KR20240155178A - 절연막 형성용 감광성 수지 조성물 - Google Patents

절연막 형성용 감광성 수지 조성물 Download PDF

Info

Publication number
KR20240155178A
KR20240155178A KR1020247002182A KR20247002182A KR20240155178A KR 20240155178 A KR20240155178 A KR 20240155178A KR 1020247002182 A KR1020247002182 A KR 1020247002182A KR 20247002182 A KR20247002182 A KR 20247002182A KR 20240155178 A KR20240155178 A KR 20240155178A
Authority
KR
South Korea
Prior art keywords
group
photosensitive resin
insulating film
formula
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247002182A
Other languages
English (en)
Korean (ko)
Inventor
유키 호시노
다카히로 사카구치
히데노리 이시이
다카후미 엔도
히로시 오기노
Original Assignee
닛산 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛산 가가쿠 가부시키가이샤 filed Critical 닛산 가가쿠 가부시키가이샤
Priority claimed from PCT/JP2023/005180 external-priority patent/WO2023176259A1/ja
Publication of KR20240155178A publication Critical patent/KR20240155178A/ko
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Formation Of Insulating Films (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Polymerisation Methods In General (AREA)
KR1020247002182A 2022-03-18 2023-02-15 절연막 형성용 감광성 수지 조성물 Pending KR20240155178A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022043595 2022-03-18
JPJP-P-2022-043595 2022-03-18
KR1020237023964A KR102628683B1 (ko) 2022-03-18 2023-02-15 절연막 형성용 감광성 수지 조성물
PCT/JP2023/005180 WO2023176259A1 (ja) 2022-03-18 2023-02-15 絶縁膜形成用感光性樹脂組成物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020237023964A Division KR102628683B1 (ko) 2022-03-18 2023-02-15 절연막 형성용 감광성 수지 조성물

Publications (1)

Publication Number Publication Date
KR20240155178A true KR20240155178A (ko) 2024-10-28

Family

ID=87576957

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020247002182A Pending KR20240155178A (ko) 2022-03-18 2023-02-15 절연막 형성용 감광성 수지 조성물
KR1020237023964A Active KR102628683B1 (ko) 2022-03-18 2023-02-15 절연막 형성용 감광성 수지 조성물

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237023964A Active KR102628683B1 (ko) 2022-03-18 2023-02-15 절연막 형성용 감광성 수지 조성물

Country Status (3)

Country Link
JP (2) JP7332076B1 (https=)
KR (2) KR20240155178A (https=)
CN (1) CN117099046A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134897A1 (ja) * 2023-12-18 2025-06-26 株式会社レゾナック 感光性樹脂組成物、硬化物及び半導体素子

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05295115A (ja) 1992-04-24 1993-11-09 Sumitomo Bakelite Co Ltd 低熱膨張性ポリイミド樹脂およびその製造方法
JP2000347404A (ja) 1999-06-02 2000-12-15 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物並びにこれを用いた電子部品及びその製造法
JP2012516927A (ja) 2009-08-28 2012-07-26 エルジー・ケム・リミテッド 新規なポリアミック酸、ポリイミド、これを含む感光性樹脂組成物およびこれから製造されたドライフィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6146578B2 (ja) * 2011-12-28 2017-06-14 日産化学工業株式会社 液晶配向剤、液晶配向膜、液晶表示素子及び液晶表示素子の製造方法
KR102283305B1 (ko) * 2012-12-12 2021-07-28 닛산 가가쿠 가부시키가이샤 조성물, 액정 배향 처리제, 액정 배향막 및 액정 표시 소자
WO2016172089A1 (en) * 2015-04-21 2016-10-27 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive polyimide compositions
TWI728137B (zh) * 2016-06-29 2021-05-21 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05295115A (ja) 1992-04-24 1993-11-09 Sumitomo Bakelite Co Ltd 低熱膨張性ポリイミド樹脂およびその製造方法
JP2000347404A (ja) 1999-06-02 2000-12-15 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物並びにこれを用いた電子部品及びその製造法
JP2012516927A (ja) 2009-08-28 2012-07-26 エルジー・ケム・リミテッド 新規なポリアミック酸、ポリイミド、これを含む感光性樹脂組成物およびこれから製造されたドライフィルム

Also Published As

Publication number Publication date
JP7332076B1 (ja) 2023-08-23
KR102628683B1 (ko) 2024-01-25
KR20230136738A (ko) 2023-09-26
CN117099046A (zh) 2023-11-21
JP2023138499A (ja) 2023-10-02
JPWO2023176259A1 (https=) 2023-09-21

Similar Documents

Publication Publication Date Title
WO2023106104A1 (ja) 感光性樹脂組成物
JP7131557B2 (ja) 感光性樹脂組成物
KR102922080B1 (ko) 감광성 수지 조성물
WO2023106108A1 (ja) 感光性樹脂組成物
JP7331860B2 (ja) 感光性絶縁膜組成物
KR20240113844A (ko) 수지 조성물
KR20200104303A (ko) 절연막용 수지 조성물
JP7327410B2 (ja) ポリアミック酸エステル樹脂組成物
KR102628683B1 (ko) 절연막 형성용 감광성 수지 조성물
TWI827467B (zh) 絕緣膜形成用感光性樹脂組成物
JP7782317B2 (ja) 感光性樹脂組成物
JP7533717B2 (ja) 感光性絶縁膜組成物
KR102781673B1 (ko) 폴리이미드 전구체, 수지 조성물, 감광성 수지 조성물, 패턴 경화막의 제조 방법, 경화막, 층간 절연막, 커버 코트층, 표면 보호막 및 전자 부품
WO2025220442A1 (ja) 絶縁膜形成用感光性樹脂組成物
WO2026042402A1 (ja) 絶縁膜形成用感光性樹脂組成物
JP2025169530A (ja) ポリイミドの製造方法及び感光性樹脂組成物

Legal Events

Date Code Title Description
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20240119

Application number text: 1020237023964

Filing date: 20230713

PG1501 Laying open of application