CN116888308A - 电镀液用添加剂、电镀液、电镀方法和金属层的制造方法 - Google Patents

电镀液用添加剂、电镀液、电镀方法和金属层的制造方法 Download PDF

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Publication number
CN116888308A
CN116888308A CN202280014793.5A CN202280014793A CN116888308A CN 116888308 A CN116888308 A CN 116888308A CN 202280014793 A CN202280014793 A CN 202280014793A CN 116888308 A CN116888308 A CN 116888308A
Authority
CN
China
Prior art keywords
plating
additive
plating solution
electroplating
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280014793.5A
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English (en)
Chinese (zh)
Inventor
高桥拓也
石渡伸哉
廿日出朋子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of CN116888308A publication Critical patent/CN116888308A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D251/00—Heterocyclic compounds containing 1,3,5-triazine rings
    • C07D251/02—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings
    • C07D251/12—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members
    • C07D251/26—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with only hetero atoms directly attached to ring carbon atoms
    • C07D251/30—Only oxygen atoms
    • C07D251/32—Cyanuric acid; Isocyanuric acid
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Epoxy Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
CN202280014793.5A 2021-02-15 2022-02-02 电镀液用添加剂、电镀液、电镀方法和金属层的制造方法 Pending CN116888308A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021021841 2021-02-15
JP2021-021841 2021-02-15
PCT/JP2022/004007 WO2022172823A1 (ja) 2021-02-15 2022-02-02 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法

Publications (1)

Publication Number Publication Date
CN116888308A true CN116888308A (zh) 2023-10-13

Family

ID=82838760

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280014793.5A Pending CN116888308A (zh) 2021-02-15 2022-02-02 电镀液用添加剂、电镀液、电镀方法和金属层的制造方法

Country Status (6)

Country Link
US (1) US20240132453A1 (https=)
JP (1) JP7808062B2 (https=)
KR (1) KR20230142785A (https=)
CN (1) CN116888308A (https=)
TW (1) TW202248198A (https=)
WO (1) WO2022172823A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
AT371816B (de) * 1979-10-08 1983-08-10 Henkel Kgaa Verfahren zur herstellung von neuen isocyanurs[urederivaten
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
JP2007327127A (ja) 2006-06-09 2007-12-20 Daiwa Fine Chemicals Co Ltd (Laboratory) 銀めっき方法
CN101555609B (zh) * 2009-04-28 2010-08-04 武汉风帆电镀技术有限公司 有氰转无氰碱性环保镀锌组合物光亮剂
JP5809055B2 (ja) 2009-07-01 2015-11-10 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細ダマシン配線埋め込み用電気銅めっき水溶液
US20110220512A1 (en) 2010-03-15 2011-09-15 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
WO2011135716A1 (ja) * 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP5952093B2 (ja) * 2012-05-31 2016-07-13 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
JP6142165B2 (ja) 2013-03-25 2017-06-07 石原ケミカル株式会社 電気銅メッキ浴、電気銅メッキ方法並びに当該メッキ浴を用いて銅皮膜を形成した電子部品の製造方法
US10100421B2 (en) 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
ES2681836T3 (es) * 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
WO2019044651A1 (ja) * 2017-08-31 2019-03-07 株式会社Adeka 電解めっき液用添加剤、該電解めっき液用添加剤を含有する電解めっき液及び該電解めっき液を用いた電解めっき方法

Also Published As

Publication number Publication date
WO2022172823A1 (ja) 2022-08-18
US20240132453A1 (en) 2024-04-25
JP7808062B2 (ja) 2026-01-28
KR20230142785A (ko) 2023-10-11
TW202248198A (zh) 2022-12-16
JPWO2022172823A1 (https=) 2022-08-18

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