JP2023110879A5 - - Google Patents
Info
- Publication number
- JP2023110879A5 JP2023110879A5 JP2023006883A JP2023006883A JP2023110879A5 JP 2023110879 A5 JP2023110879 A5 JP 2023110879A5 JP 2023006883 A JP2023006883 A JP 2023006883A JP 2023006883 A JP2023006883 A JP 2023006883A JP 2023110879 A5 JP2023110879 A5 JP 2023110879A5
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- semiconductor chip
- curable resin
- bump
- forming surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022012254 | 2022-01-28 | ||
| JP2022012254 | 2022-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023110879A JP2023110879A (ja) | 2023-08-09 |
| JP2023110879A5 true JP2023110879A5 (https=) | 2025-12-26 |
Family
ID=87394650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023006883A Pending JP2023110879A (ja) | 2022-01-28 | 2023-01-19 | 硬化性樹脂フィルム、複合シート、半導体チップ、及び半導体チップの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2023110879A (https=) |
| KR (1) | KR20230116659A (https=) |
| CN (1) | CN116515237A (https=) |
| TW (1) | TW202342600A (https=) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5830250B2 (ja) | 2011-02-15 | 2015-12-09 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP2015092594A (ja) | 2014-12-10 | 2015-05-14 | 日東電工株式会社 | 保護層形成用フィルム |
-
2022
- 2022-09-16 TW TW111135043A patent/TW202342600A/zh unknown
- 2022-10-21 KR KR1020220136574A patent/KR20230116659A/ko active Pending
-
2023
- 2023-01-19 CN CN202310085287.1A patent/CN116515237A/zh active Pending
- 2023-01-19 JP JP2023006883A patent/JP2023110879A/ja active Pending
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