JPWO2023120059A5 - - Google Patents
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- Publication number
- JPWO2023120059A5 JPWO2023120059A5 JP2023569215A JP2023569215A JPWO2023120059A5 JP WO2023120059 A5 JPWO2023120059 A5 JP WO2023120059A5 JP 2023569215 A JP2023569215 A JP 2023569215A JP 2023569215 A JP2023569215 A JP 2023569215A JP WO2023120059 A5 JPWO2023120059 A5 JP WO2023120059A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin composition
- composition according
- cured product
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021209325 | 2021-12-23 | ||
| PCT/JP2022/043925 WO2023120059A1 (ja) | 2021-12-23 | 2022-11-29 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120059A1 JPWO2023120059A1 (https=) | 2023-06-29 |
| JPWO2023120059A5 true JPWO2023120059A5 (https=) | 2024-09-04 |
Family
ID=86902284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023569215A Pending JPWO2023120059A1 (https=) | 2021-12-23 | 2022-11-29 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023120059A1 (https=) |
| TW (1) | TW202328217A (https=) |
| WO (1) | WO2023120059A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024090460A1 (ja) * | 2022-10-27 | 2024-05-02 | 富士フイルム株式会社 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3859447B1 (en) * | 2018-09-28 | 2025-11-19 | FUJIFILM Corporation | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device |
| JP2020154205A (ja) * | 2019-03-22 | 2020-09-24 | 富士フイルム株式会社 | パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス |
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2022
- 2022-11-29 WO PCT/JP2022/043925 patent/WO2023120059A1/ja not_active Ceased
- 2022-11-29 JP JP2023569215A patent/JPWO2023120059A1/ja active Pending
- 2022-12-07 TW TW111146972A patent/TW202328217A/zh unknown