JPWO2025169634A1 - - Google Patents
Info
- Publication number
- JPWO2025169634A1 JPWO2025169634A1 JP2025543846A JP2025543846A JPWO2025169634A1 JP WO2025169634 A1 JPWO2025169634 A1 JP WO2025169634A1 JP 2025543846 A JP2025543846 A JP 2025543846A JP 2025543846 A JP2025543846 A JP 2025543846A JP WO2025169634 A1 JPWO2025169634 A1 JP WO2025169634A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024017336 | 2024-02-07 | ||
| PCT/JP2024/045929 WO2025169634A1 (ja) | 2024-02-07 | 2024-12-25 | フレキシブル多層回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025169634A1 true JPWO2025169634A1 (https=) | 2025-08-14 |
| JPWO2025169634A5 JPWO2025169634A5 (https=) | 2026-01-15 |
Family
ID=96699773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025543846A Pending JPWO2025169634A1 (https=) | 2024-02-07 | 2024-12-25 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025169634A1 (https=) |
| TW (1) | TW202533646A (https=) |
| WO (1) | WO2025169634A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003008233A (ja) * | 2001-06-19 | 2003-01-10 | Nitto Denko Corp | 多層配線基板 |
| WO2016152149A1 (ja) * | 2015-03-23 | 2016-09-29 | タツタ電線株式会社 | 樹脂含浸物、複合材及び銅張積層体の製造方法 |
| JP2021044475A (ja) * | 2019-09-13 | 2021-03-18 | 日東電工株式会社 | 配線回路基板 |
| WO2022124038A1 (ja) * | 2020-12-09 | 2022-06-16 | 株式会社村田製作所 | 回路基板及び電子機器 |
| JP2022182956A (ja) * | 2021-05-28 | 2022-12-08 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| WO2022260094A1 (ja) * | 2021-06-09 | 2022-12-15 | 株式会社村田製作所 | 導体層付き樹脂フィルム、積層基板、及び、導体層付き樹脂フィルムの製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002261453A (ja) * | 2001-02-28 | 2002-09-13 | Kyocera Corp | 多層配線基板 |
| JP4967116B2 (ja) * | 2005-08-23 | 2012-07-04 | 国立大学法人東北大学 | 多層回路基板及び電子機器 |
-
2024
- 2024-12-25 JP JP2025543846A patent/JPWO2025169634A1/ja active Pending
- 2024-12-25 WO PCT/JP2024/045929 patent/WO2025169634A1/ja active Pending
- 2024-12-27 TW TW113151111A patent/TW202533646A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003008233A (ja) * | 2001-06-19 | 2003-01-10 | Nitto Denko Corp | 多層配線基板 |
| WO2016152149A1 (ja) * | 2015-03-23 | 2016-09-29 | タツタ電線株式会社 | 樹脂含浸物、複合材及び銅張積層体の製造方法 |
| JP2021044475A (ja) * | 2019-09-13 | 2021-03-18 | 日東電工株式会社 | 配線回路基板 |
| WO2022124038A1 (ja) * | 2020-12-09 | 2022-06-16 | 株式会社村田製作所 | 回路基板及び電子機器 |
| JP2022182956A (ja) * | 2021-05-28 | 2022-12-08 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| WO2022260094A1 (ja) * | 2021-06-09 | 2022-12-15 | 株式会社村田製作所 | 導体層付き樹脂フィルム、積層基板、及び、導体層付き樹脂フィルムの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025169634A1 (ja) | 2025-08-14 |
| TW202533646A (zh) | 2025-08-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250729 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250729 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20250729 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20251021 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251203 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20260224 |