JPWO2024190271A1 - - Google Patents
Info
- Publication number
- JPWO2024190271A1 JPWO2024190271A1 JP2025506614A JP2025506614A JPWO2024190271A1 JP WO2024190271 A1 JPWO2024190271 A1 JP WO2024190271A1 JP 2025506614 A JP2025506614 A JP 2025506614A JP 2025506614 A JP2025506614 A JP 2025506614A JP WO2024190271 A1 JPWO2024190271 A1 JP WO2024190271A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023038391 | 2023-03-13 | ||
| PCT/JP2024/005544 WO2024190271A1 (ja) | 2023-03-13 | 2024-02-16 | 半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024190271A1 true JPWO2024190271A1 (https=) | 2024-09-19 |
| JPWO2024190271A5 JPWO2024190271A5 (https=) | 2025-12-02 |
Family
ID=92755273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025506614A Pending JPWO2024190271A1 (https=) | 2023-03-13 | 2024-02-16 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024190271A1 (https=) |
| CN (1) | CN120548616A (https=) |
| TW (1) | TW202503921A (https=) |
| WO (1) | WO2024190271A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011054637A (ja) * | 2009-08-31 | 2011-03-17 | Sony Corp | 半導体装置およびその製造方法 |
| CN111883501B (zh) * | 2015-05-18 | 2024-10-18 | 索尼公司 | 光检测装置和成像装置 |
| JPWO2022163260A1 (https=) * | 2021-01-27 | 2022-08-04 |
-
2024
- 2024-02-16 CN CN202480007896.8A patent/CN120548616A/zh active Pending
- 2024-02-16 JP JP2025506614A patent/JPWO2024190271A1/ja active Pending
- 2024-02-16 WO PCT/JP2024/005544 patent/WO2024190271A1/ja not_active Ceased
- 2024-03-01 TW TW113107335A patent/TW202503921A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024190271A1 (ja) | 2024-09-19 |
| CN120548616A (zh) | 2025-08-26 |
| TW202503921A (zh) | 2025-01-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250710 |