JPWO2025023128A5 - - Google Patents
Info
- Publication number
- JPWO2025023128A5 JPWO2025023128A5 JP2025535766A JP2025535766A JPWO2025023128A5 JP WO2025023128 A5 JPWO2025023128 A5 JP WO2025023128A5 JP 2025535766 A JP2025535766 A JP 2025535766A JP 2025535766 A JP2025535766 A JP 2025535766A JP WO2025023128 A5 JPWO2025023128 A5 JP WO2025023128A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- semiconductor device
- concentration
- gate structure
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023119281 | 2023-07-21 | ||
| PCT/JP2024/025692 WO2025023128A1 (ja) | 2023-07-21 | 2024-07-17 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025023128A1 JPWO2025023128A1 (https=) | 2025-01-30 |
| JPWO2025023128A5 true JPWO2025023128A5 (https=) | 2026-04-21 |
Family
ID=94374434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025535766A Pending JPWO2025023128A1 (https=) | 2023-07-21 | 2024-07-17 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025023128A1 (https=) |
| WO (1) | WO2025023128A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3158973B2 (ja) * | 1995-07-20 | 2001-04-23 | 富士電機株式会社 | 炭化けい素縦型ｆｅｔ |
| JP2009283540A (ja) * | 2008-05-20 | 2009-12-03 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
| US9293558B2 (en) * | 2012-11-26 | 2016-03-22 | Infineon Technologies Austria Ag | Semiconductor device |
| WO2019244681A1 (ja) * | 2018-06-21 | 2019-12-26 | 富士電機株式会社 | 半導体装置および製造方法 |
| WO2020084736A1 (ja) * | 2018-10-25 | 2020-04-30 | 三菱電機株式会社 | 半導体装置、電力変換装置及び半導体装置の製造方法 |
| JP7712617B2 (ja) * | 2021-09-16 | 2025-07-24 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、インバータ回路、駆動装置、車両、及び、昇降機 |
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2024
- 2024-07-17 JP JP2025535766A patent/JPWO2025023128A1/ja active Pending
- 2024-07-17 WO PCT/JP2024/025692 patent/WO2025023128A1/ja active Pending