JPWO2024190271A5 - - Google Patents

Info

Publication number
JPWO2024190271A5
JPWO2024190271A5 JP2025506614A JP2025506614A JPWO2024190271A5 JP WO2024190271 A5 JPWO2024190271 A5 JP WO2024190271A5 JP 2025506614 A JP2025506614 A JP 2025506614A JP 2025506614 A JP2025506614 A JP 2025506614A JP WO2024190271 A5 JPWO2024190271 A5 JP WO2024190271A5
Authority
JP
Japan
Prior art keywords
bonding
dummy
semiconductor elements
semiconductor
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025506614A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024190271A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/005544 external-priority patent/WO2024190271A1/ja
Publication of JPWO2024190271A1 publication Critical patent/JPWO2024190271A1/ja
Publication of JPWO2024190271A5 publication Critical patent/JPWO2024190271A5/ja
Pending legal-status Critical Current

Links

JP2025506614A 2023-03-13 2024-02-16 Pending JPWO2024190271A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023038391 2023-03-13
PCT/JP2024/005544 WO2024190271A1 (ja) 2023-03-13 2024-02-16 半導体デバイス

Publications (2)

Publication Number Publication Date
JPWO2024190271A1 JPWO2024190271A1 (https=) 2024-09-19
JPWO2024190271A5 true JPWO2024190271A5 (https=) 2025-12-02

Family

ID=92755273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025506614A Pending JPWO2024190271A1 (https=) 2023-03-13 2024-02-16

Country Status (4)

Country Link
JP (1) JPWO2024190271A1 (https=)
CN (1) CN120548616A (https=)
TW (1) TW202503921A (https=)
WO (1) WO2024190271A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054637A (ja) * 2009-08-31 2011-03-17 Sony Corp 半導体装置およびその製造方法
CN111883501B (zh) * 2015-05-18 2024-10-18 索尼公司 光检测装置和成像装置
JPWO2022163260A1 (https=) * 2021-01-27 2022-08-04

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