JP2021044475A - 配線回路基板 - Google Patents
配線回路基板 Download PDFInfo
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- JP2021044475A JP2021044475A JP2019166948A JP2019166948A JP2021044475A JP 2021044475 A JP2021044475 A JP 2021044475A JP 2019166948 A JP2019166948 A JP 2019166948A JP 2019166948 A JP2019166948 A JP 2019166948A JP 2021044475 A JP2021044475 A JP 2021044475A
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- 239000011347 resin Substances 0.000 claims abstract description 76
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- 239000010410 layer Substances 0.000 claims description 420
- 239000012790 adhesive layer Substances 0.000 claims description 36
- 238000009413 insulation Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- 229910052802 copper Inorganic materials 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
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- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
本発明の配線回路基板の第1実施形態を、図1を参照して説明する。
この配線回路基板1では、ベース絶縁層2およびカバー絶縁層4が多孔質樹脂層10であるので、高周波信号の伝送効率を向上できる。
以下の各変形例において、上記した第1実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。また、各変形例は、特記する以外、第1実施形態と同様の作用効果を奏することができる。さらに、第1実施形態およびその変形例を適宜組み合わせることができる。
第2実施形態において、上記した第1実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。また、第2実施形態は、特記する以外、第1実施形態と同様の作用効果を奏することができる。さらに、第1実施形態、その変形例および第2実施形態を適宜組み合わせることができる。
この配線回路基板1によれば、多孔質樹脂層10をカバー絶縁層4に設けながら、かかる多孔質樹脂層10を、接着剤層15を介してベース絶縁層2および導体層3に簡単に接着できる。そのため、簡便な方法で、配線回路基板1を得ることができる。
以下の各変形例において、上記した第2実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。また、各変形例は、特記する以外、第2実施形態と同様の作用効果を奏することができる。さらに、第1、第2実施形態およびそれらの変形例を適宜組み合わせることができる。
2 ベース絶縁層2
3 導体層3
4 カバー絶縁層4
5 シールド層5
10 多孔質樹脂層10
15 接着剤層15
Claims (7)
- ベース絶縁層と、
前記ベース絶縁層の厚み方向一方面に配置される導体層と、
前記ベース絶縁層の厚み方向一方面に、前記導体層を被覆するように配置されるカバー絶縁層と、
前記ベース絶縁層の厚み方向他方面および幅方向両側面と、前記カバー絶縁層の厚み方向一方面および幅方向両側面とに配置されるシールド層と
を備え、
前記ベース絶縁層および前記カバー絶縁層の少なくとも一方が、多孔質樹脂層を有することを特徴とする、配線回路基板。 - 前記導体層の厚み方向他方面と前記ベース絶縁層の厚み方向他方面との距離T1に対する、前記導体層の厚み方向一方面と前記カバー絶縁層の厚み方向一方面との距離T2の比(T2/T1)が、0.9以上、1.1以下であることを特徴とする、請求項1に記載の配線回路基板。
- 前記多孔質樹脂層が、独立気泡構造を有することを特徴とする、請求項1または2に記載の配線回路基板。
- 前記多孔質樹脂層の空孔率が、50%以上であることを特徴とする、請求項1〜3のいずれか一項に記載の配線回路基板。
- 前記多孔質樹脂層の材料が、ポリイミド樹脂であることを特徴とする、請求項1〜4のいずれか一項に記載の配線回路基板。
- 前記ベース絶縁層および前記カバー絶縁層が、多孔質樹脂層からなることを特徴とする、請求項1〜5のいずれか一項に記載の配線回路基板。
- 前記ベース絶縁層が、前記多孔質樹脂層からなり、
前記カバー絶縁層は、
前記導体層の厚み方向一方面および幅方向両側面と、前記ベース絶縁層の厚み方向一方面において厚み方向に投影したときに前記導体層に重ならない部分に接触する接着剤層と、
前記接着剤層の厚み方向一方面に接触する前記多孔質樹脂層とを備えることを特徴とする、請求項1〜6のいずれか一項に記載の配線回路基板。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019166948A JP7454929B2 (ja) | 2019-09-13 | 2019-09-13 | 配線回路基板の製造方法 |
US17/641,658 US20220312597A1 (en) | 2019-09-13 | 2020-08-12 | Wired circuit board |
CN202080063404.9A CN114402699A (zh) | 2019-09-13 | 2020-08-12 | 布线电路基板 |
PCT/JP2020/030723 WO2021049242A1 (ja) | 2019-09-13 | 2020-08-12 | 配線回路基板 |
KR1020227007191A KR20220062276A (ko) | 2019-09-13 | 2020-08-12 | 배선 회로 기판 |
EP20862723.2A EP4030473A1 (en) | 2019-09-13 | 2020-08-12 | Wiring circuit board |
TW109128224A TW202114499A (zh) | 2019-09-13 | 2020-08-19 | 配線電路基板 |
JP2024038115A JP2024060046A (ja) | 2019-09-13 | 2024-03-12 | 配線回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019166948A JP7454929B2 (ja) | 2019-09-13 | 2019-09-13 | 配線回路基板の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024038115A Division JP2024060046A (ja) | 2019-09-13 | 2024-03-12 | 配線回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021044475A true JP2021044475A (ja) | 2021-03-18 |
JP7454929B2 JP7454929B2 (ja) | 2024-03-25 |
Family
ID=74861771
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Application Number | Title | Priority Date | Filing Date |
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JP2019166948A Active JP7454929B2 (ja) | 2019-09-13 | 2019-09-13 | 配線回路基板の製造方法 |
JP2024038115A Pending JP2024060046A (ja) | 2019-09-13 | 2024-03-12 | 配線回路基板 |
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JP2024038115A Pending JP2024060046A (ja) | 2019-09-13 | 2024-03-12 | 配線回路基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220312597A1 (ja) |
EP (1) | EP4030473A1 (ja) |
JP (2) | JP7454929B2 (ja) |
KR (1) | KR20220062276A (ja) |
CN (1) | CN114402699A (ja) |
TW (1) | TW202114499A (ja) |
WO (1) | WO2021049242A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022234748A1 (ja) * | 2021-05-07 | 2022-11-10 | 株式会社村田製作所 | アンテナ素子、電子機器及びアンテナ素子の製造方法 |
WO2023002766A1 (ja) * | 2021-07-20 | 2023-01-26 | 住友電気工業株式会社 | プリント配線板及びプリント配線板の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6255992A (ja) * | 1985-09-05 | 1987-03-11 | 住友電気工業株式会社 | シ−ルド付可撓性プリント回路基板 |
JP2002118339A (ja) * | 2000-10-05 | 2002-04-19 | Sony Chem Corp | 配線基板及び配線基板製造方法 |
JP2003201362A (ja) * | 2002-01-09 | 2003-07-18 | Hitachi Ltd | 多孔質ポリイミドフィルムおよび多孔質ポリイミド回路基板 |
WO2004060660A1 (ja) * | 2002-12-27 | 2004-07-22 | Nec Corporation | シート材及び配線板 |
JP2009146694A (ja) * | 2007-12-13 | 2009-07-02 | Sumitomo Electric Ind Ltd | シールドフラットケーブル |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4200908B2 (ja) | 2004-01-27 | 2008-12-24 | 日立電線株式会社 | シールド被覆フレキシブルフラットケーブル及びその製造方法 |
JP5946709B2 (ja) | 2012-07-17 | 2016-07-06 | 矢崎総業株式会社 | 高周波電力伝送用同軸ケーブル |
JP2015100045A (ja) | 2013-11-19 | 2015-05-28 | キヤノン・コンポーネンツ株式会社 | シールドケーブル、その製造方法およびアンテナ部一体シールドケーブル |
US20200032026A1 (en) | 2017-04-06 | 2020-01-30 | Nitto Denko Corporation | Film for millimeter-wave antenna |
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2019
- 2019-09-13 JP JP2019166948A patent/JP7454929B2/ja active Active
-
2020
- 2020-08-12 WO PCT/JP2020/030723 patent/WO2021049242A1/ja unknown
- 2020-08-12 CN CN202080063404.9A patent/CN114402699A/zh active Pending
- 2020-08-12 EP EP20862723.2A patent/EP4030473A1/en not_active Withdrawn
- 2020-08-12 US US17/641,658 patent/US20220312597A1/en not_active Abandoned
- 2020-08-12 KR KR1020227007191A patent/KR20220062276A/ko unknown
- 2020-08-19 TW TW109128224A patent/TW202114499A/zh unknown
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2024
- 2024-03-12 JP JP2024038115A patent/JP2024060046A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6255992A (ja) * | 1985-09-05 | 1987-03-11 | 住友電気工業株式会社 | シ−ルド付可撓性プリント回路基板 |
JP2002118339A (ja) * | 2000-10-05 | 2002-04-19 | Sony Chem Corp | 配線基板及び配線基板製造方法 |
JP2003201362A (ja) * | 2002-01-09 | 2003-07-18 | Hitachi Ltd | 多孔質ポリイミドフィルムおよび多孔質ポリイミド回路基板 |
WO2004060660A1 (ja) * | 2002-12-27 | 2004-07-22 | Nec Corporation | シート材及び配線板 |
JP2009146694A (ja) * | 2007-12-13 | 2009-07-02 | Sumitomo Electric Ind Ltd | シールドフラットケーブル |
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WO2022234748A1 (ja) * | 2021-05-07 | 2022-11-10 | 株式会社村田製作所 | アンテナ素子、電子機器及びアンテナ素子の製造方法 |
JP7420315B2 (ja) | 2021-05-07 | 2024-01-23 | 株式会社村田製作所 | アンテナ素子、電子機器及びアンテナ素子の製造方法 |
WO2023002766A1 (ja) * | 2021-07-20 | 2023-01-26 | 住友電気工業株式会社 | プリント配線板及びプリント配線板の製造方法 |
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US20220312597A1 (en) | 2022-09-29 |
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