TW202248198A - 電解電鍍液用添加劑、電解電鍍液、電解電鍍方法及金屬層的製造方法 - Google Patents

電解電鍍液用添加劑、電解電鍍液、電解電鍍方法及金屬層的製造方法 Download PDF

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Publication number
TW202248198A
TW202248198A TW111105314A TW111105314A TW202248198A TW 202248198 A TW202248198 A TW 202248198A TW 111105314 A TW111105314 A TW 111105314A TW 111105314 A TW111105314 A TW 111105314A TW 202248198 A TW202248198 A TW 202248198A
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TW
Taiwan
Prior art keywords
electrolytic plating
plating solution
additive
metal layer
electrolytic
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TW111105314A
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English (en)
Chinese (zh)
Inventor
髙橋拓也
石渡伸哉
廿日出朋子
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日商Ａｄｅｋａ股份有限公司
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Application filed by 日商Ａｄｅｋａ股份有限公司 filed Critical 日商Ａｄｅｋａ股份有限公司
Publication of TW202248198A publication Critical patent/TW202248198A/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D251/00—Heterocyclic compounds containing 1,3,5-triazine rings
    • C07D251/02—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings
    • C07D251/12—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members
    • C07D251/26—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with only hetero atoms directly attached to ring carbon atoms
    • C07D251/30—Only oxygen atoms
    • C07D251/32—Cyanuric acid; Isocyanuric acid
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Epoxy Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
TW111105314A 2021-02-15 2022-02-14 電解電鍍液用添加劑、電解電鍍液、電解電鍍方法及金屬層的製造方法 TW202248198A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021021841 2021-02-15
JP2021-021841 2021-02-15

Publications (1)

Publication Number Publication Date
TW202248198A true TW202248198A (zh) 2022-12-16

Family

ID=82838760

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105314A TW202248198A (zh) 2021-02-15 2022-02-14 電解電鍍液用添加劑、電解電鍍液、電解電鍍方法及金屬層的製造方法

Country Status (6)

Country Link
US (1) US20240132453A1 (https=)
JP (1) JP7808062B2 (https=)
KR (1) KR20230142785A (https=)
CN (1) CN116888308A (https=)
TW (1) TW202248198A (https=)
WO (1) WO2022172823A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
AT371816B (de) * 1979-10-08 1983-08-10 Henkel Kgaa Verfahren zur herstellung von neuen isocyanurs[urederivaten
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
JP2007327127A (ja) 2006-06-09 2007-12-20 Daiwa Fine Chemicals Co Ltd (Laboratory) 銀めっき方法
CN101555609B (zh) * 2009-04-28 2010-08-04 武汉风帆电镀技术有限公司 有氰转无氰碱性环保镀锌组合物光亮剂
JP5809055B2 (ja) 2009-07-01 2015-11-10 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細ダマシン配線埋め込み用電気銅めっき水溶液
US20110220512A1 (en) 2010-03-15 2011-09-15 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
WO2011135716A1 (ja) * 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP5952093B2 (ja) * 2012-05-31 2016-07-13 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
JP6142165B2 (ja) 2013-03-25 2017-06-07 石原ケミカル株式会社 電気銅メッキ浴、電気銅メッキ方法並びに当該メッキ浴を用いて銅皮膜を形成した電子部品の製造方法
US10100421B2 (en) 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
ES2681836T3 (es) * 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
WO2019044651A1 (ja) * 2017-08-31 2019-03-07 株式会社Adeka 電解めっき液用添加剤、該電解めっき液用添加剤を含有する電解めっき液及び該電解めっき液を用いた電解めっき方法

Also Published As

Publication number Publication date
WO2022172823A1 (ja) 2022-08-18
US20240132453A1 (en) 2024-04-25
JP7808062B2 (ja) 2026-01-28
KR20230142785A (ko) 2023-10-11
JPWO2022172823A1 (https=) 2022-08-18
CN116888308A (zh) 2023-10-13

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