JPWO2022118925A5 - - Google Patents
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- Publication number
- JPWO2022118925A5 JPWO2022118925A5 JP2022554846A JP2022554846A JPWO2022118925A5 JP WO2022118925 A5 JPWO2022118925 A5 JP WO2022118925A5 JP 2022554846 A JP2022554846 A JP 2022554846A JP 2022554846 A JP2022554846 A JP 2022554846A JP WO2022118925 A5 JPWO2022118925 A5 JP WO2022118925A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- temporary fixing
- carrier
- adhesive layer
- curable adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 90
- 239000012790 adhesive layer Substances 0.000 claims 48
- 239000000463 material Substances 0.000 claims 38
- 238000004519 manufacturing process Methods 0.000 claims 24
- 239000008393 encapsulating agent Substances 0.000 claims 16
- 238000000034 method Methods 0.000 claims 13
- 239000010410 layer Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 10
- 239000000853 adhesive Substances 0.000 claims 7
- 230000001070 adhesive effect Effects 0.000 claims 7
- 239000011521 glass Substances 0.000 claims 6
- 239000003566 sealing material Substances 0.000 claims 5
- 230000001678 irradiating effect Effects 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 238000007790 scraping Methods 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023016965A JP7823602B2 (ja) | 2020-12-04 | 2023-02-07 | 半導体装置の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/045338 WO2022118480A1 (ja) | 2020-12-04 | 2020-12-04 | 半導体装置の製造方法 |
| JPPCT/JP2020/045338 | 2020-12-04 | ||
| PCT/JP2021/044312 WO2022118925A1 (ja) | 2020-12-04 | 2021-12-02 | 半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023016965A Division JP7823602B2 (ja) | 2020-12-04 | 2023-02-07 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022118925A1 JPWO2022118925A1 (https=) | 2022-06-09 |
| JPWO2022118925A5 true JPWO2022118925A5 (https=) | 2022-11-16 |
| JP7226669B2 JP7226669B2 (ja) | 2023-02-21 |
Family
ID=81853340
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022554846A Active JP7226669B2 (ja) | 2020-12-04 | 2021-12-02 | 半導体装置の製造方法 |
| JP2023016965A Active JP7823602B2 (ja) | 2020-12-04 | 2023-02-07 | 半導体装置の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023016965A Active JP7823602B2 (ja) | 2020-12-04 | 2023-02-07 | 半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12593657B2 (https=) |
| JP (2) | JP7226669B2 (https=) |
| WO (2) | WO2022118480A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022118480A1 (ja) | 2020-12-04 | 2022-06-09 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555906B2 (en) * | 2000-12-15 | 2003-04-29 | Intel Corporation | Microelectronic package having a bumpless laminated interconnection layer |
| JP3853247B2 (ja) | 2002-04-16 | 2006-12-06 | 日東電工株式会社 | 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品 |
| US6972964B2 (en) * | 2002-06-27 | 2005-12-06 | Via Technologies Inc. | Module board having embedded chips and components and method of forming the same |
| JP5810957B2 (ja) * | 2012-02-17 | 2015-11-11 | 富士通株式会社 | 半導体装置の製造方法及び電子装置の製造方法 |
| CN203983326U (zh) * | 2014-05-21 | 2014-12-03 | 叶逸仁 | Led光源模块 |
| US9859394B2 (en) * | 2014-12-18 | 2018-01-02 | Agilome, Inc. | Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids |
| JP2017152617A (ja) * | 2016-02-26 | 2017-08-31 | 京セラ株式会社 | 電子部品及び電子部品の製造方法 |
| JP6859729B2 (ja) * | 2016-07-05 | 2021-04-14 | 昭和電工マテリアルズ株式会社 | 仮固定用樹脂組成物、仮固定用樹脂フィルム、仮固定用樹脂フィルムシート及び半導体装置の製造方法 |
| EP3553816A4 (en) | 2016-12-08 | 2020-05-06 | Hitachi Chemical Co., Ltd. | METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT |
| JP2019033124A (ja) * | 2017-08-04 | 2019-02-28 | リンテック株式会社 | 半導体装置の製造方法、及び接着積層体 |
| JP2019129179A (ja) * | 2018-01-22 | 2019-08-01 | 日立化成株式会社 | 半導体装置の製造方法 |
| WO2022118480A1 (ja) | 2020-12-04 | 2022-06-09 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法 |
-
2020
- 2020-12-04 WO PCT/JP2020/045338 patent/WO2022118480A1/ja not_active Ceased
-
2021
- 2021-12-02 JP JP2022554846A patent/JP7226669B2/ja active Active
- 2021-12-02 US US18/255,383 patent/US12593657B2/en active Active
- 2021-12-02 WO PCT/JP2021/044312 patent/WO2022118925A1/ja not_active Ceased
-
2023
- 2023-02-07 JP JP2023016965A patent/JP7823602B2/ja active Active
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