JPWO2024209647A5 - - Google Patents

Info

Publication number
JPWO2024209647A5
JPWO2024209647A5 JP2025512340A JP2025512340A JPWO2024209647A5 JP WO2024209647 A5 JPWO2024209647 A5 JP WO2024209647A5 JP 2025512340 A JP2025512340 A JP 2025512340A JP 2025512340 A JP2025512340 A JP 2025512340A JP WO2024209647 A5 JPWO2024209647 A5 JP WO2024209647A5
Authority
JP
Japan
Prior art keywords
photosensitive resin
resin composition
cured product
resin film
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025512340A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024209647A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/014297 external-priority patent/WO2024209647A1/ja
Publication of JPWO2024209647A1 publication Critical patent/JPWO2024209647A1/ja
Publication of JPWO2024209647A5 publication Critical patent/JPWO2024209647A5/ja
Pending legal-status Critical Current

Links

JP2025512340A 2023-04-06 2023-04-06 Pending JPWO2024209647A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/014297 WO2024209647A1 (ja) 2023-04-06 2023-04-06 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、及び電子部品

Publications (2)

Publication Number Publication Date
JPWO2024209647A1 JPWO2024209647A1 (https=) 2024-10-10
JPWO2024209647A5 true JPWO2024209647A5 (https=) 2025-12-04

Family

ID=92971530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025512340A Pending JPWO2024209647A1 (https=) 2023-04-06 2023-04-06

Country Status (4)

Country Link
JP (1) JPWO2024209647A1 (https=)
KR (1) KR20250168197A (https=)
CN (1) CN120858317A (https=)
WO (1) WO2024209647A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5169446B2 (ja) 2008-04-28 2013-03-27 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品
TWI430024B (zh) * 2010-08-05 2014-03-11 旭化成電子材料股份有限公司 A photosensitive resin composition, a method for manufacturing a hardened bump pattern, and a semiconductor device
JP7407518B2 (ja) * 2018-04-27 2024-01-04 旭化成株式会社 ネガ型感光性樹脂組成物及びその製造方法
JP7761418B2 (ja) * 2021-08-04 2025-10-28 旭化成株式会社 感光性樹脂組成物および半導体装置

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