CN120548616A - 半导体器件 - Google Patents

半导体器件

Info

Publication number
CN120548616A
CN120548616A CN202480007896.8A CN202480007896A CN120548616A CN 120548616 A CN120548616 A CN 120548616A CN 202480007896 A CN202480007896 A CN 202480007896A CN 120548616 A CN120548616 A CN 120548616A
Authority
CN
China
Prior art keywords
bonding
semiconductor
semiconductor element
semiconductor device
bonding contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480007896.8A
Other languages
English (en)
Chinese (zh)
Inventor
宇佐利裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN120548616A publication Critical patent/CN120548616A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN202480007896.8A 2023-03-13 2024-02-16 半导体器件 Pending CN120548616A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023038391 2023-03-13
JP2023-038391 2023-03-13
PCT/JP2024/005544 WO2024190271A1 (ja) 2023-03-13 2024-02-16 半導体デバイス

Publications (1)

Publication Number Publication Date
CN120548616A true CN120548616A (zh) 2025-08-26

Family

ID=92755273

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480007896.8A Pending CN120548616A (zh) 2023-03-13 2024-02-16 半导体器件

Country Status (4)

Country Link
JP (1) JPWO2024190271A1 (https=)
CN (1) CN120548616A (https=)
TW (1) TW202503921A (https=)
WO (1) WO2024190271A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054637A (ja) * 2009-08-31 2011-03-17 Sony Corp 半導体装置およびその製造方法
CN111883501B (zh) * 2015-05-18 2024-10-18 索尼公司 光检测装置和成像装置
JPWO2022163260A1 (https=) * 2021-01-27 2022-08-04

Also Published As

Publication number Publication date
WO2024190271A1 (ja) 2024-09-19
TW202503921A (zh) 2025-01-16
JPWO2024190271A1 (https=) 2024-09-19

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