TW202239592A - 結構體、各向異性導電性構件之製造方法及保護層形成用組成物 - Google Patents
結構體、各向異性導電性構件之製造方法及保護層形成用組成物 Download PDFInfo
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- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
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| JP (1) | JPWO2022163260A1 (https=) |
| CN (1) | CN116830391A (https=) |
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| WO (1) | WO2022163260A1 (https=) |
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| WO2021033467A1 (ja) * | 2019-08-16 | 2021-02-25 | 富士フイルム株式会社 | 構造体の製造方法 |
| CN120548616A (zh) * | 2023-03-13 | 2025-08-26 | 富士胶片株式会社 | 半导体器件 |
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| JPH05217786A (ja) * | 1992-02-07 | 1993-08-27 | Nec Kansai Ltd | チップ型電子部品 |
| KR102396894B1 (ko) * | 2016-08-05 | 2022-05-11 | 미츠비시 가스 가가쿠 가부시키가이샤 | 지지 기판, 지지 기판이 부착된 적층체 및 반도체 소자 탑재용 패키지 기판의 제조 방법 |
| JP6906616B2 (ja) * | 2017-08-25 | 2021-07-21 | 富士フイルム株式会社 | 構造体、構造体の製造方法、積層体および半導体パッケージ |
| WO2020158484A1 (ja) * | 2019-01-30 | 2020-08-06 | 日東電工株式会社 | 粘着シート、粘着層付き光学フィルム、積層体、および画像表示装置 |
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2021
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- 2021-12-24 WO PCT/JP2021/048168 patent/WO2022163260A1/ja not_active Ceased
- 2021-12-24 JP JP2022578178A patent/JPWO2022163260A1/ja active Pending
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| JPWO2022163260A1 (https=) | 2022-08-04 |
| CN116830391A (zh) | 2023-09-29 |
| WO2022163260A1 (ja) | 2022-08-04 |
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