JPWO2023145610A5 - - Google Patents
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- Publication number
- JPWO2023145610A5 JPWO2023145610A5 JP2023536015A JP2023536015A JPWO2023145610A5 JP WO2023145610 A5 JPWO2023145610 A5 JP WO2023145610A5 JP 2023536015 A JP2023536015 A JP 2023536015A JP 2023536015 A JP2023536015 A JP 2023536015A JP WO2023145610 A5 JPWO2023145610 A5 JP WO2023145610A5
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- semiconductor chip
- curable resin
- forming surface
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 29
- 229920005989 resin Polymers 0.000 claims 27
- 239000011347 resin Substances 0.000 claims 27
- 238000004519 manufacturing process Methods 0.000 claims 9
- 230000001681 protective effect Effects 0.000 claims 6
- 239000002131 composite material Substances 0.000 claims 4
- 238000001723 curing Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 239000000049 pigment Substances 0.000 claims 2
- 239000005038 ethylene vinyl acetate Substances 0.000 claims 1
- 238000013007 heat curing Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022012254 | 2022-01-28 | ||
| JP2022012257 | 2022-01-28 | ||
| JP2022012254 | 2022-01-28 | ||
| JP2022012257 | 2022-01-28 | ||
| PCT/JP2023/001566 WO2023145610A1 (ja) | 2022-01-28 | 2023-01-19 | 硬化性樹脂フィルム、複合シート、半導体チップ、及び半導体チップの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023145610A1 JPWO2023145610A1 (https=) | 2023-08-03 |
| JP7378678B1 JP7378678B1 (ja) | 2023-11-13 |
| JPWO2023145610A5 true JPWO2023145610A5 (https=) | 2023-12-27 |
Family
ID=87471817
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023576841A Pending JPWO2023145589A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023576840A Pending JPWO2023145588A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023576842A Pending JPWO2023145590A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023536015A Active JP7378678B1 (ja) | 2022-01-28 | 2023-01-19 | 硬化性樹脂フィルム、複合シート、半導体チップ、及び半導体チップの製造方法 |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023576841A Pending JPWO2023145589A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023576840A Pending JPWO2023145588A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023576842A Pending JPWO2023145590A1 (https=) | 2022-01-28 | 2023-01-19 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250112101A1 (https=) |
| JP (4) | JPWO2023145589A1 (https=) |
| KR (3) | KR20240144904A (https=) |
| TW (4) | TW202337979A (https=) |
| WO (4) | WO2023145589A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025052540A1 (ja) * | 2023-09-05 | 2025-03-13 | 株式会社レゾナック | 半導体装置の製造方法、及びフィルム状接着剤 |
| JP7616470B1 (ja) | 2024-09-20 | 2025-01-17 | ａｒｔｉｅｎｃｅ株式会社 | 電磁波シールドシート、シールド加工ウエハ、半導体装置およびその製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004221169A (ja) * | 2003-01-10 | 2004-08-05 | Hitachi Chem Co Ltd | 半導体素子保護材、及び半導体装置 |
| JP4812525B2 (ja) * | 2006-06-12 | 2011-11-09 | パナソニック株式会社 | 半導体装置および半導体装置の実装体および半導体装置の製造方法 |
| JP5830250B2 (ja) | 2011-02-15 | 2015-12-09 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP2013234305A (ja) * | 2012-05-11 | 2013-11-21 | Panasonic Corp | 半導体封止用エポキシ樹脂組成物および半導体装置 |
| JP5961055B2 (ja) * | 2012-07-05 | 2016-08-02 | 日東電工株式会社 | 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ |
| KR20150135284A (ko) * | 2013-03-22 | 2015-12-02 | 린텍 가부시키가이샤 | 보호막 형성용 필름 및 보호막 형성용 복합 시트 |
| JP2015092594A (ja) | 2014-12-10 | 2015-05-14 | 日東電工株式会社 | 保護層形成用フィルム |
| JP2017183635A (ja) * | 2016-03-31 | 2017-10-05 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、集積基板、及び、電子機器 |
| JP6746224B2 (ja) * | 2016-11-18 | 2020-08-26 | 株式会社ディスコ | デバイスチップパッケージの製造方法 |
| US12173157B2 (en) * | 2018-12-27 | 2024-12-24 | Dow Toray Co., Ltd. | Curable silicone composition, cured product thereof, and method for producing same |
| JP7399694B2 (ja) * | 2019-12-02 | 2023-12-18 | 日泉化学株式会社 | 成形シート |
| JP7176072B2 (ja) * | 2019-12-27 | 2022-11-21 | リンテック株式会社 | キット及び半導体チップの製造方法 |
| JP2021141261A (ja) * | 2020-03-06 | 2021-09-16 | 太陽ホールディングス株式会社 | 電子素子封止用フィルム、それを用いた電子部品、および電子部品の製造方法 |
-
2023
- 2023-01-19 US US18/832,340 patent/US20250112101A1/en active Pending
- 2023-01-19 KR KR1020247024878A patent/KR20240144904A/ko active Pending
- 2023-01-19 JP JP2023576841A patent/JPWO2023145589A1/ja active Pending
- 2023-01-19 JP JP2023576840A patent/JPWO2023145588A1/ja active Pending
- 2023-01-19 JP JP2023576842A patent/JPWO2023145590A1/ja active Pending
- 2023-01-19 KR KR1020247024880A patent/KR20240141740A/ko active Pending
- 2023-01-19 KR KR1020247024879A patent/KR20240144905A/ko active Pending
- 2023-01-19 WO PCT/JP2023/001453 patent/WO2023145589A1/ja not_active Ceased
- 2023-01-19 JP JP2023536015A patent/JP7378678B1/ja active Active
- 2023-01-19 WO PCT/JP2023/001455 patent/WO2023145590A1/ja not_active Ceased
- 2023-01-19 WO PCT/JP2023/001451 patent/WO2023145588A1/ja not_active Ceased
- 2023-01-19 WO PCT/JP2023/001566 patent/WO2023145610A1/ja not_active Ceased
- 2023-01-30 TW TW112102940A patent/TW202337979A/zh unknown
- 2023-01-30 TW TW112102942A patent/TW202337980A/zh unknown
- 2023-01-30 TW TW112102943A patent/TW202337981A/zh unknown
- 2023-01-30 TW TW112102941A patent/TW202407005A/zh unknown
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