JPWO2023026584A1 - - Google Patents
Info
- Publication number
- JPWO2023026584A1 JPWO2023026584A1 JP2022545451A JP2022545451A JPWO2023026584A1 JP WO2023026584 A1 JPWO2023026584 A1 JP WO2023026584A1 JP 2022545451 A JP2022545451 A JP 2022545451A JP 2022545451 A JP2022545451 A JP 2022545451A JP WO2023026584 A1 JPWO2023026584 A1 JP WO2023026584A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021135624 | 2021-08-23 | ||
| JP2021135624 | 2021-08-23 | ||
| PCT/JP2022/017919 WO2023026584A1 (ja) | 2021-08-23 | 2022-04-15 | フィルム状接着剤、これを用いた電子部品及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023026584A1 true JPWO2023026584A1 (https=) | 2023-03-02 |
| JP7269446B1 JP7269446B1 (ja) | 2023-05-08 |
| JPWO2023026584A5 JPWO2023026584A5 (https=) | 2023-08-01 |
Family
ID=85322672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022545451A Active JP7269446B1 (ja) | 2021-08-23 | 2022-04-15 | フィルム状接着剤、これを用いた電子部品及びその製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20240141216A1 (https=) |
| EP (1) | EP4394861A4 (https=) |
| JP (1) | JP7269446B1 (https=) |
| KR (1) | KR102705562B1 (https=) |
| CN (1) | CN117321159A (https=) |
| MY (1) | MY209332A (https=) |
| PH (1) | PH12023553257A1 (https=) |
| TW (1) | TW202309127A (https=) |
| WO (1) | WO2023026584A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024225161A1 (https=) | 2023-04-28 | 2024-10-31 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4411876B2 (ja) * | 2003-06-23 | 2010-02-10 | 東レ株式会社 | 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム |
| JP2005053940A (ja) * | 2003-08-01 | 2005-03-03 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム |
| JP4665414B2 (ja) * | 2004-03-24 | 2011-04-06 | 東レ株式会社 | 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム |
| WO2008114696A1 (ja) * | 2007-03-16 | 2008-09-25 | Hitachi Chemical Company, Ltd. | 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置 |
| JP5253315B2 (ja) * | 2009-07-27 | 2013-07-31 | 大成プラス株式会社 | 溶剤型エポキシ接着剤及び接着方法 |
| JP6045773B2 (ja) | 2009-11-26 | 2016-12-14 | 日立化成株式会社 | 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置 |
| CN105934491B (zh) * | 2014-01-29 | 2018-04-24 | 日立化成株式会社 | 粘接剂组合物、使用了粘接剂组合物的半导体装置的制造方法、以及固体摄像元件 |
| JP5901715B1 (ja) * | 2014-09-05 | 2016-04-13 | 古河電気工業株式会社 | フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法 |
| CN107406742B (zh) | 2016-03-15 | 2020-12-29 | 古河电气工业株式会社 | 膜状接合剂用组合物、膜状接合剂及制造方法、使用膜状接合剂的半导体封装及制造方法 |
| JP7038565B2 (ja) * | 2018-02-23 | 2022-03-18 | 旭化成株式会社 | 熱硬化性エポキシ樹脂組成物、接着剤、エポキシ樹脂硬化物、塩、及び硬化剤 |
| JP7074033B2 (ja) * | 2018-11-22 | 2022-05-24 | 三菱ケミカル株式会社 | 粘接着剤層、粘接着シート及び積層体 |
| JP7269095B2 (ja) * | 2019-05-29 | 2023-05-08 | 古河電気工業株式会社 | ガラス加工用テープ |
| JP2021135624A (ja) | 2020-02-26 | 2021-09-13 | 久知 竹内 | 徒歩移動交通安全見守り |
| KR102734913B1 (ko) * | 2020-09-29 | 2024-11-28 | 후루카와 덴키 고교 가부시키가이샤 | 투명 접착제용 조성물 및 필름형 투명 접착제와, 투명 접착제 경화층 딸린 부재의 제조 방법, 전자 부품 및 그 제조 방법 |
-
2022
- 2022-04-15 CN CN202280035301.0A patent/CN117321159A/zh active Pending
- 2022-04-15 KR KR1020237038614A patent/KR102705562B1/ko active Active
- 2022-04-15 WO PCT/JP2022/017919 patent/WO2023026584A1/ja not_active Ceased
- 2022-04-15 EP EP22860881.6A patent/EP4394861A4/en active Pending
- 2022-04-15 JP JP2022545451A patent/JP7269446B1/ja active Active
- 2022-04-15 MY MYPI2023007734A patent/MY209332A/en unknown
- 2022-04-15 PH PH1/2023/553257A patent/PH12023553257A1/en unknown
- 2022-04-20 TW TW111115030A patent/TW202309127A/zh unknown
-
2023
- 2023-12-12 US US18/537,276 patent/US20240141216A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7269446B1 (ja) | 2023-05-08 |
| US20240141216A1 (en) | 2024-05-02 |
| EP4394861A4 (en) | 2025-07-16 |
| MY209332A (en) | 2025-07-02 |
| CN117321159A (zh) | 2023-12-29 |
| KR20240025505A (ko) | 2024-02-27 |
| PH12023553257A1 (en) | 2024-03-25 |
| KR102705562B1 (ko) | 2024-09-12 |
| EP4394861A1 (en) | 2024-07-03 |
| WO2023026584A1 (ja) | 2023-03-02 |
| TW202309127A (zh) | 2023-03-01 |
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