JPWO2023120059A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023120059A5 JPWO2023120059A5 JP2023569215A JP2023569215A JPWO2023120059A5 JP WO2023120059 A5 JPWO2023120059 A5 JP WO2023120059A5 JP 2023569215 A JP2023569215 A JP 2023569215A JP 2023569215 A JP2023569215 A JP 2023569215A JP WO2023120059 A5 JPWO2023120059 A5 JP WO2023120059A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin composition
- composition according
- cured product
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 7
- 125000000962 organic group Chemical group 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 150000001412 amines Chemical class 0.000 claims 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 4
- 239000010410 layer Substances 0.000 claims 4
- 125000003368 amide group Chemical group 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 3
- 125000005842 heteroatom Chemical group 0.000 claims 3
- 239000002243 precursor Substances 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 2
- 125000003277 amino group Chemical group 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 125000004185 ester group Chemical group 0.000 claims 2
- 125000001033 ether group Chemical group 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 125000005462 imide group Chemical group 0.000 claims 2
- 125000000468 ketone group Chemical group 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 125000000101 thioether group Chemical group 0.000 claims 2
- 150000001299 aldehydes Chemical class 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 125000005647 linker group Chemical group 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims 1
- 125000000467 secondary amino group Chemical class [H]N([*:1])[*:2] 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 125000004434 sulfur atom Chemical group 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021209325 | 2021-12-23 | ||
| PCT/JP2022/043925 WO2023120059A1 (ja) | 2021-12-23 | 2022-11-29 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120059A1 JPWO2023120059A1 (https=) | 2023-06-29 |
| JPWO2023120059A5 true JPWO2023120059A5 (https=) | 2024-09-04 |
Family
ID=86902284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023569215A Pending JPWO2023120059A1 (https=) | 2021-12-23 | 2022-11-29 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023120059A1 (https=) |
| TW (1) | TW202328217A (https=) |
| WO (1) | WO2023120059A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202428704A (zh) * | 2022-10-27 | 2024-07-16 | 日商富士軟片股份有限公司 | 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法及半導體元件 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102571972B1 (ko) * | 2018-09-28 | 2023-08-29 | 후지필름 가부시키가이샤 | 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 및 반도체 디바이스 |
| JP2020154205A (ja) * | 2019-03-22 | 2020-09-24 | 富士フイルム株式会社 | パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス |
-
2022
- 2022-11-29 WO PCT/JP2022/043925 patent/WO2023120059A1/ja not_active Ceased
- 2022-11-29 JP JP2023569215A patent/JPWO2023120059A1/ja active Pending
- 2022-12-07 TW TW111146972A patent/TW202328217A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI856124B (zh) | 樹脂組成物、樹脂片、多層印刷配線板、及半導體裝置 | |
| JPWO2021020344A5 (https=) | ||
| JPWO2023032820A5 (https=) | ||
| JP2023109817A5 (https=) | ||
| JPWO2021187355A5 (https=) | ||
| JPWO2020031976A5 (https=) | ||
| JP2023027046A5 (https=) | ||
| JP2023159163A5 (https=) | ||
| JPWO2020184326A5 (https=) | ||
| JPWO2022224838A5 (https=) | ||
| JPWO2023106101A5 (https=) | ||
| JP2022133300A5 (https=) | ||
| JPWO2023032821A5 (https=) | ||
| TW202216816A (zh) | 介電膜形成用組成物 | |
| JPWO2023120035A5 (https=) | ||
| JPWO2023120059A5 (https=) | ||
| JPWO2020255984A5 (https=) | ||
| JPWO2023008049A5 (https=) | ||
| JPH02261862A (ja) | 光重合性樹脂組成物 | |
| JPWO2020196601A5 (https=) | ||
| JPWO2023026892A5 (https=) | ||
| TW201942185A (zh) | 含有聚合性不飽和基的鹼可溶性樹脂的製造方法、含有聚合性不飽和基的鹼可溶性樹脂、以其作為必須成分的感光性樹脂組成物以及其硬化膜 | |
| JP2023127745A5 (https=) | ||
| JP2007226209A (ja) | 感光性樹脂組成物 | |
| JPWO2023189126A5 (https=) |