JPWO2023189161A5 - - Google Patents

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Publication number
JPWO2023189161A5
JPWO2023189161A5 JP2024511536A JP2024511536A JPWO2023189161A5 JP WO2023189161 A5 JPWO2023189161 A5 JP WO2023189161A5 JP 2024511536 A JP2024511536 A JP 2024511536A JP 2024511536 A JP2024511536 A JP 2024511536A JP WO2023189161 A5 JPWO2023189161 A5 JP WO2023189161A5
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JP
Japan
Prior art keywords
region
trench
semiconductor device
potential
conductive polysilicon
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Pending
Application number
JP2024511536A
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English (en)
Japanese (ja)
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JPWO2023189161A1 (https=
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Priority claimed from PCT/JP2023/007747 external-priority patent/WO2023189161A1/ja
Publication of JPWO2023189161A1 publication Critical patent/JPWO2023189161A1/ja
Publication of JPWO2023189161A5 publication Critical patent/JPWO2023189161A5/ja
Pending legal-status Critical Current

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JP2024511536A 2022-03-29 2023-03-02 Pending JPWO2023189161A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022053290 2022-03-29
PCT/JP2023/007747 WO2023189161A1 (ja) 2022-03-29 2023-03-02 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023189161A1 JPWO2023189161A1 (https=) 2023-10-05
JPWO2023189161A5 true JPWO2023189161A5 (https=) 2024-12-10

Family

ID=88201241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511536A Pending JPWO2023189161A1 (https=) 2022-03-29 2023-03-02

Country Status (2)

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JP (1) JPWO2023189161A1 (https=)
WO (1) WO2023189161A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113396482B (zh) * 2019-02-07 2023-12-19 罗姆股份有限公司 半导体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4379013B2 (ja) * 2003-06-25 2009-12-09 富士電機デバイステクノロジー株式会社 半導体装置の製造方法
JP2005303253A (ja) * 2004-03-18 2005-10-27 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP5087816B2 (ja) * 2004-12-15 2012-12-05 富士電機株式会社 半導体装置およびその製造方法
JP5371358B2 (ja) * 2008-09-29 2013-12-18 ローム株式会社 半導体装置および半導体装置の製造方法

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