JPWO2022163260A1 - - Google Patents
Info
- Publication number
- JPWO2022163260A1 JPWO2022163260A1 JP2022578178A JP2022578178A JPWO2022163260A1 JP WO2022163260 A1 JPWO2022163260 A1 JP WO2022163260A1 JP 2022578178 A JP2022578178 A JP 2022578178A JP 2022578178 A JP2022578178 A JP 2022578178A JP WO2022163260 A1 JPWO2022163260 A1 JP WO2022163260A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021011361 | 2021-01-27 | ||
| PCT/JP2021/048168 WO2022163260A1 (ja) | 2021-01-27 | 2021-12-24 | 構造体、異方導電性部材の製造方法、及び保護層形成用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022163260A1 true JPWO2022163260A1 (https=) | 2022-08-04 |
Family
ID=82654422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022578178A Pending JPWO2022163260A1 (https=) | 2021-01-27 | 2021-12-24 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022163260A1 (https=) |
| CN (1) | CN116830391A (https=) |
| TW (1) | TW202239592A (https=) |
| WO (1) | WO2022163260A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021033467A1 (ja) * | 2019-08-16 | 2021-02-25 | 富士フイルム株式会社 | 構造体の製造方法 |
| CN120548616A (zh) * | 2023-03-13 | 2025-08-26 | 富士胶片株式会社 | 半导体器件 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05217786A (ja) * | 1992-02-07 | 1993-08-27 | Nec Kansai Ltd | チップ型電子部品 |
| WO2018026004A1 (ja) * | 2016-08-05 | 2018-02-08 | 三菱瓦斯化学株式会社 | 支持基板、支持基板付積層体及び半導体素子搭載用パッケージ基板の製造方法 |
| WO2019039071A1 (ja) * | 2017-08-25 | 2019-02-28 | 富士フイルム株式会社 | 構造体、構造体の製造方法、積層体および半導体パッケージ |
| WO2020158484A1 (ja) * | 2019-01-30 | 2020-08-06 | 日東電工株式会社 | 粘着シート、粘着層付き光学フィルム、積層体、および画像表示装置 |
-
2021
- 2021-12-24 CN CN202180092075.5A patent/CN116830391A/zh active Pending
- 2021-12-24 WO PCT/JP2021/048168 patent/WO2022163260A1/ja not_active Ceased
- 2021-12-24 JP JP2022578178A patent/JPWO2022163260A1/ja active Pending
-
2022
- 2022-01-14 TW TW111101574A patent/TW202239592A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05217786A (ja) * | 1992-02-07 | 1993-08-27 | Nec Kansai Ltd | チップ型電子部品 |
| WO2018026004A1 (ja) * | 2016-08-05 | 2018-02-08 | 三菱瓦斯化学株式会社 | 支持基板、支持基板付積層体及び半導体素子搭載用パッケージ基板の製造方法 |
| WO2019039071A1 (ja) * | 2017-08-25 | 2019-02-28 | 富士フイルム株式会社 | 構造体、構造体の製造方法、積層体および半導体パッケージ |
| WO2020158484A1 (ja) * | 2019-01-30 | 2020-08-06 | 日東電工株式会社 | 粘着シート、粘着層付き光学フィルム、積層体、および画像表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202239592A (zh) | 2022-10-16 |
| CN116830391A (zh) | 2023-09-29 |
| WO2022163260A1 (ja) | 2022-08-04 |
Similar Documents
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