JPWO2023120035A5 - - Google Patents
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- Publication number
- JPWO2023120035A5 JPWO2023120035A5 JP2023569203A JP2023569203A JPWO2023120035A5 JP WO2023120035 A5 JPWO2023120035 A5 JP WO2023120035A5 JP 2023569203 A JP2023569203 A JP 2023569203A JP 2023569203 A JP2023569203 A JP 2023569203A JP WO2023120035 A5 JPWO2023120035 A5 JP WO2023120035A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- composition according
- cured product
- formula
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 claims 13
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 239000010410 layer Substances 0.000 claims 4
- 125000001424 substituent group Chemical group 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 125000000962 organic group Chemical group 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 150000001299 aldehydes Chemical class 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 125000005647 linker group Chemical group 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 125000002524 organometallic group Chemical group 0.000 claims 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021209324 | 2021-12-23 | ||
| PCT/JP2022/043598 WO2023120035A1 (ja) | 2021-12-23 | 2022-11-25 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120035A1 JPWO2023120035A1 (https=) | 2023-06-29 |
| JPWO2023120035A5 true JPWO2023120035A5 (https=) | 2024-09-10 |
Family
ID=86902044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023569203A Pending JPWO2023120035A1 (https=) | 2021-12-23 | 2022-11-25 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023120035A1 (https=) |
| TW (1) | TW202328348A (https=) |
| WO (1) | WO2023120035A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202600620A (zh) * | 2024-01-31 | 2026-01-01 | 日商富士軟片股份有限公司 | 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7351896B2 (ja) * | 2019-02-22 | 2023-09-27 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱塩基発生剤 |
-
2022
- 2022-11-25 JP JP2023569203A patent/JPWO2023120035A1/ja active Pending
- 2022-11-25 WO PCT/JP2022/043598 patent/WO2023120035A1/ja not_active Ceased
- 2022-12-05 TW TW111146607A patent/TW202328348A/zh unknown