JPWO2025169634A5 - - Google Patents

Info

Publication number
JPWO2025169634A5
JPWO2025169634A5 JP2025543846A JP2025543846A JPWO2025169634A5 JP WO2025169634 A5 JPWO2025169634 A5 JP WO2025169634A5 JP 2025543846 A JP2025543846 A JP 2025543846A JP 2025543846 A JP2025543846 A JP 2025543846A JP WO2025169634 A5 JPWO2025169634 A5 JP WO2025169634A5
Authority
JP
Japan
Prior art keywords
insulating layer
porous insulating
circuit board
thickness direction
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025543846A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025169634A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/045929 external-priority patent/WO2025169634A1/ja
Publication of JPWO2025169634A1 publication Critical patent/JPWO2025169634A1/ja
Publication of JPWO2025169634A5 publication Critical patent/JPWO2025169634A5/ja
Pending legal-status Critical Current

Links

JP2025543846A 2024-02-07 2024-12-25 Pending JPWO2025169634A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024017336 2024-02-07
PCT/JP2024/045929 WO2025169634A1 (ja) 2024-02-07 2024-12-25 フレキシブル多層回路基板

Publications (2)

Publication Number Publication Date
JPWO2025169634A1 JPWO2025169634A1 (https=) 2025-08-14
JPWO2025169634A5 true JPWO2025169634A5 (https=) 2026-01-15

Family

ID=96699773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025543846A Pending JPWO2025169634A1 (https=) 2024-02-07 2024-12-25

Country Status (3)

Country Link
JP (1) JPWO2025169634A1 (https=)
TW (1) TW202533646A (https=)
WO (1) WO2025169634A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261453A (ja) * 2001-02-28 2002-09-13 Kyocera Corp 多層配線基板
JP2003008233A (ja) * 2001-06-19 2003-01-10 Nitto Denko Corp 多層配線基板
JP4967116B2 (ja) * 2005-08-23 2012-07-04 国立大学法人東北大学 多層回路基板及び電子機器
HK1244833B (zh) * 2015-03-23 2019-11-29 拓自达电线株式会社 树脂浸渗物、复合材料和覆铜层叠体的制造方法
JP7454929B2 (ja) * 2019-09-13 2024-03-25 日東電工株式会社 配線回路基板の製造方法
CN220021574U (zh) * 2020-12-09 2023-11-14 株式会社村田制作所 电路基板以及电子设备
JP7762044B2 (ja) * 2021-05-28 2025-10-29 日東電工株式会社 配線回路基板およびその製造方法
JPWO2022260092A1 (https=) * 2021-06-09 2022-12-15

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