JPWO2022244717A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2022244717A5 JPWO2022244717A5 JP2023522647A JP2023522647A JPWO2022244717A5 JP WO2022244717 A5 JPWO2022244717 A5 JP WO2022244717A5 JP 2023522647 A JP2023522647 A JP 2023522647A JP 2023522647 A JP2023522647 A JP 2023522647A JP WO2022244717 A5 JPWO2022244717 A5 JP WO2022244717A5
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- forming
- composition
- substrate
- containing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021082953 | 2021-05-17 | ||
| PCT/JP2022/020338 WO2022244717A1 (ja) | 2021-05-17 | 2022-05-16 | ポリイミド含有部形成用組成物、接合体の製造方法、接合体、デバイスの製造方法、及び、デバイス。 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022244717A1 JPWO2022244717A1 (https=) | 2022-11-24 |
| JPWO2022244717A5 true JPWO2022244717A5 (https=) | 2024-02-19 |
Family
ID=84140477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023522647A Pending JPWO2022244717A1 (https=) | 2021-05-17 | 2022-05-16 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022244717A1 (https=) |
| KR (1) | KR20230171470A (https=) |
| CN (1) | CN117378044A (https=) |
| TW (1) | TW202307090A (https=) |
| WO (1) | WO2022244717A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024202901A1 (https=) * | 2023-03-30 | 2024-10-03 | ||
| JPWO2024219502A1 (https=) * | 2023-04-19 | 2024-10-24 | ||
| WO2026070909A1 (ja) * | 2024-09-27 | 2026-04-02 | 富士フイルム株式会社 | 基材接合用樹脂組成物、積層体の製造方法及び半導体デバイスの製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299505A (ja) * | 2001-03-29 | 2002-10-11 | Nippon Steel Chem Co Ltd | 半導体素子の製造方法 |
| CN102985505B (zh) * | 2010-07-09 | 2014-08-20 | 东丽株式会社 | 感光性粘合剂组合物、感光性粘合剂膜和使用它们的半导体装置 |
| KR102147108B1 (ko) * | 2016-06-02 | 2020-08-25 | 후지필름 가부시키가이샤 | 적층체의 제조 방법, 반도체 소자의 제조 방법 및 적층체 |
-
2022
- 2022-05-12 TW TW111117890A patent/TW202307090A/zh unknown
- 2022-05-16 CN CN202280035809.0A patent/CN117378044A/zh active Pending
- 2022-05-16 WO PCT/JP2022/020338 patent/WO2022244717A1/ja not_active Ceased
- 2022-05-16 JP JP2023522647A patent/JPWO2022244717A1/ja active Pending
- 2022-05-16 KR KR1020237039473A patent/KR20230171470A/ko not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2022244717A5 (https=) | ||
| US10090351B2 (en) | Semiconductor device having gaps within the conductive parts | |
| JP2024501559A5 (https=) | ||
| CN108122823B (zh) | 晶圆键合方法及晶圆键合结构 | |
| JP2023178289A5 (https=) | ||
| CN105280509A (zh) | 一种基于低熔点铜共晶金属的晶圆混合键合方法 | |
| JP2010287710A5 (ja) | 半導体装置の製造方法 | |
| CN105185719A (zh) | 一种锁扣式混合键合方法 | |
| JPWO2023228940A5 (https=) | ||
| JP2009194189A5 (https=) | ||
| CN103730382B (zh) | 一种铜铜键合凸点的制作方法 | |
| JP2015225868A (ja) | 半導体装置の製造方法 | |
| CN103871914B (zh) | 制作层堆叠的方法 | |
| JPS608426Y2 (ja) | 半導体ウエハ−の保持基板 | |
| CN111739869B (zh) | 一种背板及其制作方法、显示装置及其制作方法 | |
| CN115172192B (zh) | 一种多芯粒晶圆级集成的混合键合方法 | |
| JP2025504526A5 (https=) | ||
| JPS61174661A (ja) | 半導体集積回路装置の製造方法 | |
| WO2011148445A1 (ja) | 半導体装置及びその製造方法 | |
| JPH0878622A (ja) | 半導体装置の製造方法 | |
| TW202127972A (zh) | 基板接合 | |
| CN117253779B (zh) | 一种半导体晶片的背面刷胶方法 | |
| CN116313905B (zh) | 避免解键合印记的方法及功率器件的制备方法 | |
| JPH0736471B2 (ja) | 多層基板の接合方法 | |
| JPH01137652A (ja) | 平板接着法 |