JP2012190924A5 - - Google Patents
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- Publication number
- JP2012190924A5 JP2012190924A5 JP2011051885A JP2011051885A JP2012190924A5 JP 2012190924 A5 JP2012190924 A5 JP 2012190924A5 JP 2011051885 A JP2011051885 A JP 2011051885A JP 2011051885 A JP2011051885 A JP 2011051885A JP 2012190924 A5 JP2012190924 A5 JP 2012190924A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- semiconductor chip
- adhesive
- mounting
- flip chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 10
- 239000012790 adhesive layer Substances 0.000 claims 9
- 239000002313 adhesive film Substances 0.000 claims 5
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000011256 inorganic filler Substances 0.000 claims 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011051885A JP5703073B2 (ja) | 2011-03-09 | 2011-03-09 | フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011051885A JP5703073B2 (ja) | 2011-03-09 | 2011-03-09 | フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012190924A JP2012190924A (ja) | 2012-10-04 |
| JP2012190924A5 true JP2012190924A5 (https=) | 2013-10-31 |
| JP5703073B2 JP5703073B2 (ja) | 2015-04-15 |
Family
ID=47083787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011051885A Active JP5703073B2 (ja) | 2011-03-09 | 2011-03-09 | フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5703073B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201704434RA (en) * | 2014-12-08 | 2017-07-28 | Toray Industries | Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same |
| JP2019178304A (ja) * | 2018-03-30 | 2019-10-17 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| JP6769465B2 (ja) * | 2018-09-27 | 2020-10-14 | 味の素株式会社 | 樹脂組成物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4438973B2 (ja) * | 2000-05-23 | 2010-03-24 | アムコア テクノロジー，インコーポレイテッド | シート状樹脂組成物及びそれを用いた半導体装置の製造方法 |
| JP2007150065A (ja) * | 2005-11-29 | 2007-06-14 | Shin Etsu Chem Co Ltd | ダイシング・ダイボンド用接着テープ |
| JP5436827B2 (ja) * | 2008-03-21 | 2014-03-05 | 日立化成株式会社 | 半導体装置の製造方法 |
| JP5837272B2 (ja) * | 2008-05-21 | 2015-12-24 | 日立化成株式会社 | 半導体製造装置の製造方法 |
| CN102598235B (zh) * | 2009-09-30 | 2014-12-03 | 积水化学工业株式会社 | 半导体接合用粘接剂、半导体接合用粘接膜、半导体芯片的安装方法及半导体装置 |
-
2011
- 2011-03-09 JP JP2011051885A patent/JP5703073B2/ja active Active
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