JPWO2024225161A5 - - Google Patents

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Publication number
JPWO2024225161A5
JPWO2024225161A5 JP2024548474A JP2024548474A JPWO2024225161A5 JP WO2024225161 A5 JPWO2024225161 A5 JP WO2024225161A5 JP 2024548474 A JP2024548474 A JP 2024548474A JP 2024548474 A JP2024548474 A JP 2024548474A JP WO2024225161 A5 JPWO2024225161 A5 JP WO2024225161A5
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JP
Japan
Prior art keywords
film
adhesive
dicing
electronic component
adhesive layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024548474A
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English (en)
Japanese (ja)
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JPWO2024225161A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/015428 external-priority patent/WO2024225161A1/ja
Publication of JPWO2024225161A1 publication Critical patent/JPWO2024225161A1/ja
Publication of JPWO2024225161A5 publication Critical patent/JPWO2024225161A5/ja
Pending legal-status Critical Current

Links

JP2024548474A 2023-04-28 2024-04-18 Pending JPWO2024225161A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023074875 2023-04-28
PCT/JP2024/015428 WO2024225161A1 (ja) 2023-04-28 2024-04-18 ダイシングフィルム付きフィルム状接着剤、これを用いた電子部品及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024225161A1 JPWO2024225161A1 (https=) 2024-10-31
JPWO2024225161A5 true JPWO2024225161A5 (https=) 2026-01-29

Family

ID=93256630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024548474A Pending JPWO2024225161A1 (https=) 2023-04-28 2024-04-18

Country Status (5)

Country Link
JP (1) JPWO2024225161A1 (https=)
KR (1) KR20250033137A (https=)
CN (1) CN119234295A (https=)
TW (1) TW202442841A (https=)
WO (1) WO2024225161A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5493460B2 (ja) * 2008-08-20 2014-05-14 日立化成株式会社 半導体装置の製造方法及びダイシングテープ一体型接着シート
CN105047597B (zh) * 2009-06-15 2018-04-03 日东电工株式会社 半导体背面用切割带集成膜
JP2011187571A (ja) * 2010-03-05 2011-09-22 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP4976532B2 (ja) * 2010-09-06 2012-07-18 日東電工株式会社 半導体装置用フィルム
JP5976326B2 (ja) * 2012-01-25 2016-08-23 日東電工株式会社 半導体装置の製造方法、及び、当該半導体装置の製造方法に用いられる接着フィルム
JP7269095B2 (ja) * 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
CN117321159A (zh) 2021-08-23 2023-12-29 古河电气工业株式会社 膜状粘接剂、使用其的电子部件及其制造方法

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