JPWO2022203010A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2022203010A5 JPWO2022203010A5 JP2022540766A JP2022540766A JPWO2022203010A5 JP WO2022203010 A5 JPWO2022203010 A5 JP WO2022203010A5 JP 2022540766 A JP2022540766 A JP 2022540766A JP 2022540766 A JP2022540766 A JP 2022540766A JP WO2022203010 A5 JPWO2022203010 A5 JP WO2022203010A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- photosensitive resin
- solvent
- composition according
- diethylene glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023017215A JP7464765B2 (ja) | 2021-03-26 | 2023-02-08 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021052528 | 2021-03-26 | ||
| JP2021052528 | 2021-03-26 | ||
| PCT/JP2022/014061 WO2022203010A1 (ja) | 2021-03-26 | 2022-03-24 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023017215A Division JP7464765B2 (ja) | 2021-03-26 | 2023-02-08 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022203010A1 JPWO2022203010A1 (https=) | 2022-09-29 |
| JP7225475B2 JP7225475B2 (ja) | 2023-02-20 |
| JPWO2022203010A5 true JPWO2022203010A5 (https=) | 2023-02-20 |
Family
ID=83397437
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022540766A Active JP7225475B2 (ja) | 2021-03-26 | 2022-03-24 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス |
| JP2023017215A Active JP7464765B2 (ja) | 2021-03-26 | 2023-02-08 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023017215A Active JP7464765B2 (ja) | 2021-03-26 | 2023-02-08 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7225475B2 (https=) |
| KR (1) | KR102826223B1 (https=) |
| CN (1) | CN117063123A (https=) |
| TW (1) | TWI825626B (https=) |
| WO (1) | WO2022203010A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025134339A1 (ja) * | 2023-12-21 | 2025-06-26 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品 |
| WO2026083782A1 (ja) * | 2024-10-15 | 2026-04-23 | 東レ株式会社 | 樹脂組成物、硬化膜、硬化膜の製造方法、電子部品及び半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000147768A (ja) | 1998-11-07 | 2000-05-26 | Pi Gijutsu Kenkyusho:Kk | ネガ型感光性ポリイミド組成物及び絶縁膜 |
| JP4571616B2 (ja) | 2006-12-26 | 2010-10-27 | リンナイ株式会社 | 温水循環加熱システム |
| JP7366521B2 (ja) * | 2017-03-22 | 2023-10-23 | 旭化成株式会社 | 半導体装置、及びその製造方法 |
| EP3633455B1 (en) * | 2017-05-31 | 2026-04-08 | FUJIFILM Corporation | Photosensitive resin composition, polymeric precursor, cured film, laminate, cured film production method, and semiconductor device |
-
2022
- 2022-03-18 TW TW111109965A patent/TWI825626B/zh active
- 2022-03-24 KR KR1020237032870A patent/KR102826223B1/ko active Active
- 2022-03-24 JP JP2022540766A patent/JP7225475B2/ja active Active
- 2022-03-24 CN CN202280024496.9A patent/CN117063123A/zh active Pending
- 2022-03-24 WO PCT/JP2022/014061 patent/WO2022203010A1/ja not_active Ceased
-
2023
- 2023-02-08 JP JP2023017215A patent/JP7464765B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2022203010A5 (https=) | ||
| KR102671323B1 (ko) | 감광성 수지 조성물, 패턴 경화막의 제조 방법, 경화막, 층간 절연막, 커버 코트층, 표면 보호막 및 전자 부품 | |
| TWI468870B (zh) | 形成光交聯硬化之光阻底層膜之含矽光阻底層膜形成組成物 | |
| JP4956149B2 (ja) | 感光性有機反射防止膜形成用組成物及びそれを用いたパターン形成方法 | |
| JP2016517532A (ja) | メタノフラーレン | |
| JP2012088738A (ja) | 光架橋硬化のレジスト下層膜を形成するためのレジスト下層膜形成組成物 | |
| WO2021012700A1 (zh) | 封装薄膜用化合物及其组合物和薄膜及有机发光器件和封装方法 | |
| JPWO2020196139A5 (https=) | ||
| JP6818138B2 (ja) | 高耐エッチング性スピンオンカーボンハードマスク組成物及びそれを用いたパターン化方法 | |
| SG177240A1 (en) | Method and materials for reverse patterning | |
| SG177241A1 (en) | Method and materials for double patterning | |
| KR20170118587A (ko) | 2단계 포토레지스트 조성물 및 방법 | |
| JP5078992B2 (ja) | 感光性樹脂組成物 | |
| CN104884423A (zh) | 亚甲基富勒烯 | |
| JPWO2023021971A5 (https=) | ||
| JP2014196469A (ja) | 光硬化性組成物 | |
| TWI665518B (zh) | 負型感光性樹脂組合物、使用該組合物的光固化圖案及圖像顯示裝置 | |
| CN102666731B (zh) | 硅倍半氧烷树脂的稳定化 | |
| KR100618878B1 (ko) | 사면체 탄소 화합물로 이루어지는 하드 마스크용 폴리머막및 그 제조 방법과 이를 이용한 미세 패턴 형성 방법 | |
| JPWO2023157911A5 (https=) | ||
| JPWO2023032821A5 (https=) | ||
| TW201903031A (zh) | 用於形成具有高蝕刻速率的有機防反射膜的組合物 | |
| JP4850770B2 (ja) | 感光性樹脂組成物 | |
| JPWO2021187481A5 (https=) | ||
| JPWO2023120035A5 (https=) |