JPWO2023189126A5 - - Google Patents
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- Publication number
- JPWO2023189126A5 JPWO2023189126A5 JP2024511517A JP2024511517A JPWO2023189126A5 JP WO2023189126 A5 JPWO2023189126 A5 JP WO2023189126A5 JP 2024511517 A JP2024511517 A JP 2024511517A JP 2024511517 A JP2024511517 A JP 2024511517A JP WO2023189126 A5 JPWO2023189126 A5 JP WO2023189126A5
- Authority
- JP
- Japan
- Prior art keywords
- formula
- group
- organic group
- monovalent organic
- ring structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000000962 organic group Chemical group 0.000 claims 21
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 10
- 239000011342 resin composition Substances 0.000 claims 10
- 125000003118 aryl group Chemical group 0.000 claims 8
- 150000001875 compounds Chemical class 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000004642 Polyimide Substances 0.000 claims 5
- 229920001721 polyimide Polymers 0.000 claims 5
- 239000002243 precursor Substances 0.000 claims 5
- 239000010410 layer Substances 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022053207 | 2022-03-29 | ||
| PCT/JP2023/007449 WO2023189126A1 (ja) | 2022-03-29 | 2023-03-01 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189126A1 JPWO2023189126A1 (https=) | 2023-10-05 |
| JPWO2023189126A5 true JPWO2023189126A5 (https=) | 2024-12-10 |
Family
ID=88200628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511517A Pending JPWO2023189126A1 (https=) | 2022-03-29 | 2023-03-01 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023189126A1 (https=) |
| KR (1) | KR20240134227A (https=) |
| TW (1) | TW202337926A (https=) |
| WO (1) | WO2023189126A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025088815A1 (ja) * | 2023-10-27 | 2025-05-01 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化物、パターン硬化物の製造方法、及び電子部品 |
| WO2025094402A1 (ja) * | 2023-11-02 | 2025-05-08 | Ｈｄマイクロシステムズ株式会社 | 樹脂組成物、硬化物、硬化物の製造方法、及び電子部品 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102214856B1 (ko) | 2012-12-21 | 2021-02-09 | 에이치디 마이크로시스템즈 가부시키가이샤 | 폴리이미드 전구체, 그 폴리이미드 전구체를 포함하는 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치 |
| TWI890798B (zh) * | 2020-06-03 | 2025-07-21 | 日商富士軟片股份有限公司 | 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件 |
| WO2022050278A1 (ja) * | 2020-09-01 | 2022-03-10 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、光塩基発生剤 |
| TWI890907B (zh) * | 2020-12-25 | 2025-07-21 | 日商富士軟片股份有限公司 | 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件 |
| JP7761418B2 (ja) * | 2021-08-04 | 2025-10-28 | 旭化成株式会社 | 感光性樹脂組成物および半導体装置 |
-
2023
- 2023-03-01 WO PCT/JP2023/007449 patent/WO2023189126A1/ja not_active Ceased
- 2023-03-01 JP JP2024511517A patent/JPWO2023189126A1/ja active Pending
- 2023-03-01 KR KR1020247028408A patent/KR20240134227A/ko active Pending
- 2023-03-13 TW TW112109050A patent/TW202337926A/zh unknown
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