TW202533646A - 撓性多層電路基板 - Google Patents

撓性多層電路基板

Info

Publication number
TW202533646A
TW202533646A TW113151111A TW113151111A TW202533646A TW 202533646 A TW202533646 A TW 202533646A TW 113151111 A TW113151111 A TW 113151111A TW 113151111 A TW113151111 A TW 113151111A TW 202533646 A TW202533646 A TW 202533646A
Authority
TW
Taiwan
Prior art keywords
insulating layer
porous insulating
layer
porous
circuit board
Prior art date
Application number
TW113151111A
Other languages
English (en)
Chinese (zh)
Inventor
永見直斗
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202533646A publication Critical patent/TW202533646A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW113151111A 2024-02-07 2024-12-27 撓性多層電路基板 TW202533646A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024017336 2024-02-07
JP2024-017336 2024-02-07

Publications (1)

Publication Number Publication Date
TW202533646A true TW202533646A (zh) 2025-08-16

Family

ID=96699773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113151111A TW202533646A (zh) 2024-02-07 2024-12-27 撓性多層電路基板

Country Status (3)

Country Link
JP (1) JPWO2025169634A1 (https=)
TW (1) TW202533646A (https=)
WO (1) WO2025169634A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261453A (ja) * 2001-02-28 2002-09-13 Kyocera Corp 多層配線基板
JP2003008233A (ja) * 2001-06-19 2003-01-10 Nitto Denko Corp 多層配線基板
JP4967116B2 (ja) * 2005-08-23 2012-07-04 国立大学法人東北大学 多層回路基板及び電子機器
HK1244833B (zh) * 2015-03-23 2019-11-29 拓自达电线株式会社 树脂浸渗物、复合材料和覆铜层叠体的制造方法
JP7454929B2 (ja) * 2019-09-13 2024-03-25 日東電工株式会社 配線回路基板の製造方法
CN220021574U (zh) * 2020-12-09 2023-11-14 株式会社村田制作所 电路基板以及电子设备
JP7762044B2 (ja) * 2021-05-28 2025-10-29 日東電工株式会社 配線回路基板およびその製造方法
JPWO2022260092A1 (https=) * 2021-06-09 2022-12-15

Also Published As

Publication number Publication date
WO2025169634A1 (ja) 2025-08-14
JPWO2025169634A1 (https=) 2025-08-14

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