JPWO2023145590A1 - - Google Patents
Info
- Publication number
- JPWO2023145590A1 JPWO2023145590A1 JP2023576842A JP2023576842A JPWO2023145590A1 JP WO2023145590 A1 JPWO2023145590 A1 JP WO2023145590A1 JP 2023576842 A JP2023576842 A JP 2023576842A JP 2023576842 A JP2023576842 A JP 2023576842A JP WO2023145590 A1 JPWO2023145590 A1 JP WO2023145590A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
- H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/014—Manufacture or treatment using batch processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
- H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022012254 | 2022-01-28 | ||
| JP2022012257 | 2022-01-28 | ||
| PCT/JP2023/001455 WO2023145590A1 (ja) | 2022-01-28 | 2023-01-19 | 熱硬化性樹脂フィルム、複合シート、半導体チップ、及び半導体チップの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023145590A1 true JPWO2023145590A1 (https=) | 2023-08-03 |
Family
ID=87471817
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023576841A Pending JPWO2023145589A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023576840A Pending JPWO2023145588A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023576842A Pending JPWO2023145590A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023536015A Active JP7378678B1 (ja) | 2022-01-28 | 2023-01-19 | 硬化性樹脂フィルム、複合シート、半導体チップ、及び半導体チップの製造方法 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023576841A Pending JPWO2023145589A1 (https=) | 2022-01-28 | 2023-01-19 | |
| JP2023576840A Pending JPWO2023145588A1 (https=) | 2022-01-28 | 2023-01-19 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023536015A Active JP7378678B1 (ja) | 2022-01-28 | 2023-01-19 | 硬化性樹脂フィルム、複合シート、半導体チップ、及び半導体チップの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250112101A1 (https=) |
| JP (4) | JPWO2023145589A1 (https=) |
| KR (3) | KR20240144904A (https=) |
| TW (4) | TW202337979A (https=) |
| WO (4) | WO2023145589A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025052540A1 (ja) * | 2023-09-05 | 2025-03-13 | 株式会社レゾナック | 半導体装置の製造方法、及びフィルム状接着剤 |
| JP7616470B1 (ja) | 2024-09-20 | 2025-01-17 | ａｒｔｉｅｎｃｅ株式会社 | 電磁波シールドシート、シールド加工ウエハ、半導体装置およびその製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004221169A (ja) * | 2003-01-10 | 2004-08-05 | Hitachi Chem Co Ltd | 半導体素子保護材、及び半導体装置 |
| JP4812525B2 (ja) * | 2006-06-12 | 2011-11-09 | パナソニック株式会社 | 半導体装置および半導体装置の実装体および半導体装置の製造方法 |
| JP5830250B2 (ja) | 2011-02-15 | 2015-12-09 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP2013234305A (ja) * | 2012-05-11 | 2013-11-21 | Panasonic Corp | 半導体封止用エポキシ樹脂組成物および半導体装置 |
| JP5961055B2 (ja) * | 2012-07-05 | 2016-08-02 | 日東電工株式会社 | 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ |
| KR20150135284A (ko) * | 2013-03-22 | 2015-12-02 | 린텍 가부시키가이샤 | 보호막 형성용 필름 및 보호막 형성용 복합 시트 |
| JP2015092594A (ja) | 2014-12-10 | 2015-05-14 | 日東電工株式会社 | 保護層形成用フィルム |
| JP2017183635A (ja) * | 2016-03-31 | 2017-10-05 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、集積基板、及び、電子機器 |
| JP6746224B2 (ja) * | 2016-11-18 | 2020-08-26 | 株式会社ディスコ | デバイスチップパッケージの製造方法 |
| US12173157B2 (en) * | 2018-12-27 | 2024-12-24 | Dow Toray Co., Ltd. | Curable silicone composition, cured product thereof, and method for producing same |
| JP7399694B2 (ja) * | 2019-12-02 | 2023-12-18 | 日泉化学株式会社 | 成形シート |
| JP7176072B2 (ja) * | 2019-12-27 | 2022-11-21 | リンテック株式会社 | キット及び半導体チップの製造方法 |
| JP2021141261A (ja) * | 2020-03-06 | 2021-09-16 | 太陽ホールディングス株式会社 | 電子素子封止用フィルム、それを用いた電子部品、および電子部品の製造方法 |
-
2023
- 2023-01-19 US US18/832,340 patent/US20250112101A1/en active Pending
- 2023-01-19 KR KR1020247024878A patent/KR20240144904A/ko active Pending
- 2023-01-19 JP JP2023576841A patent/JPWO2023145589A1/ja active Pending
- 2023-01-19 JP JP2023576840A patent/JPWO2023145588A1/ja active Pending
- 2023-01-19 JP JP2023576842A patent/JPWO2023145590A1/ja active Pending
- 2023-01-19 KR KR1020247024880A patent/KR20240141740A/ko active Pending
- 2023-01-19 KR KR1020247024879A patent/KR20240144905A/ko active Pending
- 2023-01-19 WO PCT/JP2023/001453 patent/WO2023145589A1/ja not_active Ceased
- 2023-01-19 JP JP2023536015A patent/JP7378678B1/ja active Active
- 2023-01-19 WO PCT/JP2023/001455 patent/WO2023145590A1/ja not_active Ceased
- 2023-01-19 WO PCT/JP2023/001451 patent/WO2023145588A1/ja not_active Ceased
- 2023-01-19 WO PCT/JP2023/001566 patent/WO2023145610A1/ja not_active Ceased
- 2023-01-30 TW TW112102940A patent/TW202337979A/zh unknown
- 2023-01-30 TW TW112102942A patent/TW202337980A/zh unknown
- 2023-01-30 TW TW112102943A patent/TW202337981A/zh unknown
- 2023-01-30 TW TW112102941A patent/TW202407005A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7378678B1 (ja) | 2023-11-13 |
| WO2023145589A1 (ja) | 2023-08-03 |
| WO2023145610A1 (ja) | 2023-08-03 |
| TW202337981A (zh) | 2023-10-01 |
| KR20240144904A (ko) | 2024-10-04 |
| TW202337979A (zh) | 2023-10-01 |
| WO2023145588A1 (ja) | 2023-08-03 |
| KR20240141740A (ko) | 2024-09-27 |
| US20250112101A1 (en) | 2025-04-03 |
| JPWO2023145589A1 (https=) | 2023-08-03 |
| WO2023145590A1 (ja) | 2023-08-03 |
| JPWO2023145588A1 (https=) | 2023-08-03 |
| KR20240144905A (ko) | 2024-10-04 |
| TW202407005A (zh) | 2024-02-16 |
| TW202337980A (zh) | 2023-10-01 |
| JPWO2023145610A1 (https=) | 2023-08-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251104 |