JPWO2023026584A5 - - Google Patents
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- Publication number
- JPWO2023026584A5 JPWO2023026584A5 JP2022545451A JP2022545451A JPWO2023026584A5 JP WO2023026584 A5 JPWO2023026584 A5 JP WO2023026584A5 JP 2022545451 A JP2022545451 A JP 2022545451A JP 2022545451 A JP2022545451 A JP 2022545451A JP WO2023026584 A5 JPWO2023026584 A5 JP WO2023026584A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive
- electronic component
- epoxy resin
- dicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 17
- 230000001070 adhesive effect Effects 0.000 claims 17
- 239000012790 adhesive layer Substances 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 238000002834 transmittance Methods 0.000 claims 2
- 239000003086 colorant Substances 0.000 claims 1
- 230000001186 cumulative effect Effects 0.000 claims 1
- 238000009826 distribution Methods 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 239000005001 laminate film Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000013034 phenoxy resin Substances 0.000 claims 1
- 229920006287 phenoxy resin Polymers 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021135624 | 2021-08-23 | ||
| JP2021135624 | 2021-08-23 | ||
| PCT/JP2022/017919 WO2023026584A1 (ja) | 2021-08-23 | 2022-04-15 | フィルム状接着剤、これを用いた電子部品及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023026584A1 JPWO2023026584A1 (https=) | 2023-03-02 |
| JP7269446B1 JP7269446B1 (ja) | 2023-05-08 |
| JPWO2023026584A5 true JPWO2023026584A5 (https=) | 2023-08-01 |
Family
ID=85322672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022545451A Active JP7269446B1 (ja) | 2021-08-23 | 2022-04-15 | フィルム状接着剤、これを用いた電子部品及びその製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20240141216A1 (https=) |
| EP (1) | EP4394861A4 (https=) |
| JP (1) | JP7269446B1 (https=) |
| KR (1) | KR102705562B1 (https=) |
| CN (1) | CN117321159A (https=) |
| MY (1) | MY209332A (https=) |
| PH (1) | PH12023553257A1 (https=) |
| TW (1) | TW202309127A (https=) |
| WO (1) | WO2023026584A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024225161A1 (https=) | 2023-04-28 | 2024-10-31 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4411876B2 (ja) * | 2003-06-23 | 2010-02-10 | 東レ株式会社 | 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム |
| JP2005053940A (ja) * | 2003-08-01 | 2005-03-03 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム |
| JP4665414B2 (ja) * | 2004-03-24 | 2011-04-06 | 東レ株式会社 | 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム |
| WO2008114696A1 (ja) * | 2007-03-16 | 2008-09-25 | Hitachi Chemical Company, Ltd. | 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置 |
| JP5253315B2 (ja) * | 2009-07-27 | 2013-07-31 | 大成プラス株式会社 | 溶剤型エポキシ接着剤及び接着方法 |
| JP6045773B2 (ja) | 2009-11-26 | 2016-12-14 | 日立化成株式会社 | 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置 |
| CN105934491B (zh) * | 2014-01-29 | 2018-04-24 | 日立化成株式会社 | 粘接剂组合物、使用了粘接剂组合物的半导体装置的制造方法、以及固体摄像元件 |
| JP5901715B1 (ja) * | 2014-09-05 | 2016-04-13 | 古河電気工業株式会社 | フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法 |
| CN107406742B (zh) | 2016-03-15 | 2020-12-29 | 古河电气工业株式会社 | 膜状接合剂用组合物、膜状接合剂及制造方法、使用膜状接合剂的半导体封装及制造方法 |
| JP7038565B2 (ja) * | 2018-02-23 | 2022-03-18 | 旭化成株式会社 | 熱硬化性エポキシ樹脂組成物、接着剤、エポキシ樹脂硬化物、塩、及び硬化剤 |
| JP7074033B2 (ja) * | 2018-11-22 | 2022-05-24 | 三菱ケミカル株式会社 | 粘接着剤層、粘接着シート及び積層体 |
| JP7269095B2 (ja) * | 2019-05-29 | 2023-05-08 | 古河電気工業株式会社 | ガラス加工用テープ |
| JP2021135624A (ja) | 2020-02-26 | 2021-09-13 | 久知 竹内 | 徒歩移動交通安全見守り |
| KR102734913B1 (ko) * | 2020-09-29 | 2024-11-28 | 후루카와 덴키 고교 가부시키가이샤 | 투명 접착제용 조성물 및 필름형 투명 접착제와, 투명 접착제 경화층 딸린 부재의 제조 방법, 전자 부품 및 그 제조 방법 |
-
2022
- 2022-04-15 CN CN202280035301.0A patent/CN117321159A/zh active Pending
- 2022-04-15 KR KR1020237038614A patent/KR102705562B1/ko active Active
- 2022-04-15 WO PCT/JP2022/017919 patent/WO2023026584A1/ja not_active Ceased
- 2022-04-15 EP EP22860881.6A patent/EP4394861A4/en active Pending
- 2022-04-15 JP JP2022545451A patent/JP7269446B1/ja active Active
- 2022-04-15 MY MYPI2023007734A patent/MY209332A/en unknown
- 2022-04-15 PH PH1/2023/553257A patent/PH12023553257A1/en unknown
- 2022-04-20 TW TW111115030A patent/TW202309127A/zh unknown
-
2023
- 2023-12-12 US US18/537,276 patent/US20240141216A1/en active Pending
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