JPWO2022118929A5 - - Google Patents
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- Publication number
- JPWO2022118929A5 JPWO2022118929A5 JP2022549893A JP2022549893A JPWO2022118929A5 JP WO2022118929 A5 JPWO2022118929 A5 JP WO2022118929A5 JP 2022549893 A JP2022549893 A JP 2022549893A JP 2022549893 A JP2022549893 A JP 2022549893A JP WO2022118929 A5 JPWO2022118929 A5 JP WO2022118929A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- curable adhesive
- manufacturing
- semiconductor device
- semiconductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 45
- 239000012790 adhesive layer Substances 0.000 claims 23
- 238000004519 manufacturing process Methods 0.000 claims 20
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive effect Effects 0.000 claims 6
- 239000003566 sealing material Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 5
- 239000010410 layer Substances 0.000 claims 4
- 239000011521 glass Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 239000008393 encapsulating agent Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000006096 absorbing agent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 238000007790 scraping Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023016963A JP2023056529A (ja) | 2020-12-04 | 2023-02-07 | 半導体装置の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPPCT/JP2020/045335 | 2020-12-04 | ||
| PCT/JP2020/045335 WO2022118479A1 (ja) | 2020-12-04 | 2020-12-04 | 半導体装置の製造方法 |
| PCT/JP2021/044321 WO2022118929A1 (ja) | 2020-12-04 | 2021-12-02 | 半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023016963A Division JP2023056529A (ja) | 2020-12-04 | 2023-02-07 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022118929A1 JPWO2022118929A1 (https=) | 2022-06-09 |
| JPWO2022118929A5 true JPWO2022118929A5 (https=) | 2022-11-16 |
| JP7226664B2 JP7226664B2 (ja) | 2023-02-21 |
Family
ID=81853353
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022549893A Active JP7226664B2 (ja) | 2020-12-04 | 2021-12-02 | 半導体装置の製造方法 |
| JP2023016963A Pending JP2023056529A (ja) | 2020-12-04 | 2023-02-07 | 半導体装置の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023016963A Pending JP2023056529A (ja) | 2020-12-04 | 2023-02-07 | 半導体装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12604756B2 (https=) |
| JP (2) | JP7226664B2 (https=) |
| TW (1) | TW202230484A (https=) |
| WO (2) | WO2022118479A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022118479A1 (ja) | 2020-12-04 | 2022-06-09 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法 |
| US11887862B2 (en) | 2021-09-14 | 2024-01-30 | Deca Technologies Usa, Inc. | Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL |
| WO2024135070A1 (ja) * | 2022-12-20 | 2024-06-27 | デンカ株式会社 | 正極組成物、正極形成用塗液、正極、電池、正極形成用塗液の製造方法、正極の製造方法及び電池の製造方法 |
| US12362322B2 (en) * | 2023-06-22 | 2025-07-15 | Deca Technologies Usa, Inc. | Method of making a fan-out semiconductor assembly with an intermediate carrier |
| JP2025161446A (ja) * | 2024-04-12 | 2025-10-24 | 株式会社レゾナック | 半導体装置形成用積層体及び半導体装置の製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3853247B2 (ja) | 2002-04-16 | 2006-12-06 | 日東電工株式会社 | 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品 |
| JP2006222164A (ja) | 2005-02-08 | 2006-08-24 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2010034217A (ja) | 2008-07-28 | 2010-02-12 | Hitachi Ltd | 有機薄膜トランジスタの製造方法 |
| JP5810957B2 (ja) | 2012-02-17 | 2015-11-11 | 富士通株式会社 | 半導体装置の製造方法及び電子装置の製造方法 |
| JP2017050464A (ja) | 2015-09-03 | 2017-03-09 | 凸版印刷株式会社 | 配線基板積層体、その製造方法及び半導体装置の製造方法 |
| WO2017149810A1 (ja) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
| JP6769132B2 (ja) | 2016-06-22 | 2020-10-14 | 日立化成株式会社 | 半導体装置の製造方法 |
| JP6859729B2 (ja) * | 2016-07-05 | 2021-04-14 | 昭和電工マテリアルズ株式会社 | 仮固定用樹脂組成物、仮固定用樹脂フィルム、仮固定用樹脂フィルムシート及び半導体装置の製造方法 |
| KR102454056B1 (ko) | 2017-03-31 | 2022-10-14 | 린텍 가부시키가이샤 | 반도체 장치의 제조 방법 및 양면 점착 시트 |
| JP2019129179A (ja) * | 2018-01-22 | 2019-08-01 | 日立化成株式会社 | 半導体装置の製造方法 |
| JP2019211218A (ja) | 2018-05-31 | 2019-12-12 | セイコーエプソン株式会社 | 物理量センサー、複合センサー、慣性計測ユニット、移動体測位装置、携帯型電子機器、電子機器、移動体、走行支援システム、表示装置、および物理量センサーの製造方法 |
| US10510713B1 (en) * | 2018-10-28 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semicondcutor package and method of manufacturing the same |
| CN113195668B (zh) | 2018-12-20 | 2023-01-13 | 昭和电工材料株式会社 | 临时固定用树脂组合物、临时固定用树脂膜及临时固定用片、以及半导体装置的制造方法 |
| US11183482B2 (en) * | 2019-09-17 | 2021-11-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Shift control method in manufacture of semiconductor device |
| WO2021058663A1 (en) * | 2019-09-25 | 2021-04-01 | Deepmind Technologies Limited | Augmenting attention-based neural networks to selectively attend to past inputs |
| WO2022118479A1 (ja) | 2020-12-04 | 2022-06-09 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法 |
-
2020
- 2020-12-04 WO PCT/JP2020/045335 patent/WO2022118479A1/ja not_active Ceased
-
2021
- 2021-12-02 US US18/255,382 patent/US12604756B2/en active Active
- 2021-12-02 WO PCT/JP2021/044321 patent/WO2022118929A1/ja not_active Ceased
- 2021-12-02 JP JP2022549893A patent/JP7226664B2/ja active Active
- 2021-12-03 TW TW110145151A patent/TW202230484A/zh unknown
-
2023
- 2023-02-07 JP JP2023016963A patent/JP2023056529A/ja active Pending
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