KR102705562B1 - 필름형 접착제, 이것을 사용한 전자 부품 및 그 제조 방법 - Google Patents

필름형 접착제, 이것을 사용한 전자 부품 및 그 제조 방법 Download PDF

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Publication number
KR102705562B1
KR102705562B1 KR1020237038614A KR20237038614A KR102705562B1 KR 102705562 B1 KR102705562 B1 KR 102705562B1 KR 1020237038614 A KR1020237038614 A KR 1020237038614A KR 20237038614 A KR20237038614 A KR 20237038614A KR 102705562 B1 KR102705562 B1 KR 102705562B1
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South Korea
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film
type adhesive
epoxy resin
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curing agent
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KR20240025505A (ko
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코유키 사카이
미노루 모리타
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후루카와 덴키 고교 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H01L23/29—
    • H01L23/31—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Epoxy Resins (AREA)
KR1020237038614A 2021-08-23 2022-04-15 필름형 접착제, 이것을 사용한 전자 부품 및 그 제조 방법 Active KR102705562B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021135624 2021-08-23
JPJP-P-2021-135624 2021-08-23
PCT/JP2022/017919 WO2023026584A1 (ja) 2021-08-23 2022-04-15 フィルム状接着剤、これを用いた電子部品及びその製造方法

Publications (2)

Publication Number Publication Date
KR20240025505A KR20240025505A (ko) 2024-02-27
KR102705562B1 true KR102705562B1 (ko) 2024-09-12

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KR1020237038614A Active KR102705562B1 (ko) 2021-08-23 2022-04-15 필름형 접착제, 이것을 사용한 전자 부품 및 그 제조 방법

Country Status (9)

Country Link
US (1) US20240141216A1 (https=)
EP (1) EP4394861A4 (https=)
JP (1) JP7269446B1 (https=)
KR (1) KR102705562B1 (https=)
CN (1) CN117321159A (https=)
MY (1) MY209332A (https=)
PH (1) PH12023553257A1 (https=)
TW (1) TW202309127A (https=)
WO (1) WO2023026584A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024225161A1 (https=) 2023-04-28 2024-10-31

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005272567A (ja) 2004-03-24 2005-10-06 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム
JP2011026457A (ja) 2009-07-27 2011-02-10 Taisei Plas Co Ltd 溶剤型エポキシ接着剤及び接着方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4411876B2 (ja) * 2003-06-23 2010-02-10 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム
JP2005053940A (ja) * 2003-08-01 2005-03-03 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム
WO2008114696A1 (ja) * 2007-03-16 2008-09-25 Hitachi Chemical Company, Ltd. 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置
JP6045773B2 (ja) 2009-11-26 2016-12-14 日立化成株式会社 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
CN105934491B (zh) * 2014-01-29 2018-04-24 日立化成株式会社 粘接剂组合物、使用了粘接剂组合物的半导体装置的制造方法、以及固体摄像元件
JP5901715B1 (ja) * 2014-09-05 2016-04-13 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
CN107406742B (zh) 2016-03-15 2020-12-29 古河电气工业株式会社 膜状接合剂用组合物、膜状接合剂及制造方法、使用膜状接合剂的半导体封装及制造方法
JP7038565B2 (ja) * 2018-02-23 2022-03-18 旭化成株式会社 熱硬化性エポキシ樹脂組成物、接着剤、エポキシ樹脂硬化物、塩、及び硬化剤
JP7074033B2 (ja) * 2018-11-22 2022-05-24 三菱ケミカル株式会社 粘接着剤層、粘接着シート及び積層体
JP7269095B2 (ja) * 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
JP2021135624A (ja) 2020-02-26 2021-09-13 久知 竹内 徒歩移動交通安全見守り
KR102734913B1 (ko) * 2020-09-29 2024-11-28 후루카와 덴키 고교 가부시키가이샤 투명 접착제용 조성물 및 필름형 투명 접착제와, 투명 접착제 경화층 딸린 부재의 제조 방법, 전자 부품 및 그 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005272567A (ja) 2004-03-24 2005-10-06 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム
JP2011026457A (ja) 2009-07-27 2011-02-10 Taisei Plas Co Ltd 溶剤型エポキシ接着剤及び接着方法

Also Published As

Publication number Publication date
JP7269446B1 (ja) 2023-05-08
US20240141216A1 (en) 2024-05-02
EP4394861A4 (en) 2025-07-16
MY209332A (en) 2025-07-02
CN117321159A (zh) 2023-12-29
KR20240025505A (ko) 2024-02-27
PH12023553257A1 (en) 2024-03-25
JPWO2023026584A1 (https=) 2023-03-02
EP4394861A1 (en) 2024-07-03
WO2023026584A1 (ja) 2023-03-02
TW202309127A (zh) 2023-03-01

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