JPWO2023228940A1 - - Google Patents
Info
- Publication number
- JPWO2023228940A1 JPWO2023228940A1 JP2024523305A JP2024523305A JPWO2023228940A1 JP WO2023228940 A1 JPWO2023228940 A1 JP WO2023228940A1 JP 2024523305 A JP2024523305 A JP 2024523305A JP 2024523305 A JP2024523305 A JP 2024523305A JP WO2023228940 A1 JPWO2023228940 A1 JP WO2023228940A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
- H10W80/011—Manufacture or treatment of pads or other interconnections to be direct bonded
- H10W80/031—Changing or setting shapes of the pads
- H10W80/037—Changing or setting shapes of the pads by mechanical treatment, e.g. by cutting, pressing or stamping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
- H10W80/301—Bonding techniques, e.g. hybrid bonding
- H10W80/312—Bonding techniques, e.g. hybrid bonding characterised by the direct bonding of electrically conductive pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
- H10W80/301—Bonding techniques, e.g. hybrid bonding
- H10W80/327—Bonding techniques, e.g. hybrid bonding characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
- H10W80/301—Bonding techniques, e.g. hybrid bonding
- H10W80/331—Bonding techniques, e.g. hybrid bonding characterised by the application of energy for connecting
- H10W80/333—Compression bonding
- H10W80/334—Thermocompression bonding
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/021410 WO2023228321A1 (ja) | 2022-05-25 | 2022-05-25 | 半導体装置の製造方法 |
| PCT/JP2023/019135 WO2023228940A1 (ja) | 2022-05-25 | 2023-05-23 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023228940A1 true JPWO2023228940A1 (https=) | 2023-11-30 |
| JPWO2023228940A5 JPWO2023228940A5 (https=) | 2025-04-23 |
Family
ID=88918697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523305A Pending JPWO2023228940A1 (https=) | 2022-05-25 | 2023-05-23 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250336881A1 (https=) |
| JP (1) | JPWO2023228940A1 (https=) |
| CN (1) | CN119110986A (https=) |
| TW (1) | TW202401532A (https=) |
| WO (2) | WO2023228321A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121909226A (zh) * | 2024-08-08 | 2026-04-21 | 株式会社力森诺科 | 混合键合用硬化性树脂组合物及制造电路连接体的方法 |
| WO2026078823A1 (ja) * | 2024-10-09 | 2026-04-16 | 株式会社レゾナック | 半導体装置の製造方法 |
| WO2026078824A1 (ja) * | 2024-10-09 | 2026-04-16 | 株式会社レゾナック | 半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021131080A1 (ja) * | 2019-12-27 | 2021-07-01 | ボンドテック株式会社 | 接合方法、被接合物および接合装置 |
| JP7543712B2 (ja) * | 2020-06-12 | 2024-09-03 | 株式会社レゾナック | 半導体装置の製造方法 |
| WO2022070362A1 (ja) * | 2020-09-30 | 2022-04-07 | 昭和電工マテリアルズ株式会社 | 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置 |
-
2022
- 2022-05-25 WO PCT/JP2022/021410 patent/WO2023228321A1/ja not_active Ceased
-
2023
- 2023-05-23 WO PCT/JP2023/019135 patent/WO2023228940A1/ja not_active Ceased
- 2023-05-23 US US18/861,215 patent/US20250336881A1/en active Pending
- 2023-05-23 CN CN202380037184.6A patent/CN119110986A/zh active Pending
- 2023-05-23 JP JP2024523305A patent/JPWO2023228940A1/ja active Pending
- 2023-05-24 TW TW112119284A patent/TW202401532A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN119110986A (zh) | 2024-12-10 |
| WO2023228321A1 (ja) | 2023-11-30 |
| US20250336881A1 (en) | 2025-10-30 |
| TW202401532A (zh) | 2024-01-01 |
| WO2023228940A1 (ja) | 2023-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250415 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260402 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20260402 |