KR20230142785A - 전해 도금액용 첨가제, 전해 도금액, 전해 도금 방법 및 금속층의 제조 방법 - Google Patents

전해 도금액용 첨가제, 전해 도금액, 전해 도금 방법 및 금속층의 제조 방법 Download PDF

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Publication number
KR20230142785A
KR20230142785A KR1020237030640A KR20237030640A KR20230142785A KR 20230142785 A KR20230142785 A KR 20230142785A KR 1020237030640 A KR1020237030640 A KR 1020237030640A KR 20237030640 A KR20237030640 A KR 20237030640A KR 20230142785 A KR20230142785 A KR 20230142785A
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KR
South Korea
Prior art keywords
electrolytic plating
plating solution
metal layer
additive
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237030640A
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English (en)
Korean (ko)
Inventor
다쿠야 다카하시
신야 이시와타
도모코 하츠카데
Original Assignee
가부시키가이샤 아데카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아데카 filed Critical 가부시키가이샤 아데카
Publication of KR20230142785A publication Critical patent/KR20230142785A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D251/00—Heterocyclic compounds containing 1,3,5-triazine rings
    • C07D251/02—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings
    • C07D251/12—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members
    • C07D251/26—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with only hetero atoms directly attached to ring carbon atoms
    • C07D251/30—Only oxygen atoms
    • C07D251/32—Cyanuric acid; Isocyanuric acid
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Epoxy Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
KR1020237030640A 2021-02-15 2022-02-02 전해 도금액용 첨가제, 전해 도금액, 전해 도금 방법 및 금속층의 제조 방법 Pending KR20230142785A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021021841 2021-02-15
JPJP-P-2021-021841 2021-02-15
PCT/JP2022/004007 WO2022172823A1 (ja) 2021-02-15 2022-02-02 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法

Publications (1)

Publication Number Publication Date
KR20230142785A true KR20230142785A (ko) 2023-10-11

Family

ID=82838760

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237030640A Pending KR20230142785A (ko) 2021-02-15 2022-02-02 전해 도금액용 첨가제, 전해 도금액, 전해 도금 방법 및 금속층의 제조 방법

Country Status (6)

Country Link
US (1) US20240132453A1 (https=)
JP (1) JP7808062B2 (https=)
KR (1) KR20230142785A (https=)
CN (1) CN116888308A (https=)
TW (1) TW202248198A (https=)
WO (1) WO2022172823A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007327127A (ja) 2006-06-09 2007-12-20 Daiwa Fine Chemicals Co Ltd (Laboratory) 銀めっき方法
WO2011001847A1 (ja) 2009-07-01 2011-01-06 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細銅配線埋め込み用電気銅めっき液
JP2011190260A (ja) 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2014185390A (ja) 2013-03-25 2014-10-02 Ishihara Chemical Co Ltd 電気銅メッキ浴、電気銅メッキ方法並びに当該メッキ浴を用いて銅皮膜を形成した電子部品
JP2017036500A (ja) 2015-08-06 2017-02-16 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ イミダゾールとビスエポキシド化合物との反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法
JP2017061487A (ja) 2010-03-15 2017-03-30 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ めっき浴および方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
AT371816B (de) * 1979-10-08 1983-08-10 Henkel Kgaa Verfahren zur herstellung von neuen isocyanurs[urederivaten
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
CN101555609B (zh) * 2009-04-28 2010-08-04 武汉风帆电镀技术有限公司 有氰转无氰碱性环保镀锌组合物光亮剂
WO2011135716A1 (ja) * 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP5952093B2 (ja) * 2012-05-31 2016-07-13 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
ES2681836T3 (es) * 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
WO2019044651A1 (ja) * 2017-08-31 2019-03-07 株式会社Adeka 電解めっき液用添加剤、該電解めっき液用添加剤を含有する電解めっき液及び該電解めっき液を用いた電解めっき方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007327127A (ja) 2006-06-09 2007-12-20 Daiwa Fine Chemicals Co Ltd (Laboratory) 銀めっき方法
WO2011001847A1 (ja) 2009-07-01 2011-01-06 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細銅配線埋め込み用電気銅めっき液
JP2011190260A (ja) 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2017061487A (ja) 2010-03-15 2017-03-30 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ めっき浴および方法
JP2014185390A (ja) 2013-03-25 2014-10-02 Ishihara Chemical Co Ltd 電気銅メッキ浴、電気銅メッキ方法並びに当該メッキ浴を用いて銅皮膜を形成した電子部品
JP2017036500A (ja) 2015-08-06 2017-02-16 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ イミダゾールとビスエポキシド化合物との反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法

Also Published As

Publication number Publication date
WO2022172823A1 (ja) 2022-08-18
US20240132453A1 (en) 2024-04-25
JP7808062B2 (ja) 2026-01-28
TW202248198A (zh) 2022-12-16
JPWO2022172823A1 (https=) 2022-08-18
CN116888308A (zh) 2023-10-13

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