JPWO2023286571A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023286571A5
JPWO2023286571A5 JP2023535210A JP2023535210A JPWO2023286571A5 JP WO2023286571 A5 JPWO2023286571 A5 JP WO2023286571A5 JP 2023535210 A JP2023535210 A JP 2023535210A JP 2023535210 A JP2023535210 A JP 2023535210A JP WO2023286571 A5 JPWO2023286571 A5 JP WO2023286571A5
Authority
JP
Japan
Prior art keywords
group
resin composition
composition according
resin
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023535210A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023286571A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/025432 external-priority patent/WO2023286571A1/ja
Publication of JPWO2023286571A1 publication Critical patent/JPWO2023286571A1/ja
Publication of JPWO2023286571A5 publication Critical patent/JPWO2023286571A5/ja
Pending legal-status Critical Current

Links

JP2023535210A 2021-07-16 2022-06-27 Pending JPWO2023286571A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021117753 2021-07-16
PCT/JP2022/025432 WO2023286571A1 (ja) 2021-07-16 2022-06-27 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス

Publications (2)

Publication Number Publication Date
JPWO2023286571A1 JPWO2023286571A1 (https=) 2023-01-19
JPWO2023286571A5 true JPWO2023286571A5 (https=) 2024-04-11

Family

ID=84920034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023535210A Pending JPWO2023286571A1 (https=) 2021-07-16 2022-06-27

Country Status (4)

Country Link
JP (1) JPWO2023286571A1 (https=)
CN (1) CN117642442A (https=)
TW (1) TW202309117A (https=)
WO (1) WO2023286571A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120025574B (zh) * 2025-04-22 2025-08-08 东华大学 一种热致产碱剂催化制备聚酰亚胺双向牵伸薄膜的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002265531A (ja) * 2001-03-13 2002-09-18 Kunihiro Ichimura 塩基増殖性不飽和化合物、塩基増殖性樹脂及び該樹脂を含む組成物
JP5505036B2 (ja) * 2009-03-31 2014-05-28 大日本印刷株式会社 塩基発生剤、樹脂組成物、当該樹脂組成物からなるパターン形成用材料、当該樹脂組成物を用いたパターン形成方法並びに物品
WO2012176694A1 (ja) * 2011-06-24 2012-12-27 東京応化工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化膜、絶縁膜、カラーフィルタ、及び表示装置
TWI808143B (zh) * 2018-03-29 2023-07-11 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體及它們的製造方法、半導體器件及用於該等之熱鹼產生劑
JP7042353B2 (ja) * 2018-09-10 2022-03-25 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス
KR102527570B1 (ko) * 2018-09-26 2023-05-02 후지필름 가부시키가이샤 경화성 조성물, 경화막, 패턴의 형성 방법, 광학 필터 및 광센서
JP7237978B2 (ja) * 2018-09-27 2023-03-13 富士フイルム株式会社 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス
TWI851752B (zh) * 2019-07-01 2024-08-11 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化性樹脂組成物的製造方法、硬化膜、積層體、硬化膜的製造方法及半導體器件

Similar Documents

Publication Publication Date Title
KR101286631B1 (ko) 리버스 패터닝 방법 및 재료
JPWO2020031976A5 (https=)
US8791020B2 (en) Silicon-containing film, resin composition, and pattern formation method
JPWO2023032820A5 (https=)
JP2020091464A5 (https=)
JP5078475B2 (ja) ポリオルガノシロキサン
US8043899B2 (en) Photosensitive resin composition
JPWO2023021971A5 (https=)
WO2007086323A1 (ja) 感光性樹脂組成物
JP2022133300A5 (https=)
TWI878862B (zh) 乙炔衍生之複合物之合成方法、製造組成物的方法、製造塗層的方法、及製造包含該塗層之裝置的方法
JPWO2023032821A5 (https=)
CN1790161A (zh) 聚合的四面体碳薄膜及其形成方法以及使用该薄膜形成精细图形的方法
JPWO2023286571A5 (https=)
JP2008260839A5 (https=)
JPWO2023120035A5 (https=)
JPWO2021187481A5 (https=)
JPWO2023008049A5 (https=)
JPWO2023026892A5 (https=)
JPWO2022203010A5 (https=)
JPWO2023017728A5 (https=)
JP2024129038A5 (https=)
JPWO2023276517A5 (https=)
JP2606321B2 (ja) 感光性耐熱樹脂組成物と半導体装置の製造方法
JPWO2023008001A5 (https=)