JPWO2023176259A5 - - Google Patents
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- Publication number
- JPWO2023176259A5 JPWO2023176259A5 JP2023528273A JP2023528273A JPWO2023176259A5 JP WO2023176259 A5 JPWO2023176259 A5 JP WO2023176259A5 JP 2023528273 A JP2023528273 A JP 2023528273A JP 2023528273 A JP2023528273 A JP 2023528273A JP WO2023176259 A5 JPWO2023176259 A5 JP WO2023176259A5
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- integer
- resin composition
- insulating film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 claims 17
- 239000011342 resin composition Substances 0.000 claims 12
- 239000004642 Polyimide Substances 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 229920001721 polyimide Polymers 0.000 claims 6
- 125000000217 alkyl group Chemical group 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 125000000962 organic group Chemical group 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- -1 1,2-ethylene group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000006367 bivalent amino carbonyl group Chemical group [H]N([*:1])C([*:2])=O 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000013039 cover film Substances 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 239000003505 polymerization initiator Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023086262A JP2023138499A (ja) | 2022-03-18 | 2023-05-25 | 絶縁膜形成用感光性樹脂組成物 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022043595 | 2022-03-18 | ||
| JP2022043595 | 2022-03-18 | ||
| PCT/JP2023/005180 WO2023176259A1 (ja) | 2022-03-18 | 2023-02-15 | 絶縁膜形成用感光性樹脂組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023086262A Division JP2023138499A (ja) | 2022-03-18 | 2023-05-25 | 絶縁膜形成用感光性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7332076B1 JP7332076B1 (ja) | 2023-08-23 |
| JPWO2023176259A1 JPWO2023176259A1 (https=) | 2023-09-21 |
| JPWO2023176259A5 true JPWO2023176259A5 (https=) | 2024-02-22 |
Family
ID=87576957
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023528273A Active JP7332076B1 (ja) | 2022-03-18 | 2023-02-15 | 絶縁膜形成用感光性樹脂組成物 |
| JP2023086262A Pending JP2023138499A (ja) | 2022-03-18 | 2023-05-25 | 絶縁膜形成用感光性樹脂組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023086262A Pending JP2023138499A (ja) | 2022-03-18 | 2023-05-25 | 絶縁膜形成用感光性樹脂組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7332076B1 (https=) |
| KR (2) | KR20240155178A (https=) |
| CN (1) | CN117099046A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025134897A1 (ja) * | 2023-12-18 | 2025-06-26 | 株式会社レゾナック | 感光性樹脂組成物、硬化物及び半導体素子 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05295115A (ja) | 1992-04-24 | 1993-11-09 | Sumitomo Bakelite Co Ltd | 低熱膨張性ポリイミド樹脂およびその製造方法 |
| JP2000347404A (ja) | 1999-06-02 | 2000-12-15 | Hitachi Chemical Dupont Microsystems Ltd | 感光性重合体組成物並びにこれを用いた電子部品及びその製造法 |
| KR101010036B1 (ko) | 2009-08-28 | 2011-01-21 | 주식회사 엘지화학 | 신규한 폴리아믹산, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름 |
| JP6146578B2 (ja) * | 2011-12-28 | 2017-06-14 | 日産化学工業株式会社 | 液晶配向剤、液晶配向膜、液晶表示素子及び液晶表示素子の製造方法 |
| KR102283305B1 (ko) * | 2012-12-12 | 2021-07-28 | 닛산 가가쿠 가부시키가이샤 | 조성물, 액정 배향 처리제, 액정 배향막 및 액정 표시 소자 |
| WO2016172089A1 (en) * | 2015-04-21 | 2016-10-27 | Fujifilm Electronic Materials U.S.A., Inc. | Photosensitive polyimide compositions |
| TWI728137B (zh) * | 2016-06-29 | 2021-05-21 | 日商富士軟片股份有限公司 | 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物 |
-
2023
- 2023-02-15 CN CN202380010276.5A patent/CN117099046A/zh active Pending
- 2023-02-15 KR KR1020247002182A patent/KR20240155178A/ko active Pending
- 2023-02-15 KR KR1020237023964A patent/KR102628683B1/ko active Active
- 2023-02-15 JP JP2023528273A patent/JP7332076B1/ja active Active
- 2023-05-25 JP JP2023086262A patent/JP2023138499A/ja active Pending
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