JPWO2024202901A1 - - Google Patents
Info
- Publication number
- JPWO2024202901A1 JPWO2024202901A1 JP2025510055A JP2025510055A JPWO2024202901A1 JP WO2024202901 A1 JPWO2024202901 A1 JP WO2024202901A1 JP 2025510055 A JP2025510055 A JP 2025510055A JP 2025510055 A JP2025510055 A JP 2025510055A JP WO2024202901 A1 JPWO2024202901 A1 JP WO2024202901A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
- H10W72/01323—Manufacture or treatment of die-attach connectors using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01371—Cleaning, e.g. oxide removal or de-smearing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023055033 | 2023-03-30 | ||
| PCT/JP2024/007535 WO2024202901A1 (ja) | 2023-03-30 | 2024-02-29 | 接合体の製造方法、処理液および処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024202901A1 true JPWO2024202901A1 (https=) | 2024-10-03 |
Family
ID=92905381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025510055A Pending JPWO2024202901A1 (https=) | 2023-03-30 | 2024-02-29 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024202901A1 (https=) |
| CN (1) | CN120814039A (https=) |
| TW (1) | TW202505653A (https=) |
| WO (1) | WO2024202901A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5803398B2 (ja) * | 2011-08-04 | 2015-11-04 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、及び、電子機器 |
| JP6773884B2 (ja) * | 2017-02-28 | 2020-10-21 | 富士フイルム株式会社 | 半導体デバイス、積層体ならびに半導体デバイスの製造方法および積層体の製造方法 |
| JP7220796B2 (ja) * | 2019-08-16 | 2023-02-10 | 富士フイルム株式会社 | 構造体の製造方法 |
| TW202307090A (zh) * | 2021-05-17 | 2023-02-16 | 日商富士軟片股份有限公司 | 含聚醯亞胺部形成用組成物、接合體之製造方法、接合體、器件之製造方法及器件 |
| JP2023177917A (ja) * | 2022-06-03 | 2023-12-14 | 三井化学株式会社 | 半導体装置およびその製造方法 |
-
2024
- 2024-02-29 JP JP2025510055A patent/JPWO2024202901A1/ja active Pending
- 2024-02-29 CN CN202480014996.3A patent/CN120814039A/zh active Pending
- 2024-02-29 WO PCT/JP2024/007535 patent/WO2024202901A1/ja not_active Ceased
- 2024-03-18 TW TW113109894A patent/TW202505653A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202505653A (zh) | 2025-02-01 |
| WO2024202901A1 (ja) | 2024-10-03 |
| CN120814039A (zh) | 2025-10-17 |
| KR20250137676A (ko) | 2025-09-18 |