JP5703073B2 - フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法 - Google Patents

フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法 Download PDF

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Publication number
JP5703073B2
JP5703073B2 JP2011051885A JP2011051885A JP5703073B2 JP 5703073 B2 JP5703073 B2 JP 5703073B2 JP 2011051885 A JP2011051885 A JP 2011051885A JP 2011051885 A JP2011051885 A JP 2011051885A JP 5703073 B2 JP5703073 B2 JP 5703073B2
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adhesive
chip mounting
flip chip
semiconductor chip
adhesive layer
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Japanese (ja)
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JP2012190924A5 (https=
JP2012190924A (ja
Inventor
さやか 脇岡
さやか 脇岡
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2011051885A 2011-03-09 2011-03-09 フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法 Active JP5703073B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011051885A JP5703073B2 (ja) 2011-03-09 2011-03-09 フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法

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Application Number Priority Date Filing Date Title
JP2011051885A JP5703073B2 (ja) 2011-03-09 2011-03-09 フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法

Publications (3)

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JP2012190924A JP2012190924A (ja) 2012-10-04
JP2012190924A5 JP2012190924A5 (https=) 2013-10-31
JP5703073B2 true JP5703073B2 (ja) 2015-04-15

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JP2011051885A Active JP5703073B2 (ja) 2011-03-09 2011-03-09 フリップチップ実装用接着剤、フリップチップ実装用接着フィルム及び半導体チップの実装方法

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201704434RA (en) * 2014-12-08 2017-07-28 Toray Industries Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same
JP2019178304A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6769465B2 (ja) * 2018-09-27 2020-10-14 味の素株式会社 樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4438973B2 (ja) * 2000-05-23 2010-03-24 アムコア テクノロジー，インコーポレイテッド シート状樹脂組成物及びそれを用いた半導体装置の製造方法
JP2007150065A (ja) * 2005-11-29 2007-06-14 Shin Etsu Chem Co Ltd ダイシング・ダイボンド用接着テープ
JP5436827B2 (ja) * 2008-03-21 2014-03-05 日立化成株式会社 半導体装置の製造方法
JP5837272B2 (ja) * 2008-05-21 2015-12-24 日立化成株式会社 半導体製造装置の製造方法
CN102598235B (zh) * 2009-09-30 2014-12-03 积水化学工业株式会社 半导体接合用粘接剂、半导体接合用粘接膜、半导体芯片的安装方法及半导体装置

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JP2012190924A (ja) 2012-10-04

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