TW202503921A - 半導體裝置 - Google Patents

半導體裝置 Download PDF

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Publication number
TW202503921A
TW202503921A TW113107335A TW113107335A TW202503921A TW 202503921 A TW202503921 A TW 202503921A TW 113107335 A TW113107335 A TW 113107335A TW 113107335 A TW113107335 A TW 113107335A TW 202503921 A TW202503921 A TW 202503921A
Authority
TW
Taiwan
Prior art keywords
bonding
semiconductor
semiconductor element
semiconductor device
contact portion
Prior art date
Application number
TW113107335A
Other languages
English (en)
Chinese (zh)
Inventor
宇佐利裕
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202503921A publication Critical patent/TW202503921A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW113107335A 2023-03-13 2024-03-01 半導體裝置 TW202503921A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023038391 2023-03-13
JP2023-038391 2023-03-13

Publications (1)

Publication Number Publication Date
TW202503921A true TW202503921A (zh) 2025-01-16

Family

ID=92755273

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113107335A TW202503921A (zh) 2023-03-13 2024-03-01 半導體裝置

Country Status (4)

Country Link
JP (1) JPWO2024190271A1 (https=)
CN (1) CN120548616A (https=)
TW (1) TW202503921A (https=)
WO (1) WO2024190271A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054637A (ja) * 2009-08-31 2011-03-17 Sony Corp 半導体装置およびその製造方法
CN111883501B (zh) * 2015-05-18 2024-10-18 索尼公司 光检测装置和成像装置
JPWO2022163260A1 (https=) * 2021-01-27 2022-08-04

Also Published As

Publication number Publication date
WO2024190271A1 (ja) 2024-09-19
CN120548616A (zh) 2025-08-26
JPWO2024190271A1 (https=) 2024-09-19

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