JPWO2023189126A5 - - Google Patents

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Publication number
JPWO2023189126A5
JPWO2023189126A5 JP2024511517A JP2024511517A JPWO2023189126A5 JP WO2023189126 A5 JPWO2023189126 A5 JP WO2023189126A5 JP 2024511517 A JP2024511517 A JP 2024511517A JP 2024511517 A JP2024511517 A JP 2024511517A JP WO2023189126 A5 JPWO2023189126 A5 JP WO2023189126A5
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JP
Japan
Prior art keywords
formula
group
organic group
monovalent organic
ring structure
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Pending
Application number
JP2024511517A
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English (en)
Japanese (ja)
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JPWO2023189126A1 (https=
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Priority claimed from PCT/JP2023/007449 external-priority patent/WO2023189126A1/ja
Publication of JPWO2023189126A1 publication Critical patent/JPWO2023189126A1/ja
Publication of JPWO2023189126A5 publication Critical patent/JPWO2023189126A5/ja
Pending legal-status Critical Current

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JP2024511517A 2022-03-29 2023-03-01 Pending JPWO2023189126A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022053207 2022-03-29
PCT/JP2023/007449 WO2023189126A1 (ja) 2022-03-29 2023-03-01 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス

Publications (2)

Publication Number Publication Date
JPWO2023189126A1 JPWO2023189126A1 (https=) 2023-10-05
JPWO2023189126A5 true JPWO2023189126A5 (https=) 2024-12-10

Family

ID=88200628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511517A Pending JPWO2023189126A1 (https=) 2022-03-29 2023-03-01

Country Status (4)

Country Link
JP (1) JPWO2023189126A1 (https=)
KR (1) KR20240134227A (https=)
TW (1) TW202337926A (https=)
WO (1) WO2023189126A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120936947A (zh) * 2023-10-27 2025-11-11 艾曲迪微系统股份有限公司 感光性树脂组合物、图案固化物、图案固化物的制造方法及电子部件
WO2025094402A1 (ja) * 2023-11-02 2025-05-08 Hdマイクロシステムズ株式会社 樹脂組成物、硬化物、硬化物の製造方法、及び電子部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104870523B (zh) 2012-12-21 2017-10-31 日立化成杜邦微系统股份有限公司 聚酰亚胺前体、包含该聚酰亚胺前体的感光性树脂组合物、使用其的图案固化膜的制造方法和半导体装置
TWI890798B (zh) * 2020-06-03 2025-07-21 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
JP7612698B2 (ja) * 2020-09-01 2025-01-14 富士フイルム株式会社 硬化性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、光塩基発生剤
TWI890907B (zh) * 2020-12-25 2025-07-21 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
JP7761418B2 (ja) * 2021-08-04 2025-10-28 旭化成株式会社 感光性樹脂組成物および半導体装置

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