JPWO2022260092A5 - - Google Patents
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- Publication number
- JPWO2022260092A5 JPWO2022260092A5 JP2023527901A JP2023527901A JPWO2022260092A5 JP WO2022260092 A5 JPWO2022260092 A5 JP WO2022260092A5 JP 2023527901 A JP2023527901 A JP 2023527901A JP 2023527901 A JP2023527901 A JP 2023527901A JP WO2022260092 A5 JPWO2022260092 A5 JP WO2022260092A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- polymer film
- crystal polymer
- conductor layer
- peak derived
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 30
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 19
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 19
- 239000004020 conductor Substances 0.000 claims 13
- 239000010410 layer Substances 0.000 claims 10
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 238000005481 NMR spectroscopy Methods 0.000 claims 3
- 238000000354 decomposition reaction Methods 0.000 claims 3
- 230000010354 integration Effects 0.000 claims 3
- 238000003475 lamination Methods 0.000 claims 3
- 239000000843 powder Substances 0.000 claims 3
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 claims 2
- 125000001624 naphthyl group Chemical group 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021096549 | 2021-06-09 | ||
| PCT/JP2022/023153 WO2022260092A1 (ja) | 2021-06-09 | 2022-06-08 | 液晶ポリマーフィルム、導体層付き液晶ポリマーフィルム、及び、積層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022260092A1 JPWO2022260092A1 (https=) | 2022-12-15 |
| JPWO2022260092A5 true JPWO2022260092A5 (https=) | 2023-07-20 |
Family
ID=84426093
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023527901A Pending JPWO2022260092A1 (https=) | 2021-06-09 | 2022-06-08 | |
| JP2023527903A Active JP7722451B2 (ja) | 2021-06-09 | 2022-06-08 | 導体層付き樹脂フィルム、積層基板、及び、導体層付き樹脂フィルムの製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023527903A Active JP7722451B2 (ja) | 2021-06-09 | 2022-06-08 | 導体層付き樹脂フィルム、積層基板、及び、導体層付き樹脂フィルムの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US12330392B2 (https=) |
| JP (2) | JPWO2022260092A1 (https=) |
| CN (2) | CN116249617A (https=) |
| WO (2) | WO2022260094A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022260092A1 (https=) * | 2021-06-09 | 2022-12-15 | ||
| WO2023002766A1 (ja) * | 2021-07-20 | 2023-01-26 | 住友電気工業株式会社 | プリント配線板及びプリント配線板の製造方法 |
| JP2024071004A (ja) * | 2022-11-14 | 2024-05-24 | 日東電工株式会社 | 積層体、及び積層体の製造方法 |
| WO2025022820A1 (ja) * | 2023-07-25 | 2025-01-30 | 株式会社村田製作所 | 樹脂積層基板及び樹脂積層基板の製造方法 |
| CN117415514A (zh) * | 2023-11-17 | 2024-01-19 | 江苏奥匠新材料科技有限公司 | 一种助焊膏以及应用所述助焊膏的锡膏 |
| JPWO2025169634A1 (https=) * | 2024-02-07 | 2025-08-14 | ||
| TWI859075B (zh) * | 2024-02-19 | 2024-10-11 | 欣興電子股份有限公司 | 線路板結構 |
| WO2026014245A1 (ja) * | 2024-07-12 | 2026-01-15 | 株式会社村田製作所 | 樹脂シート体、導体層付樹脂シート体及び多層回路基板 |
| WO2026014243A1 (ja) * | 2024-07-12 | 2026-01-15 | 株式会社村田製作所 | 樹脂シート体、導体層付樹脂シート体、多層回路基板及び多層回路基板の製造方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5494858A (en) | 1994-06-07 | 1996-02-27 | Texas Instruments Incorporated | Method for forming porous composites as a low dielectric constant layer with varying porosity distribution electronics applications |
| JP2003008233A (ja) * | 2001-06-19 | 2003-01-10 | Nitto Denko Corp | 多層配線基板 |
| JP2005142473A (ja) * | 2003-11-10 | 2005-06-02 | Semiconductor Leading Edge Technologies Inc | 半導体装置の製造方法 |
| JP4577715B2 (ja) | 2005-01-05 | 2010-11-10 | 株式会社神戸製鋼所 | パターン電極を備えた多孔質誘電体基板の製造方法 |
| CN101223835B (zh) * | 2005-07-27 | 2012-07-04 | 株式会社可乐丽 | 热塑性液晶聚合物薄膜覆盖的线路板的制造方法 |
| JP5154055B2 (ja) | 2006-10-19 | 2013-02-27 | 株式会社プライマテック | 電子回路基板の製造方法 |
| WO2015064437A1 (ja) * | 2013-11-01 | 2015-05-07 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムの製造方法、並びに回路基板及びその製造方法 |
| JP6135825B2 (ja) | 2014-06-02 | 2017-05-31 | 株式会社村田製作所 | 伝送線路部材 |
| CN206332152U (zh) * | 2014-06-02 | 2017-07-14 | 株式会社村田制作所 | 传输线路构件 |
| CN209440968U (zh) * | 2015-12-24 | 2019-09-27 | 株式会社村田制作所 | 树脂片 |
| JP6854124B2 (ja) * | 2016-12-28 | 2021-04-07 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板 |
| CN210840269U (zh) | 2017-02-16 | 2020-06-23 | 株式会社村田制作所 | 多层基板 |
| WO2020013106A1 (ja) * | 2018-07-10 | 2020-01-16 | デンカ株式会社 | 熱可塑性液晶ポリマーフィルム、その製造方法およびフレキシブル銅張積層板 |
| JP7024142B2 (ja) * | 2019-04-23 | 2022-02-22 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法 |
| WO2021059586A1 (ja) * | 2019-09-25 | 2021-04-01 | 富士フイルム株式会社 | 液晶ポリマーフィルム及びその製造方法、フレキシブル銅張積層板、並びにフレキシブルプリント回路基板 |
| TW202229426A (zh) | 2020-09-30 | 2022-08-01 | 日商富士軟片股份有限公司 | 液晶聚合物薄膜、柔性覆銅積層板及液晶聚合物薄膜之製造方法 |
| WO2022071527A1 (ja) * | 2020-09-30 | 2022-04-07 | ダイキン工業株式会社 | フッ素樹脂材料、積層体、チューブおよびチューブの製造方法 |
| JP2022086176A (ja) * | 2020-11-30 | 2022-06-09 | 東レ株式会社 | 液晶性ポリエステル樹脂組成物、積層体、その製造方法および液晶性ポリエステル樹脂フィルム |
| WO2022113591A1 (ja) * | 2020-11-30 | 2022-06-02 | 株式会社村田製作所 | 伝送線路及び電子機器 |
| JPWO2022260092A1 (https=) * | 2021-06-09 | 2022-12-15 |
-
2022
- 2022-06-08 JP JP2023527901A patent/JPWO2022260092A1/ja active Pending
- 2022-06-08 WO PCT/JP2022/023160 patent/WO2022260094A1/ja not_active Ceased
- 2022-06-08 JP JP2023527903A patent/JP7722451B2/ja active Active
- 2022-06-08 CN CN202280006625.1A patent/CN116249617A/zh active Pending
- 2022-06-08 WO PCT/JP2022/023153 patent/WO2022260092A1/ja not_active Ceased
- 2022-06-08 CN CN202280006626.6A patent/CN116323184A/zh active Pending
-
2023
- 2023-03-31 US US18/193,703 patent/US12330392B2/en active Active
- 2023-03-31 US US18/193,696 patent/US12507340B2/en active Active
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