JPWO2023228940A5 - - Google Patents
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- Publication number
- JPWO2023228940A5 JPWO2023228940A5 JP2024523305A JP2024523305A JPWO2023228940A5 JP WO2023228940 A5 JPWO2023228940 A5 JP WO2023228940A5 JP 2024523305 A JP2024523305 A JP 2024523305A JP 2024523305 A JP2024523305 A JP 2024523305A JP WO2023228940 A5 JPWO2023228940 A5 JP WO2023228940A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- organic insulating
- protrusion amount
- electrode
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 54
- 239000000758 substrate Substances 0.000 claims 31
- 238000010438 heat treatment Methods 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 14
- 238000000034 method Methods 0.000 claims 14
- 239000000463 material Substances 0.000 claims 7
- 238000005498 polishing Methods 0.000 claims 6
- 229920002577 polybenzoxazole Polymers 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims 2
- 230000006835 compression Effects 0.000 claims 2
- 238000007906 compression Methods 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 230000003746 surface roughness Effects 0.000 claims 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- 239000004962 Polyamide-imide Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 229920002312 polyamide-imide Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/021410 WO2023228321A1 (ja) | 2022-05-25 | 2022-05-25 | 半導体装置の製造方法 |
| PCT/JP2023/019135 WO2023228940A1 (ja) | 2022-05-25 | 2023-05-23 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023228940A1 JPWO2023228940A1 (https=) | 2023-11-30 |
| JPWO2023228940A5 true JPWO2023228940A5 (https=) | 2025-04-23 |
Family
ID=88918697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523305A Pending JPWO2023228940A1 (https=) | 2022-05-25 | 2023-05-23 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250336881A1 (https=) |
| JP (1) | JPWO2023228940A1 (https=) |
| CN (1) | CN119110986A (https=) |
| TW (1) | TW202401532A (https=) |
| WO (2) | WO2023228321A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121909226A (zh) * | 2024-08-08 | 2026-04-21 | 株式会社力森诺科 | 混合键合用硬化性树脂组合物及制造电路连接体的方法 |
| WO2026078823A1 (ja) * | 2024-10-09 | 2026-04-16 | 株式会社レゾナック | 半導体装置の製造方法 |
| WO2026078824A1 (ja) * | 2024-10-09 | 2026-04-16 | 株式会社レゾナック | 半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021131080A1 (ja) * | 2019-12-27 | 2021-07-01 | ボンドテック株式会社 | 接合方法、被接合物および接合装置 |
| JP7543712B2 (ja) * | 2020-06-12 | 2024-09-03 | 株式会社レゾナック | 半導体装置の製造方法 |
| WO2022070362A1 (ja) * | 2020-09-30 | 2022-04-07 | 昭和電工マテリアルズ株式会社 | 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置 |
-
2022
- 2022-05-25 WO PCT/JP2022/021410 patent/WO2023228321A1/ja not_active Ceased
-
2023
- 2023-05-23 WO PCT/JP2023/019135 patent/WO2023228940A1/ja not_active Ceased
- 2023-05-23 US US18/861,215 patent/US20250336881A1/en active Pending
- 2023-05-23 CN CN202380037184.6A patent/CN119110986A/zh active Pending
- 2023-05-23 JP JP2024523305A patent/JPWO2023228940A1/ja active Pending
- 2023-05-24 TW TW112119284A patent/TW202401532A/zh unknown
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