JP7808062B2 - 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法 - Google Patents

電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法

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Publication number
JP7808062B2
JP7808062B2 JP2022580575A JP2022580575A JP7808062B2 JP 7808062 B2 JP7808062 B2 JP 7808062B2 JP 2022580575 A JP2022580575 A JP 2022580575A JP 2022580575 A JP2022580575 A JP 2022580575A JP 7808062 B2 JP7808062 B2 JP 7808062B2
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JP
Japan
Prior art keywords
electrolytic plating
metal layer
additive
electroplating
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022580575A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022172823A5 (https=
JPWO2022172823A1 (https=
Inventor
拓也 ▲高▼橋
伸哉 石渡
朋子 廿日出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
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Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of JPWO2022172823A1 publication Critical patent/JPWO2022172823A1/ja
Publication of JPWO2022172823A5 publication Critical patent/JPWO2022172823A5/ja
Application granted granted Critical
Publication of JP7808062B2 publication Critical patent/JP7808062B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D251/00—Heterocyclic compounds containing 1,3,5-triazine rings
    • C07D251/02—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings
    • C07D251/12—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members
    • C07D251/26—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with only hetero atoms directly attached to ring carbon atoms
    • C07D251/30—Only oxygen atoms
    • C07D251/32—Cyanuric acid; Isocyanuric acid
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Epoxy Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
JP2022580575A 2021-02-15 2022-02-02 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法 Active JP7808062B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021021841 2021-02-15
JP2021021841 2021-02-15
PCT/JP2022/004007 WO2022172823A1 (ja) 2021-02-15 2022-02-02 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022172823A1 JPWO2022172823A1 (https=) 2022-08-18
JPWO2022172823A5 JPWO2022172823A5 (https=) 2025-01-28
JP7808062B2 true JP7808062B2 (ja) 2026-01-28

Family

ID=82838760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022580575A Active JP7808062B2 (ja) 2021-02-15 2022-02-02 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法

Country Status (6)

Country Link
US (1) US20240132453A1 (https=)
JP (1) JP7808062B2 (https=)
KR (1) KR20230142785A (https=)
CN (1) CN116888308A (https=)
TW (1) TW202248198A (https=)
WO (1) WO2022172823A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879270A (en) 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
CN101555609A (zh) 2009-04-28 2009-10-14 武汉风帆电镀技术有限公司 有氰转无氰碱性环保镀锌组合物光亮剂
JP2011207878A (ja) 2010-03-15 2011-10-20 Rohm & Haas Electronic Materials Llc めっき浴および方法
WO2011135716A1 (ja) 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP2013249515A (ja) 2012-05-31 2013-12-12 Rohm & Haas Denshi Zairyo Kk 電解銅めっき液及び電解銅めっき方法
US20180237932A1 (en) 2015-09-10 2018-08-23 Atotech Deutschland Gmbh Copper plating bath composition and method for deposition of copper

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT371816B (de) * 1979-10-08 1983-08-10 Henkel Kgaa Verfahren zur herstellung von neuen isocyanurs[urederivaten
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
JP2007327127A (ja) 2006-06-09 2007-12-20 Daiwa Fine Chemicals Co Ltd (Laboratory) 銀めっき方法
JP5809055B2 (ja) 2009-07-01 2015-11-10 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細ダマシン配線埋め込み用電気銅めっき水溶液
US20110220512A1 (en) 2010-03-15 2011-09-15 Rohm And Haas Electronic Materials Llc Plating bath and method
JP6142165B2 (ja) 2013-03-25 2017-06-07 石原ケミカル株式会社 電気銅メッキ浴、電気銅メッキ方法並びに当該メッキ浴を用いて銅皮膜を形成した電子部品の製造方法
US10100421B2 (en) 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
WO2019044651A1 (ja) * 2017-08-31 2019-03-07 株式会社Adeka 電解めっき液用添加剤、該電解めっき液用添加剤を含有する電解めっき液及び該電解めっき液を用いた電解めっき方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879270A (en) 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
CN101555609A (zh) 2009-04-28 2009-10-14 武汉风帆电镀技术有限公司 有氰转无氰碱性环保镀锌组合物光亮剂
JP2011207878A (ja) 2010-03-15 2011-10-20 Rohm & Haas Electronic Materials Llc めっき浴および方法
WO2011135716A1 (ja) 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP2013249515A (ja) 2012-05-31 2013-12-12 Rohm & Haas Denshi Zairyo Kk 電解銅めっき液及び電解銅めっき方法
US20180237932A1 (en) 2015-09-10 2018-08-23 Atotech Deutschland Gmbh Copper plating bath composition and method for deposition of copper

Also Published As

Publication number Publication date
WO2022172823A1 (ja) 2022-08-18
US20240132453A1 (en) 2024-04-25
KR20230142785A (ko) 2023-10-11
TW202248198A (zh) 2022-12-16
JPWO2022172823A1 (https=) 2022-08-18
CN116888308A (zh) 2023-10-13

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