JPWO2023136078A5 - - Google Patents
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- Publication number
- JPWO2023136078A5 JPWO2023136078A5 JP2023573944A JP2023573944A JPWO2023136078A5 JP WO2023136078 A5 JPWO2023136078 A5 JP WO2023136078A5 JP 2023573944 A JP2023573944 A JP 2023573944A JP 2023573944 A JP2023573944 A JP 2023573944A JP WO2023136078 A5 JPWO2023136078 A5 JP WO2023136078A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- semiconductor device
- area
- bonding surface
- electrode terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022004243 | 2022-01-14 | ||
| PCT/JP2022/047329 WO2023136078A1 (ja) | 2022-01-14 | 2022-12-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023136078A1 JPWO2023136078A1 (https=) | 2023-07-20 |
| JPWO2023136078A5 true JPWO2023136078A5 (https=) | 2024-09-25 |
Family
ID=87279019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023573944A Pending JPWO2023136078A1 (https=) | 2022-01-14 | 2022-12-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240363572A1 (https=) |
| JP (1) | JPWO2023136078A1 (https=) |
| CN (1) | CN118541783A (https=) |
| DE (1) | DE112022005983T5 (https=) |
| WO (1) | WO2023136078A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04268739A (ja) * | 1991-02-25 | 1992-09-24 | Matsushita Electron Corp | 半導体装置の製造方法 |
| JP3226703B2 (ja) * | 1994-03-18 | 2001-11-05 | 株式会社日立製作所 | 半導体装置及びその製法 |
| DE19839760A1 (de) * | 1998-09-01 | 2000-03-02 | Bosch Gmbh Robert | Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat sowie Verfahren zur Überprüfung einer derartigen Verbindung |
| JP4078968B2 (ja) * | 2002-12-16 | 2008-04-23 | 株式会社村田製作所 | 表面実装部品の実装構造 |
| JP2007059638A (ja) * | 2005-08-25 | 2007-03-08 | Nec Corp | 半導体装置およびその製造方法 |
| JP7231382B2 (ja) | 2018-11-06 | 2023-03-01 | ローム株式会社 | 半導体装置 |
| US20230090494A1 (en) * | 2020-03-03 | 2023-03-23 | Rohm Co., Ltd. | Semiconductor device |
| CN115398608A (zh) * | 2020-03-26 | 2022-11-25 | 罗姆股份有限公司 | 半导体器件 |
-
2022
- 2022-12-22 CN CN202280088260.1A patent/CN118541783A/zh active Pending
- 2022-12-22 WO PCT/JP2022/047329 patent/WO2023136078A1/ja not_active Ceased
- 2022-12-22 JP JP2023573944A patent/JPWO2023136078A1/ja active Pending
- 2022-12-22 DE DE112022005983.4T patent/DE112022005983T5/de active Pending
-
2024
- 2024-07-12 US US18/771,523 patent/US20240363572A1/en active Pending
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