JPWO2022172823A5 - - Google Patents
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- JPWO2022172823A5 JPWO2022172823A5 JP2022580575A JP2022580575A JPWO2022172823A5 JP WO2022172823 A5 JPWO2022172823 A5 JP WO2022172823A5 JP 2022580575 A JP2022580575 A JP 2022580575A JP 2022580575 A JP2022580575 A JP 2022580575A JP WO2022172823 A5 JPWO2022172823 A5 JP WO2022172823A5
- Authority
- JP
- Japan
- Prior art keywords
- patent document
- discloses
- reaction product
- smoothing agent
- diglycidyl ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021021841 | 2021-02-15 | ||
| JP2021021841 | 2021-02-15 | ||
| PCT/JP2022/004007 WO2022172823A1 (ja) | 2021-02-15 | 2022-02-02 | 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022172823A1 JPWO2022172823A1 (https=) | 2022-08-18 |
| JPWO2022172823A5 true JPWO2022172823A5 (https=) | 2025-01-28 |
| JP7808062B2 JP7808062B2 (ja) | 2026-01-28 |
Family
ID=82838760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022580575A Active JP7808062B2 (ja) | 2021-02-15 | 2022-02-02 | 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240132453A1 (https=) |
| JP (1) | JP7808062B2 (https=) |
| KR (1) | KR20230142785A (https=) |
| CN (1) | CN116888308A (https=) |
| TW (1) | TW202248198A (https=) |
| WO (1) | WO2022172823A1 (https=) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3879270A (en) * | 1974-01-10 | 1975-04-22 | Monsanto Co | Compositions and process for the electrodeposition of metals |
| AT371816B (de) * | 1979-10-08 | 1983-08-10 | Henkel Kgaa | Verfahren zur herstellung von neuen isocyanurs[urederivaten |
| TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| JP2007327127A (ja) | 2006-06-09 | 2007-12-20 | Daiwa Fine Chemicals Co Ltd (Laboratory) | 銀めっき方法 |
| CN101555609B (zh) * | 2009-04-28 | 2010-08-04 | 武汉风帆电镀技术有限公司 | 有氰转无氰碱性环保镀锌组合物光亮剂 |
| JP5809055B2 (ja) | 2009-07-01 | 2015-11-10 | Jx日鉱日石金属株式会社 | Ｕｌｓｉ微細ダマシン配線埋め込み用電気銅めっき水溶液 |
| US20110220512A1 (en) | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US8268157B2 (en) | 2010-03-15 | 2012-09-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| WO2011135716A1 (ja) * | 2010-04-30 | 2011-11-03 | 荏原ユージライト株式会社 | 新規化合物およびその利用 |
| JP5952093B2 (ja) * | 2012-05-31 | 2016-07-13 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| JP6142165B2 (ja) | 2013-03-25 | 2017-06-07 | 石原ケミカル株式会社 | 電気銅メッキ浴、電気銅メッキ方法並びに当該メッキ浴を用いて銅皮膜を形成した電子部品の製造方法 |
| US10100421B2 (en) | 2015-08-06 | 2018-10-16 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds |
| ES2681836T3 (es) * | 2015-09-10 | 2018-09-17 | Atotech Deutschland Gmbh | Composición de baño para chapado de cobre |
| WO2019044651A1 (ja) * | 2017-08-31 | 2019-03-07 | 株式会社Adeka | 電解めっき液用添加剤、該電解めっき液用添加剤を含有する電解めっき液及び該電解めっき液を用いた電解めっき方法 |
-
2022
- 2022-02-02 US US18/275,517 patent/US20240132453A1/en not_active Abandoned
- 2022-02-02 KR KR1020237030640A patent/KR20230142785A/ko active Pending
- 2022-02-02 JP JP2022580575A patent/JP7808062B2/ja active Active
- 2022-02-02 CN CN202280014793.5A patent/CN116888308A/zh active Pending
- 2022-02-02 WO PCT/JP2022/004007 patent/WO2022172823A1/ja not_active Ceased
- 2022-02-14 TW TW111105314A patent/TW202248198A/zh unknown
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