JPWO2021206019A5 - - Google Patents
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- Publication number
- JPWO2021206019A5 JPWO2021206019A5 JP2022514044A JP2022514044A JPWO2021206019A5 JP WO2021206019 A5 JPWO2021206019 A5 JP WO2021206019A5 JP 2022514044 A JP2022514044 A JP 2022514044A JP 2022514044 A JP2022514044 A JP 2022514044A JP WO2021206019 A5 JPWO2021206019 A5 JP WO2021206019A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating layer
- interlayer connection
- connection conductor
- internal electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 314
- 239000004020 conductor Substances 0.000 claims description 244
- 239000011229 interlayer Substances 0.000 claims description 239
- 239000000758 substrate Substances 0.000 claims description 96
- 238000003475 lamination Methods 0.000 claims description 16
- 239000011241 protective layer Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 description 189
- 239000011347 resin Substances 0.000 description 189
- 229920000106 Liquid crystal polymer Polymers 0.000 description 11
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 11
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000011888 foil Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020069181 | 2020-04-07 | ||
| JP2020069181 | 2020-04-07 | ||
| PCT/JP2021/014329 WO2021206019A1 (ja) | 2020-04-07 | 2021-04-02 | 多層基板およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021206019A1 JPWO2021206019A1 (https=) | 2021-10-14 |
| JPWO2021206019A5 true JPWO2021206019A5 (https=) | 2022-10-14 |
| JP7294530B2 JP7294530B2 (ja) | 2023-06-20 |
Family
ID=78023274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022514044A Active JP7294530B2 (ja) | 2020-04-07 | 2021-04-02 | 多層基板およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12063738B2 (https=) |
| JP (1) | JP7294530B2 (https=) |
| CN (1) | CN218587412U (https=) |
| WO (1) | WO2021206019A1 (https=) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3656484B2 (ja) * | 1999-03-03 | 2005-06-08 | 株式会社村田製作所 | セラミック多層基板の製造方法 |
| JP4462473B2 (ja) * | 2002-07-01 | 2010-05-12 | 富士通株式会社 | 高周波回路基板及びそれを用いた半導体装置 |
| JP4323231B2 (ja) * | 2003-06-20 | 2009-09-02 | 富士通マイクロエレクトロニクス株式会社 | 高周波伝送線路基板 |
| JP2005072328A (ja) | 2003-08-26 | 2005-03-17 | Kyocera Corp | 多層配線基板 |
| DE602005023039D1 (de) * | 2004-10-29 | 2010-09-30 | Murata Manufacturing Co | Mehrschichtiges substrat mit elektronischer komponente des chiptyps und herstellungsverfahren dafür |
| KR100890371B1 (ko) * | 2004-10-29 | 2009-03-25 | 가부시키가이샤 무라타 세이사쿠쇼 | 세라믹 다층기판 및 그 제조방법 |
| US7757196B2 (en) | 2007-04-04 | 2010-07-13 | Cisco Technology, Inc. | Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards |
| WO2009069398A1 (ja) * | 2007-11-30 | 2009-06-04 | Murata Manufacturing Co., Ltd. | セラミック複合多層基板及びその製造方法並びに電子部品 |
| JP4957638B2 (ja) | 2008-04-24 | 2012-06-20 | イビデン株式会社 | 多層プリント配線板及び多層プリント配線板の製造方法 |
| JP5293060B2 (ja) * | 2008-10-02 | 2013-09-18 | 株式会社デンソー | 多層回路基板およびその製造方法 |
| JP5382225B2 (ja) * | 2010-07-29 | 2014-01-08 | 株式会社村田製作所 | セラミック多層基板およびその製造方法 |
| CN103430639B (zh) | 2011-03-17 | 2016-09-28 | 株式会社村田制作所 | 树脂多层基板 |
| JP2018014387A (ja) * | 2016-07-20 | 2018-01-25 | 住友電工ファインポリマー株式会社 | 基板、フレキシブルプリント配線板用基材、フレキシブルプリント配線板及び基板の製造方法 |
| JP2018032659A (ja) | 2016-08-22 | 2018-03-01 | イビデン株式会社 | プリント配線板およびプリント配線板の製造方法 |
-
2021
- 2021-04-02 JP JP2022514044A patent/JP7294530B2/ja active Active
- 2021-04-02 WO PCT/JP2021/014329 patent/WO2021206019A1/ja not_active Ceased
- 2021-04-02 CN CN202190000370.9U patent/CN218587412U/zh active Active
-
2022
- 2022-08-29 US US17/897,747 patent/US12063738B2/en active Active
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