WO2021012700A1 - 封装薄膜用化合物及其组合物和薄膜及有机发光器件和封装方法 - Google Patents
封装薄膜用化合物及其组合物和薄膜及有机发光器件和封装方法 Download PDFInfo
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- WO2021012700A1 WO2021012700A1 PCT/CN2020/081276 CN2020081276W WO2021012700A1 WO 2021012700 A1 WO2021012700 A1 WO 2021012700A1 CN 2020081276 W CN2020081276 W CN 2020081276W WO 2021012700 A1 WO2021012700 A1 WO 2021012700A1
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- WO
- WIPO (PCT)
- Prior art keywords
- bis
- diyl
- acrylate
- ethane
- meth
- Prior art date
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 38
- 238000005538 encapsulation Methods 0.000 title claims abstract description 34
- 239000000203 mixture Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 14
- -1 propenyl compound Chemical class 0.000 claims abstract description 374
- 239000010410 layer Substances 0.000 claims abstract description 39
- 239000012044 organic layer Substances 0.000 claims abstract description 32
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000001301 oxygen Substances 0.000 claims abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 11
- 239000002253 acid Substances 0.000 claims abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 130
- 239000004305 biphenyl Substances 0.000 claims description 119
- 125000004386 diacrylate group Chemical group 0.000 claims description 75
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 70
- 239000010408 film Substances 0.000 claims description 60
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 42
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 24
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 23
- 239000012785 packaging film Substances 0.000 claims description 21
- 229920006280 packaging film Polymers 0.000 claims description 21
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 20
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 16
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 15
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 12
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 12
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 12
- 239000003999 initiator Substances 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 11
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 11
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 239000012965 benzophenone Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 7
- MDYPDLBFDATSCF-UHFFFAOYSA-N nonyl prop-2-enoate Chemical compound CCCCCCCCCOC(=O)C=C MDYPDLBFDATSCF-UHFFFAOYSA-N 0.000 claims description 7
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 claims description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 6
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 claims description 6
- 150000002460 imidazoles Chemical class 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- SCFQUKBBGYTJNC-UHFFFAOYSA-N heptyl prop-2-enoate Chemical compound CCCCCCCOC(=O)C=C SCFQUKBBGYTJNC-UHFFFAOYSA-N 0.000 claims description 5
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 claims description 5
- 229940065472 octyl acrylate Drugs 0.000 claims description 5
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims description 5
- 239000007870 radical polymerization initiator Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 229910052717 sulfur Chemical group 0.000 claims description 5
- 239000011593 sulfur Chemical group 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 5
- 235000010290 biphenyl Nutrition 0.000 claims description 4
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- 125000000446 sulfanediyl group Chemical group *S* 0.000 claims description 4
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 4
- 150000003918 triazines Chemical class 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- DQBHMCKWUOZZLN-UHFFFAOYSA-N (2-hydroxy-2-naphthalen-2-yloxyethyl) prop-2-enoate Chemical compound C(C=C)(=O)OCC(OC1=CC2=CC=CC=C2C=C1)O DQBHMCKWUOZZLN-UHFFFAOYSA-N 0.000 claims description 3
- KKGJIZAPLKIKDM-UHFFFAOYSA-N (2-hydroxy-2-phenoxyethyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)OC1=CC=CC=C1 KKGJIZAPLKIKDM-UHFFFAOYSA-N 0.000 claims description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 3
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 3
- HPIWFSIKGSWSQS-UHFFFAOYSA-N 10-naphthalen-2-ylsulfanyldecyl prop-2-enoate Chemical compound C(C=C)(=O)OCCCCCCCCCCSC1=CC2=CC=CC=C2C=C1 HPIWFSIKGSWSQS-UHFFFAOYSA-N 0.000 claims description 3
- HYQASEVIBPSPMK-UHFFFAOYSA-N 12-(2-methylprop-2-enoyloxy)dodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCOC(=O)C(C)=C HYQASEVIBPSPMK-UHFFFAOYSA-N 0.000 claims description 3
- QFNYOIKHNYCFRG-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC1=CC=CC=C1 QFNYOIKHNYCFRG-UHFFFAOYSA-N 0.000 claims description 3
- YZFQAGVDQHROCY-UHFFFAOYSA-N 2-methylidene-4-phenoxybutanoic acid Chemical group OC(=O)C(=C)CCOC1=CC=CC=C1 YZFQAGVDQHROCY-UHFFFAOYSA-N 0.000 claims description 3
- BKKIFGHYLZUELC-UHFFFAOYSA-N 2-methylidene-4-phenylsulfanylbutanoic acid Chemical group OC(=O)C(=C)CCSC1=CC=CC=C1 BKKIFGHYLZUELC-UHFFFAOYSA-N 0.000 claims description 3
- JDVQPDVVINVPNR-UHFFFAOYSA-N 2-methylidene-5-naphthalen-2-yloxypentanoic acid Chemical compound C1=CC=CC2=CC(OCCCC(=C)C(=O)O)=CC=C21 JDVQPDVVINVPNR-UHFFFAOYSA-N 0.000 claims description 3
- XYCOIUGDAJORBK-UHFFFAOYSA-N 2-methylidene-5-phenoxypentanoic acid Chemical group OC(=O)C(=C)CCCOC1=CC=CC=C1 XYCOIUGDAJORBK-UHFFFAOYSA-N 0.000 claims description 3
- ZQTNHZHZSGBHCV-UHFFFAOYSA-N 2-methylidene-6-phenoxyhexanoic acid Chemical group OC(=O)C(=C)CCCCOC1=CC=CC=C1 ZQTNHZHZSGBHCV-UHFFFAOYSA-N 0.000 claims description 3
- FRIXCIPXTGZTQF-UHFFFAOYSA-N 2-methylidene-7-phenoxyheptanoic acid Chemical group OC(=O)C(=C)CCCCCOC1=CC=CC=C1 FRIXCIPXTGZTQF-UHFFFAOYSA-N 0.000 claims description 3
- FZKSNEBYWROKGW-UHFFFAOYSA-N 2-methylidene-8-naphthalen-2-yloxyoctanoic acid Chemical compound C1=CC=CC2=CC(OCCCCCCC(=C)C(=O)O)=CC=C21 FZKSNEBYWROKGW-UHFFFAOYSA-N 0.000 claims description 3
- KXHSOGOYAVRRCD-UHFFFAOYSA-N 2-methylidene-9-phenoxynonanoic acid Chemical group OC(=O)C(=C)CCCCCCCOC1=CC=CC=C1 KXHSOGOYAVRRCD-UHFFFAOYSA-N 0.000 claims description 3
- WZMFVWFHYVWEQV-UHFFFAOYSA-N 3-phenoxy-2-phenylprop-2-enoic acid Chemical compound C=1C=CC=CC=1C(C(=O)O)=COC1=CC=CC=C1 WZMFVWFHYVWEQV-UHFFFAOYSA-N 0.000 claims description 3
- LNWRCUIJTRPOBW-UHFFFAOYSA-N 5-naphthalen-2-ylsulfanylpentyl prop-2-enoate Chemical compound C(C=C)(=O)OCCCCCSC1=CC2=CC=CC=C2C=C1 LNWRCUIJTRPOBW-UHFFFAOYSA-N 0.000 claims description 3
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 3
- RNDWYEDCKJTAOM-UHFFFAOYSA-N 8-naphthalen-2-ylsulfanyloctyl prop-2-enoate Chemical compound C(C=C)(=O)OCCCCCCCCSC1=CC2=CC=CC=C2C=C1 RNDWYEDCKJTAOM-UHFFFAOYSA-N 0.000 claims description 3
- QJQGQWGBEWBCSW-UHFFFAOYSA-N 9-naphthalen-2-yloxynonyl prop-2-enoate Chemical compound C(C=C)(=O)OCCCCCCCCCOC1=CC2=CC=CC=C2C=C1 QJQGQWGBEWBCSW-UHFFFAOYSA-N 0.000 claims description 3
- ZSTITTPBPXPNIK-UHFFFAOYSA-N C(C=C)(=O)O.C1=C(C=CC2=CC=CC=C12)SCCCCC1=CC=CC2=CC=CC=C12 Chemical compound C(C=C)(=O)O.C1=C(C=CC2=CC=CC=C12)SCCCCC1=CC=CC2=CC=CC=C12 ZSTITTPBPXPNIK-UHFFFAOYSA-N 0.000 claims description 3
- RNEFUGIVRAEHCT-UHFFFAOYSA-N C(C=C)(=O)OCCCCCCCSC1=CC2=CC=CC=C2C=C1 Chemical compound C(C=C)(=O)OCCCCCCCSC1=CC2=CC=CC=C2C=C1 RNEFUGIVRAEHCT-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- RRVUIOWBDBSZRN-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCCOc1ccccc1 Chemical group OC(=O)C(=C)CCCCCCCCCCOc1ccccc1 RRVUIOWBDBSZRN-UHFFFAOYSA-N 0.000 claims description 3
- WDERPYAIJXUULT-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCCCSc1ccccc1 WDERPYAIJXUULT-UHFFFAOYSA-N 0.000 claims description 3
- AHFVLXXVUOGPFX-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCOc1ccccc1 Chemical group OC(=O)C(=C)CCCCCCCCCOc1ccccc1 AHFVLXXVUOGPFX-UHFFFAOYSA-N 0.000 claims description 3
- CKPSMVFDXYWVBN-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCOc1ccccc1 Chemical group OC(=O)C(=C)CCCCCCCCOc1ccccc1 CKPSMVFDXYWVBN-UHFFFAOYSA-N 0.000 claims description 3
- OAKWFIVAACPYGG-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCSc1ccccc1 OAKWFIVAACPYGG-UHFFFAOYSA-N 0.000 claims description 3
- MQANWZFATDENKV-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCCOc1ccc2ccccc2c1 MQANWZFATDENKV-UHFFFAOYSA-N 0.000 claims description 3
- MFXLAEXKGSUXKV-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCOc1ccccc1 Chemical group OC(=O)C(=C)CCCCCCOc1ccccc1 MFXLAEXKGSUXKV-UHFFFAOYSA-N 0.000 claims description 3
- DUOBTCTWHTWCME-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCSc1ccccc1 DUOBTCTWHTWCME-UHFFFAOYSA-N 0.000 claims description 3
- ZFQZAYGTHPLUNB-UHFFFAOYSA-N OC(=O)C(=C)CCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCOc1ccc2ccccc2c1 ZFQZAYGTHPLUNB-UHFFFAOYSA-N 0.000 claims description 3
- FTZFEPXTKFKSQX-UHFFFAOYSA-N OC(=O)C(=C)CCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCSc1ccccc1 FTZFEPXTKFKSQX-UHFFFAOYSA-N 0.000 claims description 3
- ZZAGLMPBQOKGGT-UHFFFAOYSA-N [4-[4-(4-prop-2-enoyloxybutoxy)benzoyl]oxyphenyl] 4-(4-prop-2-enoyloxybutoxy)benzoate Chemical class C1=CC(OCCCCOC(=O)C=C)=CC=C1C(=O)OC(C=C1)=CC=C1OC(=O)C1=CC=C(OCCCCOC(=O)C=C)C=C1 ZZAGLMPBQOKGGT-UHFFFAOYSA-N 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000003282 alkyl amino group Chemical group 0.000 claims description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 3
- 125000000609 carbazolyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 claims description 3
- 125000005594 diketone group Chemical group 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 3
- CHQNATAAAQFKNG-UHFFFAOYSA-N 1-naphthalen-2-ylsulfanylnaphthalene Chemical compound C1=CC=C2C(SC=3C=C4C=CC=CC4=CC=3)=CC=CC2=C1 CHQNATAAAQFKNG-UHFFFAOYSA-N 0.000 claims description 2
- YTGNMCCXGOTRQC-UHFFFAOYSA-N 2-(naphthalen-2-yloxymethoxy)ethyl prop-2-enoate Chemical compound C(C=C)(=O)OCCOCOC1=CC2=CC=CC=C2C=C1 YTGNMCCXGOTRQC-UHFFFAOYSA-N 0.000 claims description 2
- OUJIUKMBQJCVME-UHFFFAOYSA-N 2-(phenoxymethoxy)ethyl prop-2-enoate Chemical compound C(C=C)(=O)OCCOCOC1=CC=CC=C1 OUJIUKMBQJCVME-UHFFFAOYSA-N 0.000 claims description 2
- ALJJOHVLIIGTNU-UHFFFAOYSA-N 2-methylidene-4-naphthalen-2-yloxybutanoic acid Chemical compound C1=CC=CC2=CC(OCCC(=C)C(=O)O)=CC=C21 ALJJOHVLIIGTNU-UHFFFAOYSA-N 0.000 claims description 2
- OGMIVNPXPFPGBW-UHFFFAOYSA-N 8-naphthalen-2-yloxyoctyl prop-2-enoate Chemical compound C1=CC=CC2=CC(OCCCCCCCCOC(=O)C=C)=CC=C21 OGMIVNPXPFPGBW-UHFFFAOYSA-N 0.000 claims description 2
- FSQFMHMLXSWLMI-UHFFFAOYSA-N 9-naphthalen-2-ylsulfanylnonyl prop-2-enoate Chemical compound C(C=C)(=O)OCCCCCCCCCSC1=CC2=CC=CC=C2C=C1 FSQFMHMLXSWLMI-UHFFFAOYSA-N 0.000 claims description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims description 2
- DGYFFMWBSGAKLU-UHFFFAOYSA-N OC(=O)C(=C)CCCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCOc1ccc2ccccc2c1 DGYFFMWBSGAKLU-UHFFFAOYSA-N 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims 2
- SBAPKYXYDFVHKP-UHFFFAOYSA-N 2,7-dimethylocta-2,6-dienedioic acid Chemical compound OC(=O)C(C)=CCCC=C(C)C(O)=O SBAPKYXYDFVHKP-UHFFFAOYSA-N 0.000 claims 1
- SCVJRXQHFJXZFZ-KVQBGUIXSA-N 2-amino-9-[(2r,4s,5r)-4-hydroxy-5-(hydroxymethyl)oxolan-2-yl]-3h-purine-6-thione Chemical compound C1=2NC(N)=NC(=S)C=2N=CN1[C@H]1C[C@H](O)[C@@H](CO)O1 SCVJRXQHFJXZFZ-KVQBGUIXSA-N 0.000 claims 1
- BGEXRZJLGNQOLL-UHFFFAOYSA-N O(CCC=CC(=O)O)CCC=CC(=O)O Chemical compound O(CCC=CC(=O)O)CCC=CC(=O)O BGEXRZJLGNQOLL-UHFFFAOYSA-N 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 claims 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 claims 1
- 150000001989 diazonium salts Chemical class 0.000 claims 1
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- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- WDAXFOBOLVPGLV-UHFFFAOYSA-N isobutyric acid ethyl ester Natural products CCOC(=O)C(C)C WDAXFOBOLVPGLV-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000002390 rotary evaporation Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/0825—Preparations of compounds not comprising Si-Si or Si-cyano linkages
- C07F7/0827—Syntheses with formation of a Si-C bond
- C07F7/0829—Hydrosilylation reactions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D143/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Coating compositions based on derivatives of such polymers
- C09D143/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Definitions
- the present invention relates to the technical field of thin film encapsulation structures, in particular to a compound for encapsulating films, compositions and films, organic light-emitting devices and encapsulation methods.
- the present invention relates to films formed by repeated coating of inorganic and organic layers, exhibiting oxygen and Low moisture permeability, and the packaging film to extend the life of the organic light-emitting device, enhance the resistance of the organic layer to plasma (plasma) to achieve a higher flatness organic/inorganic hybrid packaging film packaging composition and Encapsulation films and display devices using them.
- the organic light emitting display device includes an organic light emitting device (OLED) composed of a hole injection electrode (anode), an organic light emitting layer, and an electron injection electrode (cathode).
- OLED organic light emitting device
- This organic light-emitting device is usually provided on a glass substrate. In order to prevent deterioration caused by the inflow of moisture or oxygen from the outside, it is covered with another substrate.
- display devices including organic light-emitting display devices are becoming thinner under the demand of consumers. In order to meet this demand, thin-film encapsulation (TFE) is applied to the cover of organic light-emitting devices for organic light-emitting devices.
- TFE thin-film encapsulation
- the thin-film packaging structure is a structure in which an inorganic film and an organic film are alternately laminated on the organic light-emitting device formed in the display range of the substrate to cover the display range to protect the organic light-emitting device.
- the laminated inorganic film and The organic film is called a thin film encapsulation layer.
- the organic light emitting display device with this thin film encapsulation layer optimizes the flexibility of the device together with the flexible substrate.
- this organic light-emitting display device makes it possible to design various devices, and most importantly, it makes possible thinning.
- the inorganic film used in the existing thin-film packaging structure is vapor-deposited by plasma generation methods such as sputtering or vapor deposition (CVD), and the underlying organic film is weaker to the plasma.
- plasma generation methods such as sputtering or vapor deposition (CVD)
- the underlying organic film is weaker to the plasma.
- WVTR Water Vapor Transmission Rate
- the present invention aims to solve the technical problems in the prior art, and provides a compound for encapsulating film and its composition and film, organic light emitting device and encapsulation method.
- a plasma resistant structure is introduced into the lower organic layer to prevent the surface from being etched when the inorganic film is evaporated. Maintaining high flatness, relatively speaking, has a huge impact on the flatness of the upper inorganic film with a thinner thickness.
- the encapsulation film containing the compound or composition provided by the present invention has a higher water vapor transmission rate, and the encapsulation film can be used to make an organic light-emitting device with flexibility.
- the present invention provides a compound for packaging films, the structure of which is shown in chemical structure 1:
- A is an alkylamino group having 6 to 12 carbon atoms, or an aromatic group substituted or unsubstituted by an alkoxy group;
- R 1 to R 4 are the same or different alkyl groups having 1 to 6 carbons, or aromatic groups;
- R 5 and R 6 are the same or different alkyl groups having 2 to 6 carbon atoms, or groups containing 1 to 6 alkyl groups and vinyloxy groups;
- R 7 and R 8 are hydrogen or methyl
- n 1 and n 2 are the same natural numbers
- n 3 is 0 or 1;
- Y 1 and Y 2 are the same or different oxygen, an amino group or sulfur substituted or unsubstituted by an alkyl group, or any one selected from the following chemical structural formulas 2 to 4;
- the present invention also provides a composition, including: component A, component B and component C;
- Component A the compound for packaging film shown in chemical structure 1;
- Component B more than one propylene-based compound curable by light and heat
- Component C more than one compound that generates free radicals and acid by light or heat.
- the weight percentage of component A is: 9.5-90%;
- the weight percentage of component B is: 9.5-90%;
- the weight percentage of component C is 0.5-10%.
- the component B is 2-phenoxyethyl acrylic acid, 2-phenoxyethyl (meth)acrylic acid, 3-phenoxypropyl acrylic acid, 3-phenoxypropyl (meth) Base) acrylic acid, 4-phenoxybutyl acrylic acid, 4-phenoxybutyl (meth) acrylic acid, 5-phenoxypentyl acrylic acid, 5-phenoxypentyl (meth) acrylic acid, 6- Phenoxyhexyl acrylic acid, 6-phenoxyhexyl (meth)acrylic acid, 7-phenoxyheptyl acrylic acid, 7-phenoxyheptyl (meth)acrylic acid, 8-phenoxyoctyl acrylic acid, 8 -Phenoxyoctyl(meth)acrylic acid, 9-phenoxynonylacrylic acid, 9-phenoxynonyl(meth)acrylic acid, 10-phenoxydecylacrylic acid, 10-phenoxydecyl (Meth)acrylic acid, 2-(phenylthio)ethyl
- the C component is a photopolymerization initiator and/or a radical polymerization initiator;
- the photopolymerization initiator is an acetophenone compound, a benzophenone compound, a thioxanthone compound, and a benzoin compound
- the radical polymerization is initiated One or more of peroxide compounds and bisazo compounds.
- the present invention also provides an encapsulating film, which is a film layer laminated under the following conditions to which the composition provided by the present invention is applied;
- the organic layer is the composition provided by the present invention.
- the inorganic layer is formed by one or more of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, zirconium oxide, titanium oxide, and zinc oxide, and the stacked inorganic layers may be different.
- the packaging film is a film layer with a water vapor transmission rate of 9*10 -2 g/m 2 ⁇ day or less.
- the inorganic layer of the encapsulation film is arranged on one or both surfaces of the organic layer.
- the present invention also provides an organic light emitting device encapsulated with the packaging film of the present invention.
- the present invention also provides a packaging method of an organic light emitting device, including the following steps:
- the packaging film of the present invention is directly coated on the organic light-emitting device, or the packaging film is directly made into a film form and attached to the organic light-emitting device.
- the present invention provides a compound for encapsulation film and a composition thereof.
- the composition is used as an organic layer, and an organic light-emitting device encapsulation film is manufactured by repeatedly alternately stacking an inorganic layer and an organic layer, so that the organic layer in the organic light-emitting device is compatible with oxygen and moisture.
- the film in which the inorganic layer and the organic layer are repeatedly and alternately laminated exhibits low water vapor transmission rate (WVTR) and bendable properties.
- WVTR water vapor transmission rate
- a plasma-free structure is applied to the organic layer, which effectively prevents the organic film from being damaged by the plasma generated during the evaporation of the inorganic film, so that the organic film to be deposited with the inorganic film Maintaining a higher flatness on the upper side makes the inorganic film deposition more stable.
- This includes providing an encapsulation film exhibiting a higher water vapor transmission rate and flexible organic light-emitting devices manufactured using this encapsulation film.
- Figure 1 is a schematic diagram of a structure of the packaging film provided by the present invention.
- the present invention provides a compound for packaging films, the structure of which is shown in chemical structure 1:
- A is an alkylamino group having 6 to 12 carbons, or an aromatic group substituted or unsubstituted by alkoxy;
- R 1 to R 4 are the same or different alkyl groups having 1 to 6 carbons, or Aromatic group;
- R 5 and R 6 are the same or different alkyl groups having 2 to 6 carbon atoms, or groups containing 1 to 6 alkyl groups and vinyloxy groups;
- R 7 and R 8 are hydrogen or Methyl;
- n 1 and n 2 are the same natural number;
- n 3 is 0 or 1;
- Y 1 and Y 2 are the same or different oxygen, amino or sulfur substituted or unsubstituted by alkyl, or selected from the following chemistry Any one of structural formulas 2 to 4;
- the present invention also provides a composition, including: component A, component B and component C;
- Component A the compound for packaging film shown in chemical structure 1;
- Component B more than one propylene-based compound curable by light and heat
- Component C more than one compound that generates free radicals and acid by light or heat.
- the weight percentage of each component is as follows:
- the weight percentage of component A is: 9.5-90%;
- the weight percentage of component B is: 9.5-90%;
- the weight percentage of component C is 0.5-10%.
- the compound of this chemical structure 1 can be used to produce a mixture of more than one propylene group that can be cured by other light or heat, and a compound or mixture of more than one compound or mixture that generates free radicals and acids by light or heat.
- the Water Vapor Transmission Rate is below 9*10 -2 g/m 2 ⁇ day, and the same or independent organic layer and inorganic layer can be alternately laminated at least once.
- the inorganic layer used may be one or more of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, zirconium oxide, titanium oxide, and zinc oxide, and the stacked inorganic layers may be different.
- the thin film layer manufactured in this way can be directly coated on the organic light emitting device or be manufactured into a thin film form and attached to it.
- the present invention also provides an encapsulating film, which is a film layer laminated under the following conditions to which the composition provided by the present invention is applied;
- the organic layer is the composition provided by the present invention.
- the inorganic layer is formed by one or more of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, zirconium oxide, titanium oxide, and zinc oxide, and the stacked inorganic layers may be different.
- the encapsulation film is a film layer with a water vapor transmission rate of 9*10 -2 g/m 2 ⁇ day or less.
- the inorganic layer of the encapsulation film is arranged on one or both surfaces of the organic layer.
- the inorganic layer is arranged on both surfaces of the organic layer, see FIG. 1 for the formed encapsulation film.
- 11 represents an inorganic layer
- 12 represents an organic layer.
- the encapsulation part is formed directly above the organic light-emitting device and the driving circuit formed on the substrate, and the organic light-emitting device and the driving circuit are sealed and protected from external damage.
- the structure of this encapsulation part is usually a thin-film type also called a thin-film encapsulation layer.
- the organic layer can be used in addition to the compound in the chemical structure 1 as specified in claim 1, and can also be used on more than one photocurable or thermally curable monomer group.
- This monomer or monomer group is mixed with solid or liquid, thermal and photo-induced free radical initiators, and thermal and photo-acid generators, and coated by inkjet, electronic spray, electronic radiation, etc., and then irradiated by ultraviolet rays or It is formed by the process of heat curing.
- the encapsulation part differs in the thickness of the inorganic layer and the organic layer.
- the relationship between the thickness of the inorganic layer and the organic layer is set so that the thickness of the organic layer is thicker than that of the inorganic layer.
- Component B has a light-curable and heat-curable propenyl compound.
- Examples are 2-phenoxyethyl acrylic acid, 2-phenoxyethyl (meth)acrylic acid, 3-phenoxypropyl acrylic acid, 3-phenoxy Propyl (meth)acrylic acid, 4-phenoxybutyl acrylic acid, 4-phenoxybutyl (meth) acrylic acid, 5-phenoxypentyl acrylic acid, 5-phenoxypentyl (meth) Acrylic acid, 6-phenoxyhexyl acrylic acid, 6-phenoxyhexyl (meth) acrylic acid, 7-phenoxyheptyl acrylic acid, 7-phenoxyheptyl (meth) acrylic acid, 8-phenoxy octyl Acrylic acid, 8-phenoxy octyl (meth) acrylic acid, 9-phenoxy nonyl acrylic acid, 9-phenoxy nonyl (meth) acrylic acid, 10-phenoxydecyl acrylic acid, 10-benzene Oxydecyl (meth)acrylic acid, 2-(phen
- the amount of both used may be used in consideration of the viscosity of the compound of Chemical Formula 1.
- the C component is a photopolymerization initiator and/or a radical polymerization initiator; the above photopolymerization initiator is a commonly used initiator in a photosensitive resin composition, for example, acetophenone compounds, benzophenone Compounds, thioxanthone compounds, benzoin compounds, triazine compounds, etc.
- acetophenone compounds examples include 2,2-diethoxy-acetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, 4-tert-butyl Trichloroacetophenone, 4-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4- (Methylthio)phenyl)-2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one Wait.
- benzophenone compounds examples include benzophenone, benzoylbenzoic acid, benzoylbenzoic acid methyl, 4-phenylbenzophenone, hydroxybenzophenone, benzophenone acrylate , 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4' -Dichlorobenzophenone, 3,3'-dimethylamino-2-methoxybenzophenone, etc.
- thioxanthone compounds examples include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4 -Diisopropylthioxanthone, 2-chlorothioxanthone, etc.
- benzophenone compounds examples include: benzophenone, benzophenone methyl ethyl ether, benzophenone ethyl ethyl ether, benzophenone isopropyl ethyl ether, benzophenone isobutyl ethyl ether, Benzyl dimethyl ketal and so on.
- triazine compounds examples include cyanuric chloride, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxybenzene) Vinyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthalene)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-tolyl)-4,6-bis(trichloromethyl)- s-triazine, 2-diphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphthalene -1-yl)-4,6-bis(trichloromethyl)-s-triazin
- the photoinitiator may also be carbazole compounds, diketone compounds, sulfonium boronic acid compounds, diazonium salt compounds, imidazole compounds, non-imidazole compounds, and the like.
- radical polymerization initiator peroxide compounds, bisazo compounds, etc. can be used.
- Examples of the above-mentioned peroxide compounds include methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, acetylacetone peroxide, etc.
- Ketone peroxides isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, O-methylbenzoyl peroxide, di-3,5,5-trimethylhexyl peroxide
- Diacyl peroxides such as oxides, 2,4,4-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene peroxide, tert-butyl Peroxides such as peroxides, dicumyl peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, 1,3-bis(tert-butyloxy) Isopropyl) benzene, tert-butylperoxyvalerate n-butyl ester and other dialkyl peroxides; 2,4,4-trimethylpentaperoxyphenoxy acetate, ⁇ -peroxide Oxidized cumyl neodecanoate
- Alkyl peresters such as di-tert-butyl peroxytrimethyl adipate, di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, peroxydicarbonate Percarbonates such as bis-4-tert-butyl cyclohexyl oxydicarbonate, diisopropyl peroxydicarbonate, acetylcyclohexylsulfonyl peroxide, tert-butylperoxy aryl carbonate, etc.
- Examples of the above-mentioned bisazo compounds include 1,1'-azobicyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2- Azobis(methyl isobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), ⁇ , ⁇ '-azobis(isobutyronitrile) And 4,4'-azobis(4-cyanovaleric acid) and so on.
- the above-mentioned initiator can be used together with a photosensitizer that undergoes a chemical reaction by absorbing light and expanding and then transferring energy.
- Examples of the aforementioned photosensitizers include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetra-mercaptopropionate, dipentaerythritol tetra-3-mercaptopropionate, and the like.
- the use range of the initiator with respect to the total amount of the photosensitive resin composition is 0.5% to 10% by weight. If the above-mentioned initiator is within the above-mentioned range, sufficient curing can take place during exposure during the film formation process to obtain excellent reliability. Although the lowering of the transmittance caused by the unreacted initiator can be prevented, it is not limited to the examples.
- the inorganic layer will form metal oxides and nitrides through sputtering CVD (Chemical Vapor Deposition), ALD (Atomic Layer Deposition), IBAD (Ion Beam Assisted Deposition), etc.
- CVD Chemical Vapor Deposition
- ALD Atomic Layer Deposition
- IBAD Ion Beam Assisted Deposition
- calcium oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, silicon oxide, silicon nitride, silicon oxynitride, aluminum nitride, and zirconium oxide will form the selected substance. But it is not limited to this.
- Another embodiment is to use the aforementioned composition to make a packaging film.
- the manufacturing method of the above-mentioned packaging film is as follows.
- the reliable embodiments of the present invention are recorded, but the following embodiment is only one of the reliable embodiments of the present invention, not to say that the present invention is limited to the following embodiments.
- the aforementioned photosensitive resin composition is placed on a pre-processed PEN (Poly Ethylene Naphthalene) substrate with a size of 6 cm * 6 cm, and silicon nitride is vapor-deposited using a plasma chemical weather vapor deposition method with moisture. Occurs after using the inductively coupled plasma method for free ions.
- the precursor material and reaction gas for vapor deposition were supplied into the reactor at a flow rate of 20 sccm (trisilylamine, TSA) and 60 scc of ammonia gas, and 200 sccm of argon gas was used as a carrier gas.
- the organic film is the same as the following manufacturing examples 5-11. After the preparation is made, the composition is painted with a spray, and the composition is irradiated with 100mW/cm 2 for about 10 seconds and then cured with UV to form the coating thickness. It is a 3 ⁇ m coating. When using a light source for exposure, high-pressure mercury is used. A 250mm silicon nitride thin film was formed on the inorganic film on the organic film using the same method as the inorganic film coating.
- the compound was placed in the reaction vessel and stirred for 30 minutes, and then filtered with a syringe filter made of 0.45 ⁇ m Teflon.
- Each composition is formed on PEN in the form of inorganic film (250nm)/organic film (3 ⁇ m)/inorganic film (250nm) as shown in Table 3.
- the water permeability of the encapsulation film is measured by a water permeability measuring instrument (AQUARAN2, MOCON). ⁇ ) for measurement. The measurement was carried out for 24 hours at 37.8°C and 100% relative humidity.
- Example 3 As in Table 3, under the same conditions, the water vapor transmission rate of the encapsulation film produced by laminating inorganic/organic films is the best in Example 1, which is applied to compound 3 of Chemical Formula 7. In the case where compound 3 is not used, the value of Comparative Example 2 with the lowest binding value is the lowest. The reason is the results before/after plasma treatment measured by atomic force microscope, that is, the results given in Table 3 are not difficult to understand. Plasma etching the surface, if the flatness is not good, it will affect the inorganic film behind it, and the water vapor transmission rate will also become low.
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Abstract
本发明涉及一种封装薄膜用化合物及其组合物和薄膜及有机发光器件和封装方法,所述化合物如下式:所述组合物包括上述化合物,一种以上具有受光以及热可固化的丙烯基化合物,及一种以上受光或热产生游离基以及产生酸的化合物。所述封装薄膜包含上述组合物作为有机层的薄膜。所述有机发光器件包含所述薄膜。所述封装方法是将封装薄膜封装在有机发光器件上。含有本发明化合物的组合物作为有机层,通过无机层与有机层重复交替叠层制造有机发光器件封装薄膜,使得有机发光器件中的有机层与氧气及水分间的隔绝从而达到保护有机发光器件的一种薄膜。且无机层与有机层重复交替叠层的薄膜展现出低水蒸气透过率和可弯曲的性质。
Description
本发明涉及薄膜封装结构技术领域,具体涉及一种封装薄膜用化合物及其组合物和薄膜及有机发光器件和封装方法,本发明涉及无机层与有机层反复涂布形成的薄膜,展现出氧和水分的低透过率,并以此封装膜延长有机发光器件的寿命,加强有机层对等离子体(plasma)的耐蚀刻性来实现更高平坦度的有机/无机混合封装膜的封装组合物和封装薄膜以及利用这些的显示设备。
有机发光显示设备包含了由空穴注入电极(阳极)、有机发光层以及电子注入电极(阴极)组成的有机发光器件(OLED)。这个有机发光器件通常是提供在玻璃基板上,为了防止受到从外部流入水分或氧导致劣化,用另外一张基板覆盖住。最近,包括有机发光显示设备在内的显示设备在消费者的需求下日渐变薄,有机发光设备方面也为了满足此需求将薄膜封装(Thin Film Encapsulation;TFE)适用在有机发光器件的覆盖上。
薄膜封装结构是在基板显示范围内将形成的有机发光器件上方分别将无机膜与有机膜一层以上交替叠层从而覆盖住显示范围来保护有机发光器件的结构,通常将叠层的无机膜与有机膜称为薄膜封装层。具有此薄膜封装层的有机发光显示设备与具有柔性的基板一起优化设备的柔韧性。另外,此有机发光显示设备使设备的多样设计成为了可能,最重要的是让薄型化成为了可能。
现有薄膜封装结构使用的无机膜是通过溅射(sputtering)或气相沉积(CVD)等产生等离子体(plasma)的方法进行蒸镀,下方的有机膜在对等离子体(plasma)较弱的结构时表面会被蚀刻,从而导致上方无机膜的平坦度下降,接着水蒸气透过率(Water Vapor Transmission Rate;WVTR)也降低。
发明内容
本发明要解决现有技术中的技术问题,提供一种封装薄膜用化合物及其组合物和薄膜及有机发光器件和封装方法。本发明是通过无机膜与有机膜重复交替叠层制造有机发光器件封装膜时,在下部有机层中引入了对等离子体(plasma)耐受的结构,从而防止蒸镀无机膜时表面被蚀刻来维持较高平坦度,相对来说这对厚度较薄的上方无机膜的平坦度有巨大影响。含有本发明提供的化合物或者组合物的封装薄膜具有较高水蒸气透过率,并且利用此封装薄膜可制成具又可弯曲性的有机发光器件。
为了解决上述技术问题,本发明的技术方案具体如下:
本发明提供一种封装薄膜用化合物,其结构如化学结构式1所示:
其中:
A是碳数量为6至12的烷氨基、或被烷氧基取代或未取代的芳香族基团;
R
1至R
4是相同或不同的碳数量为1至6的烷基、或芳香族基团;
R
5和R
6是相同或不同的碳数量为2至6的烷基、或是包含1到6个烷基与乙烯氧基的基团;
R
7和R
8是氢或甲基;
n
1和n
2是相同的自然数;
n
3为0或1;
Y
1和Y
2是相同或不同的氧、被烷基取代或未取代的氨基或硫,或是选自如下列化学结构式2至4中的任意一种;
本发明还提供一种组合物,包括:组分A、组分B和组分C;
组分A:化学结构式1所示的封装薄膜用化合物;
组分B:一种以上具有受光以及热可固化的丙烯基化合物;
组分C:一种以上受光或热产生游离基以及产生酸的化合物。
在上述技术方案中,各组分的重量百分含量如下:
组分A的重量百分含量为:9.5-90%;
组分B的重量百分含量为:9.5-90%;
组分C的重量百分含量为:0.5-10%。
在上述技术方案中,所述组分B为2-苯氧乙基丙烯酸、2-苯氧乙基(甲基)丙烯酸、3-苯氧基丙基丙烯酸、3-苯氧基丙基(甲基)丙烯酸、4-苯氧基丁基丙烯酸、4-苯氧基丁基(甲基)丙烯酸、5-苯氧基戊基丙烯酸、5-苯氧基戊基(甲基)丙烯酸、6-苯氧基己基丙烯酸、6-苯氧基己基(甲基)丙烯酸、7-苯氧基庚基丙烯酸、7-苯氧基庚基(甲基)丙烯酸、8-苯氧基辛基丙烯酸、8-苯氧基辛基(甲基)丙烯酸、9-苯氧基壬基丙烯酸、9-苯氧基壬基(甲基)丙烯酸、10-苯氧基癸基丙烯酸、10-苯氧基癸基(甲基)丙烯酸、2-(苯硫基)乙基丙烯酸、2-(苯硫基)乙基(甲基)丙烯酸、3-(苯硫基)丙基丙烯酸、3-(苯硫基)丙基(甲基)丙烯酸、4-(苯硫 基)丁基丙烯酸、4-(苯硫基)丁基(甲基)丙烯酸、5-(苯硫基)戊基丙烯酸、5-(苯硫基)戊基(甲基)丙烯酸、6-(苯硫基)己基丙烯酸、6-(苯硫基)己基(甲基)丙烯酸、7-(苯硫基)庚基丙烯酸、7-(苯硫基)庚基(甲基)丙烯酸、8-(苯硫基)辛基丙烯酸、8-(苯硫基)辛基(甲基)丙烯酸、9-(苯硫基)壬基丙烯酸、9-(苯硫基)壬基(甲基)丙烯酸、10-(苯硫基)癸基丙烯酸、10-(苯硫基)癸基(甲基)丙烯酸、2-(萘-2-基氧基)乙基丙烯酸、2-(萘-2-基氧基)乙基(甲基)丙烯酸、3-(萘-2-基氧基)丙基丙烯酸、3-(萘-2-基氧基)丙基(甲基)丙烯酸、4-(萘-2-基氧基)丁基丙烯酸、4-(萘-2-基氧基)丁基(甲基)丙烯酸、5-(萘-2-基氧基)戊基丙烯酸、5-(萘-2-基氧基)戊基(甲基)丙烯酸、6-(萘-2-基氧基)己基丙烯酸、6-(萘-2-基氧基)己基(甲基)丙烯酸、7-(萘-2-基氧基)庚基丙烯酸、7-(萘-2-基氧基)庚基(甲基)丙烯酸、8-(萘-2-基氧基)辛基丙烯酸、8-(萘-2-基氧基)辛基(甲基)丙烯酸酯、9-(萘-2-基氧基)壬基丙烯酸酯、9-(萘-2-基氧基)壬基(甲基)丙烯酸酯、10-(萘-2-基氧基基氧基)癸基丙烯酸盐、10-(萘-2-基氧基)癸基(甲基)丙烯酸盐、2-(萘-2-)乙基丙烯酸盐、2-(萘-2-基硫代)乙酯(甲基)丙烯酸盐、3-(萘-2-基硫代)丙基丙烯酸酯、3-(萘-2-基硫代)丙基(甲基)丙烯酸酯、4-(萘-2-基硫代)丁基萘丙烯酸酯、4-(萘-2-基硫代)丁基(甲基)丙烯酸酯、5-(萘-2-基硫代)戊基丙烯酸酯、5-(萘-2-基硫代)基萘(甲基)丙烯酸酯、6-(萘-2-基硫代)己基丙烯酸酯、6-(萘-2-基硫代)己基(甲基)丙烯酸酯、7-(萘-2-基硫代)庚基丙烯酸酯、7-(萘-2-基硫代)庚基(甲基)丙烯酸酯、8-(萘-2-基硫代)辛基丙烯酸酯、8-(萘-2-基硫代)辛基(甲基)丙烯酸酯、9-(萘-2-基硫代)壬基丙烯酸酯、9-(萘-2-基硫代)壬基(甲基)丙烯酸酯、10-(萘-2-基硫代)癸基丙烯酸酯、10-(萘-2-基硫代)癸基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基(甲基)丙烯酸酯、3-([1,1`-联苯]-4-基氧基)丙基丙烯酸酯、3-([1,1`-联苯]-4-基氧基)丙基(甲基)丙烯酸酯、4-([1,1`-联苯]-4-基氧基)丁基丙烯酸酯、4-([1,1`-联苯]-4-基氧基)丁基(甲基)丙烯酸酯、5-([1,1`-联苯]-4-基氧基)基萘丙烯酸酯、5-([1,1`-联苯]-4-基氧基)基萘(甲基)丙烯酸酯、6-([1,1`-联苯]-4-基氧基)己基丙烯酸酯、6-([1,1`-联苯]-4-基氧基)己基(甲基)丙烯酸酯、7-([1,1`-联苯]-4-基氧基)庚基丙烯酸酯、7-([1,1`-联苯]-4-基氧基)庚基(甲基)丙烯酸酯、8-([1,1`-联苯]-4-基氧基)辛基丙烯酸酯、8-([1,1`-联苯]-4-基氧基)辛基(甲基)丙烯酸酯、9-([1,1`-联苯]-4-基氧基)壬基丙烯酸酯、9-([1,1`-联苯]-4-基氧基)壬基(甲基)丙烯酸酯、10-([1,1`-联苯]-4-基氧基)癸基丙烯酸酯、10-([1,1`-联苯]-4-基氧基)癸基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基硫代)乙基丙烯酸酯、2-([1,1`-联苯]-4-基硫代)乙基(甲基)丙烯酸酯、3-([1,1`-联苯]-4-基硫代)丙基丙烯酸酯、3-([1,1`-联苯]-4-基硫代)丙基(甲基)丙烯酸酯、4-([1,1`-联苯]-4-基硫代)丁基丙烯酸酯、4-([1,1`-联苯]-4-基硫代)丁基(甲基)丙烯酸酯、5-([1,1`-联苯]-4-基硫代)基萘丙烯酸酯、5-([1,1`-联苯]-4-基硫代)基萘(甲基)丙烯酸酯、6-([1,1`-联苯]-4-基硫代)己基丙烯酸酯、6-([1,1`-联苯]-4-基硫代)己基(甲基)丙烯酸酯、7-([1,1`-联苯]-4-基硫代)庚基丙烯酸酯、7-([1,1`-联苯]-4-基硫代)庚基(甲基)丙烯酸酯、8-([1,1`-联苯]-4-基硫代)辛基丙烯酸酯、8-([1,1`-联苯]-4-基硫代)辛基(甲基)丙烯酸酯、9-([1,1`-联苯]-4基硫代)壬基丙烯酸酯、9-([1,1`-联苯]-4-基硫代)壬基(甲基)丙烯酸酯、10-([1,1`-联苯]-4-基硫代)癸基丙烯酸酯、10-([1,1`-联苯]-4-基硫代)癸基(甲基)丙烯酸酯、2-羟基-2-苯氧乙基丙烯酸酯、2-羟基-2-苯氧乙基(甲基)丙烯酸酯、2-羟基-2-(萘-2-基氧基)乙基丙烯酸酯、2- 羟基-2-(萘-2-基氧基)乙基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基(甲基)丙烯酸酯、2-(2-苯氧基乙氧基)乙基丙烯酸酯、2-(2-苯氧基乙氧基)乙基(甲基)丙烯酸酯、2-(苯氧基甲氧基)乙基丙烯酸酯、2-(苯氧基甲氧基)乙基(甲基)丙烯酸酯、2-(([1,1`-联苯]-4-基氧基)甲氧基)乙基丙烯酸酯、2-(([1,1`-联苯]-4-基氧基)甲氧基)乙基(甲基)丙烯酸酯、2-((萘-2-基氧基)甲氧基)乙基丙烯酸酯、2-((萘-2-基氧基)甲氧基)乙基(甲基)丙烯酸酯、2-((苯硫基)甲氧基)乙基丙烯酸酯、2-((苯硫基)甲氧基)乙基(甲基)丙烯酸酯、2-((萘-2-基硫代)甲氧基)乙基丙烯酸酯、2-((萘-2-基硫代)甲氧基)乙基(甲基)丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)二丙烯酸酯、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)双(2-丙烯酸甲酯)、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)二丙烯酸酯、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-硫代双(4,1- 亚苯基)双(氧基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-硫代双(4,1-亚苯基)二(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基) 双(硫代二基))双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、聚酯纤维氨基甲酸乙脂二丙烯酸酯、三丙二醇二丙烯酸酯、氨基甲酸乙脂丙烯酸酯、环氧树脂丙烯酸酯、苯硫基乙基(甲基)丙烯酸酯、异莰基丙烯酸酯、苯氧基乙基(甲基)丙烯酸、苯氧基-2-甲基-乙基(甲基)丙烯酸、苯氧基乙氧基乙基(甲基)丙烯酸、苯氧基苯基丙烯酸、3-苯氧基-2-羟基丙基(甲基)丙烯酸酯、2-1-萘氧基乙基(甲基)丙烯酸、2-2-萘氧基乙基(甲基)丙烯酸、2-1-萘硫代乙基(甲基)丙烯酸、2-2-萘硫代乙基(甲基)丙烯酸、三丙烯酸三羟甲基丙酯、1,12-十二烷二醇二甲基丙烯酸酯、1,6-己二醇二丙烯酸酯、及1,10-癸二醇二丙烯酸酯中的一种或多种。
在上述技术方案中,所述C组分为光聚合引发剂和/或自由基聚合引发剂;所述光聚合引发剂为乙酰苯化合物、二苯甲酮化合物、噻吨酮化合物、安息香类化合物、三嗪类化合物、咔唑类化合物、二酮类化合物、锍硼酸类化合物、重氮盐类化合物、咪唑类化合物、及非咪唑类化合物中的一种或者多种;所述自由基聚合引发剂过氧化物类化合物、及双偶氮类化合物中的一种或多种。
本发明还提供一种封装薄膜,其是适用了本发明提供的组合物的如下条件般叠层的薄膜层;
是将相同或独立的有机层与无机层叠层1次以上涂布形成的薄膜层;
所述有机层为本发明提供的组合物;
所述无机层为氮化硅、氮氧化硅、氧化硅、氧化铝、氧化锆、氧化钛、氧化锌中的一个或两个以上形成的,且叠层的无机层之间可以不同。
在上述技术方案中,所述封装薄膜是水蒸气透过率在9*10
-2g/m
2·天以下的薄膜层。
在上述技术方案中,所述封装薄膜的无机层被布置在所述有机层的一个或者两个表面上。
本发明还提供一种封装有本发明所述的封装薄膜的有机发光器件。
本发明还提供一种有机发光器件的封装方法,包括以下步骤:
将本发明所述的封装薄膜直接涂在有机发光器件上面,或者直接将封装薄膜制成薄膜形态贴在有机发光器件上。
本发明的有益效果是:
本发明提供一种封装薄膜用化合物及其组合物,将组合物作为有机层,通过无机层与有机层重复交替叠层制造有机发光器件封装薄膜,使得有机发光器件中的有机层与氧气及水分间的隔绝从而达到保护有机发光器件的一种薄膜。且无机层与有机层重复交替叠层的薄膜展现出低水蒸气透过率(WVTR)和可弯曲的性质。另外,在有机层适用了不惧等离子体(plasma)的结构,有效防止了有机膜因无机膜蒸镀时产生的等离子体(plasma)而受损的情况,使要蒸镀无机膜的有机膜上方保持较高的平坦度,让无机膜蒸镀得更加稳定,这包含了提供展现出较高水蒸气透过率的封装膜与利用此封装膜制造的灵活性有机发光器件。
下面结合附图和具体实施方式对本发明作进一步详细说明。
图1为本发明提供的封装薄膜的一种结构示意图。
图中的附图标记表示为:
11-无机层,12-有机层。
本发明提供一种封装薄膜用化合物,其结构如化学结构式1所示:
其中:A是碳数量为6至12的烷氨基、或被烷氧基取代或未取代的芳香族基团;R
1至R
4是相同或不同的碳数量为1至6的烷基、或芳香族基团;R
5和R
6是相同或不同的碳数量为2至6的烷基、或是包含1到6个烷基与乙烯氧基的基团;R
7和R
8是氢或甲基;n
1和n
2是相同的自然数;n
3为0或1;Y
1和Y
2是相同或不同的氧、被烷基取代或未取代的氨基或硫,或是选自如下列化学结构式2至4中的任意一种;
本发明还提供一种组合物,包括:组分A、组分B和组分C;
组分A:化学结构式1所示的封装薄膜用化合物;
组分B:一种以上具有受光以及热可固化的丙烯基化合物;
组分C:一种以上受光或热产生游离基以及产生酸的化合物。
各组分的重量百分含量如下:
组分A的重量百分含量为:9.5-90%;
组分B的重量百分含量为:9.5-90%;
组分C的重量百分含量为:0.5-10%。
这种化学结构式1的化合物可以制造具有一个以上单独或者通过其他光以及热可以固化的丙烯基的化合物的混合物和具有一个以上受光或热产生自由基以及酸的化合物或混合物的组合物,利用它水蒸气透过率(Water Vapor Transmission Rate)在9*10
-2g/m
2·天以下,可提供同样的或独立的有机层和无机层交替一次以上叠层的薄膜层。使用的无机层可以是氮化硅、氮氧化硅、氧化硅、氧化铝、氧化锆、氧化钛、氧化锌中的一个或两个以上,叠层的无机层之间可以不同。这样制造出的薄膜层可以直接涂在有机发光器件上面或是制造成薄膜形态贴在上面。
因此本发明还提供一种封装薄膜,其是适用了本发明提供的组合物的如下条件般叠层的薄膜层;
是将相同或独立的有机层与无机层叠层1次以上涂布形成的薄膜层;
所述有机层为本发明提供的组合物;
所述无机层为氮化硅、氮氧化硅、氧化硅、氧化铝、氧化锆、氧化钛、氧化锌中的一个或两个以上形成的,且叠层的无机层之间可以不同。
优选所述封装薄膜是水蒸气透过率在9*10
-2g/m
2·天以下的薄膜层。
优选所述封装薄膜的无机层被布置在所述有机层的一个或者两个表面上。当所述无机层被布置在所述有机层的两个表面上的形成的封装薄膜参见图1,图1中,11代表无机层,12代表有机层。
封装部分是在基板上面形成的有机发光器件和驱动电路上方直接形成的,将有机发光器件与驱动电路密封保护不受外部伤害。这种封装部分的结构通常是薄膜型的也被称为薄膜封装层。
(1)有机层
有机层除了请求项1中详细说明的如化学结构式1中的化合物之外,也可以用在具有一个以上可光固化或热固化的单体群上。这种单体或单体群与固体或液体以及热与光致自由基引发剂以及热与光致酸发生剂混合,用喷墨、电子喷雾、电子放射等方式涂布后,通过紫外线照射或热固化的方式塑成的过程而形成。
这些单体群虽然具有一个以上丙烯酸或钛基丙烯酸,但并不仅限于此。本发明中封装部分根据无机层和有机层的厚度构成不同。无机层和有机层的厚度关系的设定是有机层的厚度较无机层更厚。
组分B具有受光以及热可固化的丙烯基化合物,示例为2-苯氧乙基丙烯酸、2-苯氧乙基(甲基)丙烯酸、3-苯氧基丙基丙烯酸、3-苯氧基丙基(甲基)丙烯酸、4-苯氧基丁基丙烯酸、4-苯氧基丁基(甲基)丙烯酸、5-苯氧基戊基丙烯酸、5-苯氧基戊基(甲基)丙烯酸、6-苯氧基己基丙烯酸、6-苯氧基己基(甲基)丙烯酸、7-苯氧基庚基丙烯酸、7-苯氧基庚基(甲基)丙烯酸、8-苯氧基辛基丙烯酸、8-苯氧基辛基(甲基)丙烯酸、9-苯氧基壬基丙烯酸、9-苯氧基壬基(甲基)丙烯酸、10-苯氧基癸基丙烯酸、10-苯氧基癸基(甲基)丙烯酸、2-(苯硫基)乙基丙烯酸、2-(苯硫基)乙基(甲基)丙烯酸、3-(苯硫基)丙基丙烯酸、3-(苯硫基)丙基(甲基)丙烯酸、4-(苯硫基)丁基丙烯酸、4-(苯硫基)丁基(甲基)丙烯酸、5-(苯硫基)戊基丙烯酸、5-(苯硫基)戊基(甲基)丙烯酸、6-(苯硫基)己基丙烯酸、6-(苯硫基)己基(甲基)丙烯酸、7-(苯硫基)庚基丙烯酸、7-(苯硫基)庚基(甲基)丙烯酸、8-(苯硫基)辛基丙烯酸、8-(苯硫基)辛基(甲基)丙烯酸、9-(苯硫基)壬基丙烯酸、9-(苯硫基)壬基(甲基)丙烯酸、10-(苯硫基)癸基丙烯酸、10-(苯硫基)癸基(甲基)丙烯酸、2-(萘-2-基氧基)乙基丙烯酸、2-(萘-2-基氧基)乙基(甲基)丙烯酸、3-(萘-2-基氧基)丙基丙烯酸、3-(萘-2-基氧基)丙基(甲基)丙烯酸、4-(萘-2-基氧基)丁基丙烯酸、4-(萘-2-基氧基)丁基(甲基)丙烯酸、5-(萘-2-基氧基)戊基丙烯酸、5-(萘-2-基氧基)戊基(甲基)丙烯酸、6-(萘-2-基氧基)己基丙烯酸、6-(萘-2-基氧基)己基(甲基)丙烯酸、7-(萘-2-基氧基)庚基丙烯酸、7-(萘-2-基氧基)庚基(甲基)丙烯酸、8-(萘-2-基氧基)辛基丙烯酸、8-(萘-2-基氧基)辛基(甲基)丙烯酸酯、9-(萘-2-基氧基)壬基丙烯酸酯、9-(萘-2-基氧基)壬基(甲基)丙烯酸酯、10-(萘-2-基氧基基氧基)癸基 丙烯酸盐、10-(萘-2-基氧基)癸基(甲基)丙烯酸盐、2-(萘-2-)乙基丙烯酸盐、2-(萘-2-基硫代)乙酯(甲基)丙烯酸盐、3-(萘-2-基硫代)丙基丙烯酸酯、3-(萘-2-基硫代)丙基(甲基)丙烯酸酯、4-(萘-2-基硫代)丁基萘丙烯酸酯、4-(萘-2-基硫代)丁基(甲基)丙烯酸酯、5-(萘-2-基硫代)戊基丙烯酸酯、5-(萘-2-基硫代)基萘(甲基)丙烯酸酯、6-(萘-2-基硫代)己基丙烯酸酯、6-(萘-2-基硫代)己基(甲基)丙烯酸酯、7-(萘-2-基硫代)庚基丙烯酸酯、7-(萘-2-基硫代)庚基(甲基)丙烯酸酯、8-(萘-2-基硫代)辛基丙烯酸酯、8-(萘-2-基硫代)辛基(甲基)丙烯酸酯、9-(萘-2-基硫代)壬基丙烯酸酯、9-(萘-2-基硫代)壬基(甲基)丙烯酸酯、10-(萘-2-基硫代)癸基丙烯酸酯、10-(萘-2-基硫代)癸基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基(甲基)丙烯酸酯、3-([1,1`-联苯]-4-基氧基)丙基丙烯酸酯、3-([1,1`-联苯]-4-基氧基)丙基(甲基)丙烯酸酯、4-([1,1`-联苯]-4-基氧基)丁基丙烯酸酯、4-([1,1`-联苯]-4-基氧基)丁基(甲基)丙烯酸酯、5-([1,1`-联苯]-4-基氧基)基萘丙烯酸酯、5-([1,1`-联苯]-4-基氧基)基萘(甲基)丙烯酸酯、6-([1,1`-联苯]-4-基氧基)己基丙烯酸酯、6-([1,1`-联苯]-4-基氧基)己基(甲基)丙烯酸酯、7-([1,1`-联苯]-4-基氧基)庚基丙烯酸酯、7-([1,1`-联苯]-4-基氧基)庚基(甲基)丙烯酸酯、8-([1,1`-联苯]-4-基氧基)辛基丙烯酸酯、8-([1,1`-联苯]-4-基氧基)辛基(甲基)丙烯酸酯、9-([1,1`-联苯]-4-基氧基)壬基丙烯酸酯、9-([1,1`-联苯]-4-基氧基)壬基(甲基)丙烯酸酯、10-([1,1`-联苯]-4-基氧基)癸基丙烯酸酯、10-([1,1`-联苯]-4-基氧基)癸基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基硫代)乙基丙烯酸酯、2-([1,1`-联苯]-4-基硫代)乙基(甲基)丙烯酸酯、3-([1,1`-联苯]-4-基硫代)丙基丙烯酸酯、3-([1,1`-联苯]-4-基硫代)丙基(甲基)丙烯酸酯、4-([1,1`-联苯]-4-基硫代)丁基丙烯酸酯、4-([1,1`-联苯]-4-基硫代)丁基(甲基)丙烯酸酯、5-([1,1`-联苯]-4-基硫代)基萘丙烯酸酯、5-([1,1`-联苯]-4-基硫代)基萘(甲基)丙烯酸酯、6-([1,1`-联苯]-4-基硫代)己基丙烯酸酯、6-([1,1`-联苯]-4-基硫代)己基(甲基)丙烯酸酯、7-([1,1`-联苯]-4-基硫代)庚基丙烯酸酯、7-([1,1`-联苯]-4-基硫代)庚基(甲基)丙烯酸酯、8-([1,1`-联苯]-4-基硫代)辛基丙烯酸酯、8-([1,1`-联苯]-4-基硫代)辛基(甲基)丙烯酸酯、9-([1,1`-联苯]-4基硫代)壬基丙烯酸酯、9-([1,1`-联苯]-4-基硫代)壬基(甲基)丙烯酸酯、10-([1,1`-联苯]-4-基硫代)癸基丙烯酸酯、10-([1,1`-联苯]-4-基硫代)癸基(甲基)丙烯酸酯、2-羟基-2-苯氧乙基丙烯酸酯、2-羟基-2-苯氧乙基(甲基)丙烯酸酯、2-羟基-2-(萘-2-基氧基)乙基丙烯酸酯、2-羟基-2-(萘-2-基氧基)乙基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基(甲基)丙烯酸酯、2-(2-苯氧基乙氧基)乙基丙烯酸酯、2-(2-苯氧基乙氧基)乙基(甲基)丙烯酸酯、2-(苯氧基甲氧基)乙基丙烯酸酯、2-(苯氧基甲氧基)乙基(甲基)丙烯酸酯、2-(([1,1`-联苯]-4-基氧基)甲氧基)乙基丙烯酸酯、2-(([1,1`-联苯]-4-基氧基)甲氧基)乙基(甲基)丙烯酸酯、2-((萘-2-基氧基)甲氧基)乙基丙烯酸酯、2-((萘-2-基氧基)甲氧基)乙基(甲基)丙烯酸酯、2-((苯硫基)甲氧基)乙基丙烯酸酯、2-((苯硫基)甲氧基)乙基(甲基)丙烯酸酯、2-((萘-2-基硫代)甲氧基)乙基丙烯酸酯、2-((萘-2-基硫代)甲氧基)乙基(甲基)丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(9H-芴-9, 9-二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)二丙烯酸酯、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)双(2-丙烯酸甲酯)、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)二丙烯酸酯、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-硫代双(4,1-亚苯基)二(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-硫代双(4, 1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、聚酯纤维氨基甲酸乙脂二丙烯酸酯、三丙二醇二丙烯酸酯、氨基甲酸乙脂丙烯酸酯、环氧树脂丙烯酸酯、苯硫基乙基(甲基)丙烯酸酯、异莰基丙烯酸酯、苯氧基乙基(甲基)丙烯酸、苯氧基-2-甲基-乙基(甲基)丙烯酸、苯氧基乙氧基乙基(甲基)丙烯酸、苯氧基苯基丙烯酸、3-苯氧基-2-羟基丙基(甲基)丙烯酸酯、2-1-萘氧基乙基(甲基)丙烯酸、2-2-萘氧基乙基(甲基)丙烯酸、2-1-萘硫代乙基(甲基)丙烯酸、2-2-萘硫代乙基(甲基)丙烯酸、三丙烯酸三羟甲基丙酯、1,12-十二烷二醇二甲基丙烯酸酯、1,6-己二醇二丙烯酸酯、及1,10-癸二醇二丙烯酸酯中的一种或多种。
化学式1的化合物以及上述丙烯酸单体混合体使用时,对二者的使用量考虑化学式1的化合物的粘度来使用即可。
所述C组分为光聚合引发剂和/或自由基聚合引发剂;上述光化聚合引发剂是作为 在光感性树脂组合物中常用的引发剂,可以使用例如乙酰苯化合物、二苯甲酮化合物、噻吨酮化合物、安息香类化合物、三嗪类化合物等。上述乙酰苯化合物的示例有,2,2-二乙氧基-苯乙酮、2,2'-二丁氧基苯乙酮、2-羟基-2-甲基苯丙酮、4-叔丁基三氯苯乙酮、4-叔丁基二氯苯乙酮、4-氯苯乙酮、2,2-二氯-4-苯氧基苯乙酮、2-甲基-1-(4-(甲硫基)苯基)-2-吗啉代丙烷-1-酮、2-苄基-2-二甲胺基-1-(4-吗啉基苯基)-丁烷-1-酮等。
上述二苯甲酮系化合物的示例有:二苯甲酮、苯甲酰安息香酸、苯甲酰安息香酸甲基、4-苯基二苯甲酮、羟基二苯甲酮、丙烯酸二苯甲酮、4,4'-二(二甲氨基)二苯甲酮、4,4'-二(二乙氨基)二苯甲酮、4,4'-二甲氨基二苯甲酮、4,4'-二氯二苯甲酮、3,3'-二甲氨基-2-甲氧基二苯甲酮等。
上述噻吨酮系化合物的示例有:噻吨酮、2-氯噻吨酮、2-甲基噻吨酮、异丙基噻吨酮、2,4-二乙基噻吨酮、2,4-二异丙基噻吨酮、2-氯代噻吨酮等。上述二苯乙醇酮系化合物的示例有:二苯乙醇酮、二苯乙醇酮甲基乙醚、二苯乙醇酮乙基乙醚、二苯乙醇酮异丙基乙醚、二苯乙醇酮异丁基乙醚、苄基二甲基缩酮等。
上述三嗪类化合物的示例有,三聚氯氰、2-苯基-4,6-二(三氯甲基)-s-三嗪、2-(3',4'-二甲氧基苯乙烯基)-4,6-二(三氯甲基)-s-三嗪、2-(4'-甲氧基萘)-4,6-二(三氯甲基)-s-三嗪、2-(p-甲氧基苯基)-4,6-二(三氯甲基)-s-三嗪、2-(4-甲苯基)-4,6-二(三氯甲基)-s-三嗪、2-二苯基4,6-二(三氯甲基)-s-三嗪、二(三氯甲基)-6-苯乙烯基-s-三嗪、2-(萘-1-基)-4,6-二(三氯甲基)-s-三嗪、2-(4-甲氧基萘-1-基)-4,6-二(三氯甲基)-s-三嗪、2-4-三氯甲基(哌嗪基羰基)-6-三嗪、2-4-三氯甲基(4'-甲氧基苯乙烯基)-6-三嗪等。
上述光引发剂除了上述化合物之外,也可用咔唑类化合物、二酮类化合物、锍硼酸类化合物、重氮盐类化合物、咪唑类化合物、非咪唑类化合物等。
上述自由基聚合引发剂可以用过氧化物类化合物、双偶氮类化合物等。
上述过氧化物类化合物的示例有,甲基乙基酮过氧化物、甲基异丁基酮过氧化物、环己酮过氧化物、甲基环己酮过氧化物、过氧化乙酰丙酮等酮的过氧化物类;过氧化异丁酰、2,4-二氯苯甲酰过氧化物、O-甲基苯甲酰过氧化物、二-3,5,5-三甲基己过氧化物等的二酰基过氧化物类、2,4,4-三甲基戊基-2-氢过氧化物、二异丙基苯氢过氧化物、异丙苯过氧化物、叔丁基过氧化物等的过氧化物类、过氧化二异丙苯、2,5-二甲基-2,5-二(叔丁基过氧)己烷、1,3-二(叔丁基氧基异丙基)苯、叔丁基过氧化戊酸正丁酯等的二二烷基过氧化物类;2,4,4-三甲基戊过氧苯氧基乙酸酯、α-过氧化新癸酸异丙苯酯、过氧化苯甲酸叔丁酯。己二酸二叔丁基过氧化三甲基酯等的烷基过酸酯类、过氧化二碳酸二-3-甲氧基丁酯、过氧化二碳酸二-2-乙基己酯、过氧化二碳酸双-4-叔丁基环己酯、过氧化二碳酸二异丙酯、乙酰基环己基磺酰基过氧化物、叔丁基过氧化芳基碳酸酯等的过碳酸盐类等。
上述双偶氮类化合物的示例有,1,1'-偶氮双环己烷-1-甲腈、2,2'-偶氮二(2,4-二甲基戊腈)、2,2-偶氮二(异丁酸甲酯)、2,2'-偶氮二(4-甲氧基-2,4-二甲基戊腈)、α,α'-偶氮双(异丁腈)及4,4'-偶氮双(4-氰基戊酸)等。上述引发剂可与经过吸收光而膨胀后传递能量而产生化学反应的光敏剂一同使用。上述光敏剂的示例有四乙二醇双-3-巯基丙酸酯,季戊四醇四-巯基丙酸酯,二季戊四醇四-3-巯基丙酸酯等。
上述引发剂对于上述感光性树脂组合物总量的使用范围为0.5%至10%的重量。 上述引发剂如果是在上述范围内的话,薄膜形成工艺中曝光时可以充分发生固化获得优秀的信赖性,虽然可以防止因未反应引发剂导致的透过率低下,但并不仅限于示例所述。
(2)无机层
无机层通过溅射CVD(Chemical Vapor Deposition),ALD(Atomic Layer Deposition),IBAD(Ion Beam Assisted Deposition)等,会形成金属的氧化物和氮化物。
举例来说,钙氧化物、铝氧化物、钛氧化物、铟氧化物、锡氧化物、硅氧化物、氮化硅、氮氧化硅、氮化铝、氧化锆用会形成所选的物质,但不仅仅局限于此。
另一实施例为利用前述组成物来制成封装膜。上述封装膜的制作方法如下。记录本发明可靠的实施例,但下述的实施例只是本发明的可靠的实施例中的一个,而不是说本发明局限于下述实施例。
(3)涂膜以及涂层的形成阶段
将前述的感光性树脂组合物放在已规定好的预加工的大小为6cm*6cm的基板的PEN(Poly Ethylene Naphthalene)上通过水分将氮化硅用等离子化学气象蒸镀方法进行蒸镀。使用游离子用感应式游离性(Inductively coupled plasma)的方式后发生。为了蒸镀的前驱物质和反应气体以(trisilylamine,TSA)20sccm,氨气60scc的流量供给到反应机内部,用氩气作为载气供给200sccm。反应机内部的气体充分饱和后,打开氨气等离子后,用0.4torr对厚度为250nm厚度的氮化硅薄膜进行12分钟的蒸镀。通过SEM(Scanning Electron Microscope)确认了250nm厚度的氮化硅薄膜的形成。
有机膜和下面的制造例5-11一样,分别做好后将组合物用喷剂进行涂装,用100mW/cm
2进行10秒左右的照射后用UV进行硬化,会形成涂膜涂层厚度为3μm的涂层。使用曝光的光源的话,会使用高压的水银等。使用和无机膜涂膜相同的方法在有机膜上的无机膜形成250mm的氮化硅薄膜。
<制造例1>制造化学式7的化合物3
附着在回流器上的1000mL的三口烧瓶中,将化学式5中的化合物1(Gelest社)50g和烯丙醇(西格玛奥德里奇公司)34g溶解在500mL的乙酸乙酯(西格玛奥德里奇公司)后加入反应瓶中,加入四甲基二乙烯基二硅氧烷的卡斯泰德催化剂溶液(庄信万丰催化剂公司))0.3g加入至反应体系后,加热至80℃回流搅拌4个小时。将温度降至常温后,再进行过滤去除Pt催化剂,利用减压蒸馏装置旋蒸除去溶剂和残留的烯丙醇,获得80g的化学式6中的化合物2。将80g的化合物2加至600mL甲苯(西格玛奥德里奇公司)中,再加入丙烯酸45g和硫酸1g后,在反应瓶中架装分水器,经过加热回流将生成的水去除,并持续搅拌6小时。反应完成后用10wt%的氢氧化钠水溶液500g进行2次洗涤后,再用500g的蒸馏水洗涤两次。随后将有机层进行减压蒸馏得到110g化学式7中的化合物3。MW:418.34。
<制造例2,3,4>制造了化学结构式8的化合物4,化学结构式10的化合物6,化学结 构式12的化合物8。
像制造例1的环境中用33g烯丙胺(西格玛奥德里奇公司)来替代烯丙醇来制造化学结构式9的化合物5以及用44g烯丙基硫醇(西格玛奥德里奇公司)合成化学结构式11的化合物7。之后使用下方表1中的重量百分比在50℃搅拌4小时反应完成后即可获得化合物4(MW:592.61)、化合物6(590.38),化合物8(MW:624.22)。
<表1>
<制造例5至11>
如表2的组合,将化合物放入反应釜中搅拌30分钟后利用0.45μm特氟隆材质的针筒过滤器(syringefilter)进行过滤。各个组合物是如表3所示将无机膜(250nm)/有机膜(3 μm)/无机膜(250nm)的形式形成在PEN上面,封装膜的透水性是利用透水性测量仪(AQUARAN2,MOCON社)进行测量的。测量是在37.8℃以及100%相对湿度条件下进行了24小时。
<表2>
<表3>
另外将有机物涂上3μm后,在化学蒸发沉积仓室内不放入无机先驱体的三甲硅烷基胺和氨气,在同样的条件下仅用氩等离子体将有机膜蚀刻后,用高分辨率原子力显微镜(HR-AFM)(NanoWizardUltraSpeed型号/德国JPK公司)对等离子蚀刻前后的R
a进行测量后,得出结果如表4和5所示。
<表4>
<表5>
和表3一样,在同等条件下将无机/有机膜进行层压后制作的封装膜的水蒸气透过率,适用于化学式7的化合物3的实施例1是效果最好的。在没有使用化合物3的情况下,结合的数值最少的比较例2的数值是最低的。原因是通过原子力显微镜测得的等离子处理前/后的结果,即表3给出的结果就不难理解。通过等离子蚀刻表面,如果平坦度不好,就会给它后 面的无机膜造成影响,使水蒸气透过率也会变低。
本发明不仅仅局限于上述的实施例以及图纸,也可以成为更为多样的形态,本发明所属的技术领域中,拥有基础知识的人会理解不改变本发明的技术性思想,也能推进为其他具体的形态。所以可以理解为上述的实施例和图纸在所有方面都是具有预示意义的,并不是限定的。
Claims (10)
- 一种组合物,其特征在于,包括:组分A、组分B和组分C;组分A:权利要求1中化学结构式1所示的封装薄膜用化合物;组分B:一种以上具有受光以及热可固化的丙烯基化合物;组分C:一种以上受光或热产生游离基以及产生酸的化合物。
- 根据权利要求2所述的组合物,其特征在于,各组分的重量百分含量如下:组分A的重量百分含量为:9.5-90%;组分B的重量百分含量为:9.5-90%;组分C的重量百分含量为:0.5-10%。
- 根据权利要求2或3所述的组合物,其特征在于,所述组分B为2-苯氧乙基丙烯酸、2-苯氧乙基(甲基)丙烯酸、3-苯氧基丙基丙烯酸、3-苯氧基丙基(甲基)丙烯酸、4-苯氧基丁基丙烯酸、4-苯氧基丁基(甲基)丙烯酸、5-苯氧基戊基丙烯酸、5-苯氧基戊基(甲基)丙烯酸、6-苯氧基己基丙烯酸、6-苯氧基己基(甲基)丙烯酸、7-苯氧基庚基丙烯酸、7-苯氧基庚基(甲基)丙烯酸、8-苯氧基辛基丙烯酸、8-苯氧基辛基(甲基)丙烯酸、9-苯氧基壬基丙烯酸、9-苯氧基壬基(甲基)丙烯酸、10-苯氧基癸基丙烯酸、10-苯氧基癸基(甲基)丙烯酸、2-(苯硫基)乙基丙烯酸、2-(苯硫基)乙基(甲基)丙烯酸、3-(苯硫基)丙基丙烯酸、3-(苯硫基)丙 基(甲基)丙烯酸、4-(苯硫基)丁基丙烯酸、4-(苯硫基)丁基(甲基)丙烯酸、5-(苯硫基)戊基丙烯酸、5-(苯硫基)戊基(甲基)丙烯酸、6-(苯硫基)己基丙烯酸、6-(苯硫基)己基(甲基)丙烯酸、7-(苯硫基)庚基丙烯酸、7-(苯硫基)庚基(甲基)丙烯酸、8-(苯硫基)辛基丙烯酸、8-(苯硫基)辛基(甲基)丙烯酸、9-(苯硫基)壬基丙烯酸、9-(苯硫基)壬基(甲基)丙烯酸、10-(苯硫基)癸基丙烯酸、10-(苯硫基)癸基(甲基)丙烯酸、2-(萘-2-基氧基)乙基丙烯酸、2-(萘-2-基氧基)乙基(甲基)丙烯酸、3-(萘-2-基氧基)丙基丙烯酸、3-(萘-2-基氧基)丙基(甲基)丙烯酸、4-(萘-2-基氧基)丁基丙烯酸、4-(萘-2-基氧基)丁基(甲基)丙烯酸、5-(萘-2-基氧基)戊基丙烯酸、5-(萘-2-基氧基)戊基(甲基)丙烯酸、6-(萘-2-基氧基)己基丙烯酸、6-(萘-2-基氧基)己基(甲基)丙烯酸、7-(萘-2-基氧基)庚基丙烯酸、7-(萘-2-基氧基)庚基(甲基)丙烯酸、8-(萘-2-基氧基)辛基丙烯酸、8-(萘-2-基氧基)辛基(甲基)丙烯酸酯、9-(萘-2-基氧基)壬基丙烯酸酯、9-(萘-2-基氧基)壬基(甲基)丙烯酸酯、10-(萘-2-基氧基基氧基)癸基丙烯酸盐、10-(萘-2-基氧基)癸基(甲基)丙烯酸盐、2-(萘-2-)乙基丙烯酸盐、2-(萘-2-基硫代)乙酯(甲基)丙烯酸盐、3-(萘-2-基硫代)丙基丙烯酸酯、3-(萘-2-基硫代)丙基(甲基)丙烯酸酯、4-(萘-2-基硫代)丁基萘丙烯酸酯、4-(萘-2-基硫代)丁基(甲基)丙烯酸酯、5-(萘-2-基硫代)戊基丙烯酸酯、5-(萘-2-基硫代)基萘(甲基)丙烯酸酯、6-(萘-2-基硫代)己基丙烯酸酯、6-(萘-2-基硫代)己基(甲基)丙烯酸酯、7-(萘-2-基硫代)庚基丙烯酸酯、7-(萘-2-基硫代)庚基(甲基)丙烯酸酯、8-(萘-2-基硫代)辛基丙烯酸酯、8-(萘-2-基硫代)辛基(甲基)丙烯酸酯、9-(萘-2-基硫代)壬基丙烯酸酯、9-(萘-2-基硫代)壬基(甲基)丙烯酸酯、10-(萘-2-基硫代)癸基丙烯酸酯、10-(萘-2-基硫代)癸基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基(甲基)丙烯酸酯、3-([1,1`-联苯]-4-基氧基)丙基丙烯酸酯、3-([1,1`-联苯]-4-基氧基)丙基(甲基)丙烯酸酯、4-([1,1`-联苯]-4-基氧基)丁基丙烯酸酯、4-([1,1`-联苯]-4-基氧基)丁基(甲基)丙烯酸酯、5-([1,1`-联苯]-4-基氧基)基萘丙烯酸酯、5-([1,1`-联苯]-4-基氧基)基萘(甲基)丙烯酸酯、6-([1,1`-联苯]-4-基氧基)己基丙烯酸酯、6-([1,1`-联苯]-4-基氧基)己基(甲基)丙烯酸酯、7-([1,1`-联苯]-4-基氧基)庚基丙烯酸酯、7-([1,1`-联苯]-4-基氧基)庚基(甲基)丙烯酸酯、8-([1,1`-联苯]-4-基氧基)辛基丙烯酸酯、8-([1,1`-联苯]-4-基氧基)辛基(甲基)丙烯酸酯、9-([1,1`-联苯]-4-基氧基)壬基丙烯酸酯、9-([1,1`-联苯]-4-基氧基)壬基(甲基)丙烯酸酯、10-([1,1`-联苯]-4-基氧基)癸基丙烯酸酯、10-([1,1`-联苯]-4-基氧基)癸基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基硫代)乙基丙烯酸酯、2-([1,1`-联苯]-4-基硫代)乙基(甲基)丙烯酸酯、3-([1,1`-联苯]-4-基硫代)丙基丙烯酸酯、3-([1,1`-联苯]-4-基硫代)丙基(甲基)丙烯酸酯、4-([1,1`-联苯]-4-基硫代)丁基丙烯酸酯、4-([1,1`-联苯]-4-基硫代)丁基(甲基)丙烯酸酯、5-([1,1`-联苯]-4-基硫代)基萘丙烯酸酯、5-([1,1`-联苯]-4-基硫代)基萘(甲基)丙烯酸酯、6-([1,1`-联苯]-4-基硫代)己基丙烯酸酯、6-([1,1`-联苯]-4-基硫代)己基(甲基)丙烯酸酯、7-([1,1`-联苯]-4-基硫代)庚基丙烯酸酯、7-([1,1`-联苯]-4-基硫代)庚基(甲基)丙烯酸酯、8-([1,1`-联苯]-4-基硫代)辛基丙烯酸酯、8-([1,1`-联苯]-4-基硫代)辛基(甲基)丙烯酸酯、9-([1,1`-联苯]-4基硫代)壬基丙烯酸酯、9-([1,1`-联苯]-4-基硫代)壬基(甲基)丙烯酸酯、10-([1,1`-联苯]-4-基硫代)癸基丙烯酸酯、10-([1,1`-联苯]-4-基硫代)癸基(甲基)丙烯酸酯、2-羟基-2-苯氧乙基丙烯酸酯、2-羟基-2-苯氧乙基(甲基)丙烯酸酯、2-羟基-2-(萘-2- 基氧基)乙基丙烯酸酯、2-羟基-2-(萘-2-基氧基)乙基(甲基)丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基丙烯酸酯、2-([1,1`-联苯]-4-基氧基)乙基(甲基)丙烯酸酯、2-(2-苯氧基乙氧基)乙基丙烯酸酯、2-(2-苯氧基乙氧基)乙基(甲基)丙烯酸酯、2-(苯氧基甲氧基)乙基丙烯酸酯、2-(苯氧基甲氧基)乙基(甲基)丙烯酸酯、2-(([1,1`-联苯]-4-基氧基)甲氧基)乙基丙烯酸酯、2-(([1,1`-联苯]-4-基氧基)甲氧基)乙基(甲基)丙烯酸酯、2-((萘-2-基氧基)甲氧基)乙基丙烯酸酯、2-((萘-2-基氧基)甲氧基)乙基(甲基)丙烯酸酯、2-((苯硫基)甲氧基)乙基丙烯酸酯、2-((苯硫基)甲氧基)乙基(甲基)丙烯酸酯、2-((萘-2-基硫代)甲氧基)乙基丙烯酸酯、2-((萘-2-基硫代)甲氧基)乙基(甲基)丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)二丙烯酸酯、3,3`-(4,4`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(4,1-亚苯基))双(氧基)双(丙烷-3,1-二基)双(2-丙烯酸甲酯)、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)二丙烯酸酯、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)双(2-丙烯酸甲酯)、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)二丙烯酸酯、2,2`-(2,2`-(4,4`-(9H-芴-9,9-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,-1二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'- (4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-硫代双(4,1-亚苯基)二(氧基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(3,3'-(4,4'-氧基双(4,1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(3,3'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(丙烷-3,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(氧基)双(乙烷-2,1二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-(丙烷-2,2-二基)双(4,1-亚苯基))双(硫代二基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-氧基双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(氧基))双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、2,2'-(2,2'-(2,2'-(4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)二丙烯酸酯、2,2'-(2,2'-(2,2'- (4,4'-硫代双(4,1-亚苯基)双(硫代二基))双(乙烷-2,1-二基)双(氧基)双(乙烷-2,1-二基))双(氧基)双(乙烷-2,1-二基)双(2-丙烯酸甲酯)、聚酯纤维氨基甲酸乙脂二丙烯酸酯、三丙二醇二丙烯酸酯、氨基甲酸乙脂丙烯酸酯、环氧树脂丙烯酸酯、苯硫基乙基(甲基)丙烯酸酯、异莰基丙烯酸酯、苯氧基乙基(甲基)丙烯酸、苯氧基-2-甲基-乙基(甲基)丙烯酸、苯氧基乙氧基乙基(甲基)丙烯酸、苯氧基苯基丙烯酸、3-苯氧基-2-羟基丙基(甲基)丙烯酸酯、2-1-萘氧基乙基(甲基)丙烯酸、2-2-萘氧基乙基(甲基)丙烯酸、2-1-萘硫代乙基(甲基)丙烯酸、2-2-萘硫代乙基(甲基)丙烯酸、三丙烯酸三羟甲基丙酯、1,12-十二烷二醇二甲基丙烯酸酯、1,6-己二醇二丙烯酸酯、及1,10-癸二醇二丙烯酸酯中的一种或多种。
- 根据权利要求2或3所述的组合物,其特征在于,所述C组分为光聚合引发剂和/或自由基聚合引发剂;所述光聚合引发剂为乙酰苯化合物、二苯甲酮化合物、噻吨酮化合物、安息香类化合物、三嗪类化合物、咔唑类化合物、二酮类化合物、锍硼酸类化合物、重氮盐类化合物、咪唑类化合物、及非咪唑类化合物中的一种或者多种;所述自由基聚合引发剂过氧化物类化合物、及双偶氮类化合物中的一种或多种。
- 一种封装薄膜,其特征在于,是将相同或独立的有机层与无机层叠层1次以上涂布形成的薄膜层;所述有机层为权利要求2或3所述的组合物;所述无机层为氮化硅、氮氧化硅、氧化硅、氧化铝、氧化锆、氧化钛、氧化锌中的一个或两个以上形成的。
- 根据权利要求6所述的封装薄膜,其特征在于,所述封装薄膜是吸湿度在9*10 -2g/m 2·天以下的薄膜层。
- 根据权利要求6所述的封装薄膜,其特征在于,所述封装薄膜的无机层被布置在所述有机层的一个或者两个表面上。
- 一种封装有权利要求6-8中任意一项所述的封装薄膜的有机发光器件。
- 一种有机发光器件的封装方法,包括以下步骤:将权利要求6-8中任意一项所述的封装薄膜直接涂在有机发光器件上面,或者直接将权利要求6-8中任意一项所述的封装薄膜制成薄膜形态贴在有机发光器件上。
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CN114685551B (zh) * | 2022-03-10 | 2023-12-26 | 吉林奥来德光电材料股份有限公司 | 一种封装薄膜用化合物、组合物及封装薄膜 |
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