JP7332076B1 - 絶縁膜形成用感光性樹脂組成物 - Google Patents

絶縁膜形成用感光性樹脂組成物 Download PDF

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Publication number
JP7332076B1
JP7332076B1 JP2023528273A JP2023528273A JP7332076B1 JP 7332076 B1 JP7332076 B1 JP 7332076B1 JP 2023528273 A JP2023528273 A JP 2023528273A JP 2023528273 A JP2023528273 A JP 2023528273A JP 7332076 B1 JP7332076 B1 JP 7332076B1
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Japan
Prior art keywords
group
photosensitive resin
insulating film
resin composition
formula
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JP2023528273A
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English (en)
Japanese (ja)
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JPWO2023176259A5 (https=
JPWO2023176259A1 (https=
Inventor
有輝 星野
崇洋 坂口
秀則 石井
貴文 遠藤
浩司 荻野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
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Nissan Chemical Corp
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Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority claimed from PCT/JP2023/005180 external-priority patent/WO2023176259A1/ja
Priority to JP2023086262A priority Critical patent/JP2023138499A/ja
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Publication of JP7332076B1 publication Critical patent/JP7332076B1/ja
Publication of JPWO2023176259A1 publication Critical patent/JPWO2023176259A1/ja
Publication of JPWO2023176259A5 publication Critical patent/JPWO2023176259A5/ja
Active legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Formation Of Insulating Films (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Polymerisation Methods In General (AREA)
JP2023528273A 2022-03-18 2023-02-15 絶縁膜形成用感光性樹脂組成物 Active JP7332076B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023086262A JP2023138499A (ja) 2022-03-18 2023-05-25 絶縁膜形成用感光性樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022043595 2022-03-18
JP2022043595 2022-03-18
PCT/JP2023/005180 WO2023176259A1 (ja) 2022-03-18 2023-02-15 絶縁膜形成用感光性樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023086262A Division JP2023138499A (ja) 2022-03-18 2023-05-25 絶縁膜形成用感光性樹脂組成物

Publications (3)

Publication Number Publication Date
JP7332076B1 true JP7332076B1 (ja) 2023-08-23
JPWO2023176259A1 JPWO2023176259A1 (https=) 2023-09-21
JPWO2023176259A5 JPWO2023176259A5 (https=) 2024-02-22

Family

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Family Applications (2)

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JP2023528273A Active JP7332076B1 (ja) 2022-03-18 2023-02-15 絶縁膜形成用感光性樹脂組成物
JP2023086262A Pending JP2023138499A (ja) 2022-03-18 2023-05-25 絶縁膜形成用感光性樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023086262A Pending JP2023138499A (ja) 2022-03-18 2023-05-25 絶縁膜形成用感光性樹脂組成物

Country Status (3)

Country Link
JP (2) JP7332076B1 (https=)
KR (2) KR20240155178A (https=)
CN (1) CN117099046A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134897A1 (ja) * 2023-12-18 2025-06-26 株式会社レゾナック 感光性樹脂組成物、硬化物及び半導体素子

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017083880A (ja) * 2011-12-28 2017-05-18 日産化学工業株式会社 重合性化合物
JP2018028694A (ja) * 2012-12-12 2018-02-22 日産化学工業株式会社 組成物及び樹脂皮膜
JP2021047425A (ja) * 2015-04-21 2021-03-25 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 感光性ポリイミド組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05295115A (ja) 1992-04-24 1993-11-09 Sumitomo Bakelite Co Ltd 低熱膨張性ポリイミド樹脂およびその製造方法
JP2000347404A (ja) 1999-06-02 2000-12-15 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物並びにこれを用いた電子部品及びその製造法
KR101010036B1 (ko) 2009-08-28 2011-01-21 주식회사 엘지화학 신규한 폴리아믹산, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름
TWI728137B (zh) * 2016-06-29 2021-05-21 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017083880A (ja) * 2011-12-28 2017-05-18 日産化学工業株式会社 重合性化合物
JP2018028694A (ja) * 2012-12-12 2018-02-22 日産化学工業株式会社 組成物及び樹脂皮膜
JP2021047425A (ja) * 2015-04-21 2021-03-25 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 感光性ポリイミド組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134897A1 (ja) * 2023-12-18 2025-06-26 株式会社レゾナック 感光性樹脂組成物、硬化物及び半導体素子

Also Published As

Publication number Publication date
KR20240155178A (ko) 2024-10-28
KR102628683B1 (ko) 2024-01-25
KR20230136738A (ko) 2023-09-26
CN117099046A (zh) 2023-11-21
JP2023138499A (ja) 2023-10-02
JPWO2023176259A1 (https=) 2023-09-21

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