CN117099046A - 绝缘膜形成用感光性树脂组合物 - Google Patents

绝缘膜形成用感光性树脂组合物 Download PDF

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Publication number
CN117099046A
CN117099046A CN202380010276.5A CN202380010276A CN117099046A CN 117099046 A CN117099046 A CN 117099046A CN 202380010276 A CN202380010276 A CN 202380010276A CN 117099046 A CN117099046 A CN 117099046A
Authority
CN
China
Prior art keywords
photosensitive resin
group
resin composition
insulating film
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380010276.5A
Other languages
English (en)
Chinese (zh)
Inventor
星野有辉
坂口崇洋
石井秀则
远藤贵文
荻野浩司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority claimed from PCT/JP2023/005180 external-priority patent/WO2023176259A1/ja
Publication of CN117099046A publication Critical patent/CN117099046A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Formation Of Insulating Films (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Polymerisation Methods In General (AREA)
CN202380010276.5A 2022-03-18 2023-02-15 绝缘膜形成用感光性树脂组合物 Pending CN117099046A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022043595 2022-03-18
JP2022-043595 2022-03-18
PCT/JP2023/005180 WO2023176259A1 (ja) 2022-03-18 2023-02-15 絶縁膜形成用感光性樹脂組成物

Publications (1)

Publication Number Publication Date
CN117099046A true CN117099046A (zh) 2023-11-21

Family

ID=87576957

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380010276.5A Pending CN117099046A (zh) 2022-03-18 2023-02-15 绝缘膜形成用感光性树脂组合物

Country Status (3)

Country Link
JP (2) JP7332076B1 (https=)
KR (2) KR20240155178A (https=)
CN (1) CN117099046A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134897A1 (ja) * 2023-12-18 2025-06-26 株式会社レゾナック 感光性樹脂組成物、硬化物及び半導体素子

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05295115A (ja) 1992-04-24 1993-11-09 Sumitomo Bakelite Co Ltd 低熱膨張性ポリイミド樹脂およびその製造方法
JP2000347404A (ja) 1999-06-02 2000-12-15 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物並びにこれを用いた電子部品及びその製造法
KR101010036B1 (ko) 2009-08-28 2011-01-21 주식회사 엘지화학 신규한 폴리아믹산, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름
JP6146578B2 (ja) * 2011-12-28 2017-06-14 日産化学工業株式会社 液晶配向剤、液晶配向膜、液晶表示素子及び液晶表示素子の製造方法
KR102283305B1 (ko) * 2012-12-12 2021-07-28 닛산 가가쿠 가부시키가이샤 조성물, 액정 배향 처리제, 액정 배향막 및 액정 표시 소자
WO2016172089A1 (en) * 2015-04-21 2016-10-27 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive polyimide compositions
TWI728137B (zh) * 2016-06-29 2021-05-21 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物

Also Published As

Publication number Publication date
KR20240155178A (ko) 2024-10-28
JP7332076B1 (ja) 2023-08-23
KR102628683B1 (ko) 2024-01-25
KR20230136738A (ko) 2023-09-26
JP2023138499A (ja) 2023-10-02
JPWO2023176259A1 (https=) 2023-09-21

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