WO2021230226A1 - 回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法 - Google Patents
回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法 Download PDFInfo
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- WO2021230226A1 WO2021230226A1 PCT/JP2021/017818 JP2021017818W WO2021230226A1 WO 2021230226 A1 WO2021230226 A1 WO 2021230226A1 JP 2021017818 W JP2021017818 W JP 2021017818W WO 2021230226 A1 WO2021230226 A1 WO 2021230226A1
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- Prior art keywords
- conductor
- circuit board
- opening
- region
- board according
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 title claims description 4
- 239000004020 conductor Substances 0.000 claims abstract description 232
- 239000000463 material Substances 0.000 claims abstract description 42
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 8
- 239000011229 interlayer Substances 0.000 claims description 51
- 230000001681 protective effect Effects 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 23
- 230000005540 biological transmission Effects 0.000 claims description 17
- 238000010030 laminating Methods 0.000 claims description 4
- 239000012212 insulator Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Definitions
- the present invention relates to the structure of a connection portion of a circuit board including a laminate made by laminating thermoplastic resin layers.
- Patent Document 1 describes a transmission line device in which a plurality of transmission lines are connected.
- the transmission line device described in Patent Document 1 includes a first transmission line and a second transmission line.
- the first transmission line and the second transmission line each include an insulating base material made of a thermoplastic resin.
- the first transmission line and the second transmission line each have a connection portion.
- the first transmission line and the second transmission line are connected (joined) via a conductive joining material at their respective connecting portions.
- an insulating layer of a thermoplastic resin is laminated and heat-bonded to form a first transmission line and a second transmission line.
- connection portion of the first transmission line and the connection portion of the second transmission line are connected by performing a process such as locally heating the connection portion.
- connection portion receives a larger thermal history than the other portions. Therefore, the connection portion is liable to be unintentionally deformed or peeled off from the ground conductor or the like.
- an object of the present invention is to suppress unintended deformation of the connecting portion and peeling of the conductor or the like.
- the circuit board in the present invention is formed by laminating a thermoplastic resin layer, and has a first main surface at one end in the stacking direction and a second main surface at the other end, and a laminated body having a second main surface and a first main surface. It includes a formed mounting conductor and a planar conductor formed on the second main surface side of the mounting conductor and other conductors formed on the laminate.
- the laminate includes a connecting portion that is joined to an external substrate by a conductive bonding material using a mounting conductor, and a circuit portion other than the connecting portion.
- the first region which is the region of the circuit portion of the planar conductor, has a first opening hole
- the second region which is the region of the connection portion of the planar conductor, has a second opening hole.
- the ratio of the opening area by the second opening hole to the area of the second region is larger than the ratio of the opening area by the first opening hole to the area of the first region.
- the deformation of the thermoplastic resin is properly performed at the place where the circuit board is connected to the external board, more specifically, at the place where the circuit board is connected (bonded) by giving a thermal history to the external board. It is controlled so that unintended deformation of the laminated body and peeling of the interface between the insulator layer and the conductor are unlikely to occur.
- FIG. 1A is a side sectional view showing a schematic configuration of a connection structure 10 of a circuit board according to a first embodiment.
- FIG. 1B is a plan view of the circuit board 20 according to the first embodiment.
- 2 (A), 2 (B), 2 (C), and 2 (D) are diagrams for explaining a method of manufacturing the connection structure 10 of the circuit board.
- FIG. 3 is an enlarged side sectional view of the opening hole 292 of the connecting portion ReJ.
- FIG. 4 is a plan view of the circuit board 25 according to the modified example of the first embodiment.
- FIG. 5 is a plan view of the connection portion ReJ of the circuit board 20A according to the second embodiment.
- FIG. 6 is a plan view of the connection portion ReJ of the circuit board 20B according to the third embodiment.
- FIG. 7 is a side sectional view showing a schematic configuration of the connection structure 10C of the circuit board according to the fourth embodiment.
- FIG. 1A is a side sectional view showing a schematic configuration of a connection structure 10 of a circuit board according to a first embodiment.
- FIG. 1B is a plan view of the circuit board 20 according to the first embodiment.
- 1 (A) and 1 (B) show a part of each of the circuit board and the board, and
- FIG. 1 (A) shows a view cut with an appropriate cross section so that the configuration is easy to understand. Further, in FIGS. 1 (A) and 1 (B), the dimensions are appropriately exaggerated.
- 2 (A), 2 (B), 2 (C), and 2 (D) are diagrams for explaining a method of manufacturing a connection structure of a circuit board.
- FIG. 3 is an enlarged side sectional view of the opening hole 292 of the connecting portion ReJ.
- the circuit board connection structure 10 includes a circuit board 20 and a board 30.
- the substrate 30 corresponds to the "external substrate" of the present invention.
- the circuit board 20 includes a laminate 21, a signal conductor 22, a ground conductor 231 and a ground conductor 232, a mounting conductor 241, an interlayer connecting conductor 251 and an interlayer connecting conductor 252, and a protective film 261.
- the laminated body 21 includes a plurality of insulator layers 201, 202, 203.
- the plurality of insulator layers 201, 202, 203 are made of a thermoplastic resin.
- the laminated body 21 is formed by laminating and heat-bonding a plurality of insulator layers 201, 202, and 203.
- the laminated body 21 has a main surface 211 at one end in the stacking direction and a main surface 212 at the other end in the stacking direction.
- the main surface 211 corresponds to the "first main surface” of the present invention
- the main surface 212 corresponds to the "second main surface” of the present invention.
- the laminated body 21 has a connection portion ReJ and a circuit portion.
- the connection portion ReJ is a portion that overlaps with the substrate 30 when viewed in the stacking direction (viewed in the z-axis direction in the figure: hereinafter, viewing in this direction is referred to as a plan view), and the circuit portion is the connection portion ReJ. It is a part other than.
- the width of the connecting portion ReJ (the width in the direction in which the signal conductor 22 extends and the direction orthogonal to the stacking direction of the insulator layers (y-axis direction in the figure)) is larger than the width of the circuit portion.
- the signal conductor 22 has a shape extending along the signal transmission direction (for example, in the case of the example in the figure, the x-axis direction).
- the signal conductor 22 is a so-called linear conductor.
- the signal conductor 22 is arranged across both the connection portion ReJ and the circuit portion.
- the signal conductor 22 is arranged at an intermediate position in the stacking direction (z-axis direction) in the laminated body 21.
- the ground conductor 231 is a planar conductor, and is arranged on substantially the entire surface of the main surface 211 of the laminated body 21.
- the substantially entire surface is a concept including the entire surface of the main surface 211. That is, the ground conductor 231 is arranged straddling both the connection portion ReJ and the circuit portion.
- the ground conductor 231 is arranged so as to overlap the signal conductor 22 when viewed in the stacking direction, and is a conductor wider than the signal conductor 22. However, it is preferable that the ground conductor 231 has a shape that spreads over the entire width direction of the laminated body 21.
- the region of the connecting portion ReJ in the ground conductor 231 has an opening (non-forming portion of the conductor) so as to include one end of the signal conductor 22.
- the mounting conductor 241 is, for example, a rectangular conductor in a plan view.
- the mounting conductor 241 is arranged on the main surface 211.
- the mounting conductor 241 is arranged in the opening of the ground conductor 231 described above, and overlaps with one end of the signal conductor 22. That is, the mounting conductor 241 is arranged in the region of the connecting portion ReJ.
- the mounting conductor 241 and the ground conductor 231 are separated from each other.
- the ground conductor 232 is a planar conductor and is arranged on substantially the entire surface of the main surface 212 of the laminated body 21.
- the substantially entire surface is a concept including the entire surface of the main surface 212. That is, the ground conductor 232 is arranged straddling both the connection portion ReJ and the circuit portion.
- the ground conductor 232 is arranged so as to overlap the signal conductor 22 when viewed in the stacking direction, and is a conductor wider than the signal conductor 22. However, it is preferable that the ground conductor 232 has a shape that spreads over the entire width direction of the laminated body 21.
- the ground conductor 232 may be separated into a connection portion ReJ portion and a circuit portion. However, since the ground conductor 232 is connected between the connection portion ReJ and the circuit portion, the ground characteristics can be stabilized even if the ground conductor 231 and the plurality of opening holes 292, which will be described later, are provided.
- the ground conductor 232 and the ground conductor 231 are planar conductors and have a width wider than that of the signal conductor 22, even if the ground conductor 232 and the ground conductor 231 have a plurality of opening holes 291 and a plurality of opening holes 292 described later, the characteristic impedance is increased. Changes can be suppressed and electromagnetic shielding against the external environment can be enhanced.
- the ground conductor 232 and the ground conductor 231 overlap with the signal conductor 22 in a plan view and are sandwiched between them, so that the electromagnetic shielding property against the external environment can be enhanced.
- the ground conductor 232 overlaps with the signal conductor 22 and exists over substantially the entire width of the laminated body 21, so that even if it has a plurality of opening holes 291 and a plurality of opening holes 292, it may be present.
- the change in characteristic impedance can be suppressed more effectively, and the electromagnetic shielding property against the external environment can be further enhanced.
- the signal conductor 22, the ground conductor 231 and the ground conductor 232, and the mounting conductor 241 are realized by, for example, copper foil or the like.
- the interlayer connecting conductor 251 and the interlayer connecting conductor 252 are formed in the connecting portion ReJ of the laminated body 21.
- the interlayer connection conductor 251 is arranged at a position where it overlaps the signal conductor 22 and the mounting conductor 241 in a plan view.
- the interlayer connection conductor 251 connects the signal conductor 22 and the mounting conductor 241.
- the interlayer connecting conductor 252 is arranged at a position where it does not overlap with the signal conductor 22 but overlaps with the ground conductor 231 and the ground conductor 232 in a plan view.
- the interlayer connection conductor 252 connects the ground conductor 231 and the ground conductor 232.
- a plurality of interlayer connection conductors 252 are arranged.
- the interlayer connection conductor 251 and the interlayer connection conductor 252 are formed, for example, by solidifying a conductive paste.
- interlayer connection conductor similar to the interlayer connection conductor 252 is also formed in the circuit portion in a predetermined pattern.
- the protective film 261 is arranged on the main surface 211 side of the laminated body 21.
- the protective film 261 is a so-called resist film or the like, and has an insulating property.
- the protective film 261 has an opening that exposes a part of the region of the connecting portion ReJ in the ground conductor 231 to the outside. Further, the protective film 261 has an opening that partially exposes the mounting conductor 241 to the outside. These openings are used to connect to the substrate 30.
- the circuit board 20 realizes a strip line type transmission line of a triplate in which the exposed portion of the mounting conductor 241 and the exposed portion of the connection portion ReJ of the ground conductor 231 are used as external connection terminals.
- the substrate 30 includes an insulating base material 31, a signal land conductor 32, a ground conductor 33, and a protective film 34.
- the base material 31 has a main surface 311 and a main surface 312.
- the base material 31 is realized by, for example, a resin substrate such as FR4.
- the signal land conductor 32 and the ground land conductor 33 are arranged on the main surface 311.
- the signal land conductor 32 and the ground land conductor 33 are realized by, for example, copper foil or the like.
- the protective film 34 is arranged on the main surface 311 side of the base material 31.
- the protective film 34 is a so-called resist film or the like and has an insulating property.
- the protective film 34 has an opening that exposes a part of the signal land conductor 32 and the ground land conductor 33 to the outside. These openings are used to connect to the circuit board 20.
- connection portion ReJ of the circuit board 20 overlaps the board 30. More specifically, the exposed portion of the mounting conductor 241 and the exposed portion of the signal land conductor 32 overlap each other. The exposed portion of the connecting portion ReJ of the ground conductor 231 and the exposed portion of the ground conductor 33 for ground overlap with each other. Then, the mounting conductor 241 and the signal land conductor 32 are connected by a conductive bonding material 41. The ground conductor 231 and the ground conductor 33 are connected by a conductive bonding material 42. The conductive bonding material 41 and the conductive bonding material 42 are, for example, solder.
- connection by the conductive bonding material 41 and the conductive bonding material 42 is realized by heating and pressurizing the overlapping portion of the connection portion ReJ of the circuit board 20 and the substrate 30.
- the insulator layer 201 on which the ground conductor 231 is formed, the insulator layer 202 on which the signal conductor 22 is formed, and the insulator layer 203 on which the ground conductor 232 is formed are laminated. ..
- the insulator layer 201 and the insulator layer 202 are formed with through holes for the interlayer connection conductor 251 and are filled with the conductive paste.
- the insulator layer 201, the insulator layer 202, and the insulator layer 203 are formed with through holes for the interlayer connection conductor 252 and are filled with the conductive paste.
- the member in which the insulator layer 201, the insulator layer 202, and the insulator layer 203 are laminated is heat-bonded to form the laminated body 21.
- the conductive paste is solidified to form the interlayer connecting conductor 251 and the interlayer connecting conductor 252.
- the protective film 261 is formed on the main surface 211 side of the laminated body 21, so that the circuit board 20 is formed as shown in FIG. 2 (B).
- a conductive bonding material such as solder is arranged on the exposed portion of the signal land conductor 32 of the substrate 30 and the exposed portion of the ground conductor 33.
- connection portion ReJ of the circuit board 20 and the board 30 are overlapped.
- the circuit board 20 is arranged so that the main surface 211 faces the board 30.
- the connection portion ReJ of the circuit board 20 is heat-bonded to the substrate 30 by the heater bar 90.
- the heater bar 90 includes a position overlapping the conductive bonding material at least in a plan view so as to be in contact with substantially the entire surface of the connection portion ReJ. Is pushed from the main surface 212 side of the circuit board 20.
- the conductive bonding material is solidified and the circuit board 20 and the board 30 are connected to each other.
- the ground conductor 232 has a plurality of opening holes 291 and a plurality of opening holes 292.
- the opening hole 291 corresponds to the "first opening hole” of the present invention
- the opening hole 292 corresponds to the "second opening hole” of the present invention.
- the plurality of opening holes 291 and the plurality of opening holes 292 are realized by the non-forming portion of the conductor in the ground conductor 232.
- a plurality of opening holes 291 are arranged in the region of the circuit portion in the ground conductor 232.
- the plurality of opening holes 292 are arranged in the region of the connecting portion ReJ in the ground conductor 232.
- the region of the circuit portion in the ground conductor 232 corresponds to the "first region” of the present invention, and the region of the connection portion ReJ in the ground conductor 232 corresponds to the "second region" of the present invention.
- the opening area of the opening hole 292 is larger than the opening area of the opening hole 291.
- the opening area of the ground conductor 232 by the plurality of opening holes 292 in the region of the connecting portion ReJ is the opening area of the ground conductor 232 by the plurality of opening holes 291 in the region of the circuit portion (opening area of the circuit portion).
- the ratio of the total area of the opening areas of the plurality of opening holes 292 to the area of the second region of the ground conductor 232 is the opening area of the plurality of opening holes 291 to the area of the first region of the ground conductor 232. Greater than the ratio of total area.
- the opening area of the connection portion may be about the same as the opening area of the circuit portion, but a larger opening area is preferable.
- the gas generated from the plurality of insulating layers constituting the laminated body 21 at the time of forming the laminated body 21 of the circuit board 20, that is, at the time of heat crimping, is generated from the laminated body. It can escape to the outside of 21. As a result, unintended deformation of the laminated body 21 can be suppressed. Further, it is possible to suppress peeling between the signal conductor 22, the ground conductor 231 and the ground conductor 232, and the laminated body 21, that is, at each interface existing on the circuit board 20.
- connection portion ReJ when the circuit board 20 is connected to the substrate 30, the connection portion ReJ is mainly heated and pressurized, and the circuit portion is hardly heated and pressurized. Therefore, the connection portion ReJ receives a larger amount of heat and pressure than the circuit portion.
- the opening area of the connection portion is larger than the opening area of the circuit portion, even if the connection portion ReJ receives a larger (more) heat and pressure than the circuit portion, the connection portion is connected according to the size of the opening area.
- the part ReJ can realize appropriate degassing. As a result, in the connection portion ReJ, unintended deformation of the laminated body 21 can be suppressed, and peeling at each interface existing on the circuit board 20 can be suppressed.
- the opening area of the plurality of opening holes 291 is smaller than the opening area of the plurality of opening holes 292 arranged in the connection portion ReJ. More specifically, the opening area of each opening hole 291 is smaller than the area of each opening hole 292.
- the circuit part often has a large ratio shown on the circuit board with respect to the connection part ReJ. Therefore, the circuit board 20 can also obtain the above-mentioned effects and effects, suppress changes in the characteristic impedance, and enhance the electromagnetic shielding property. That is, in this configuration, while suppressing the change in the characteristic impedance and improving the electromagnetic shielding property, the connection portion ReJ, which is more likely to undergo unintended deformation or interface peeling than the circuit portion, undergoes unintended deformation or interface peeling. It can be suppressed.
- connection portion ReJ can be uniformly heated and pressurized as a whole.
- interlayer connection conductor 251 and the interlayer connection conductor 252 exist in the connection portion ReJ.
- the interlayer connecting conductor 251 and the interlayer connecting conductor 252 are realized by solidifying the conductive paste by heating as described above. At this time, a large amount of gas is generated from the conductive paste. For example, gas is generated during the solidification of the resin contained in the conductive paste and the reaction of the Cu—Sn alloy constituting the conductive paste. However, since the opening area of the connecting portion is large, the gas generated from the conductive pace can be effectively discharged to the outside from the opening hole 292 of the connecting portion ReJ.
- the connecting portion ReJ can realize appropriate degassing. As a result, in the connection portion ReJ, unintended deformation of the laminated body 21 can be suppressed, and peeling at each interface existing on the circuit board 20 can be suppressed.
- the positions of the interlayer connecting conductor 251 and the interlayer connecting conductor 252 and the plurality of opening holes 292 are different in the plan view. That is, the ground conductor 232 is arranged at the positions of the interlayer connecting conductor 251 and the interlayer connecting conductor 252. Therefore, the heat from the heater bar 90 can be used for solidification of the interlayer connecting conductor 251 and the interlayer connecting conductor 252, and this heat can be effectively transferred. Thereby, solidification of the interlayer connecting conductor 251 and the interlayer connecting conductor 252 can be realized more reliably. Therefore, the reliability of the interlayer connecting conductor 251 and the interlayer connecting conductor 252, and by extension, the reliability of the circuit board 20 is improved.
- the interlayer connecting conductor 251 and the conductive joining material 41 overlap each other in a plan view, and the interlayer connecting conductor 252 and the conductive joining material 42 overlap each other. Then, these overlap with the ground conductor 232 and do not overlap with the plurality of opening holes 292. Therefore, the heat from the heater bar 90 can be effectively transferred to the conductive joining material 41 and the conductive joining material 42. Thereby, solidification of the conductive bonding material 41 and the conductive bonding material 42 can be realized more reliably. Therefore, the reliability of the conductive bonding material 41 and the conductive bonding material 42, that is, the connection reliability between the circuit board 20 and the substrate 30 is improved.
- the interlayer connecting conductor 251 and the interlayer connecting conductor 252, the conductive joining material 41 and the conductive joining material 42, and the plurality of opening holes 292 do not completely overlap each other.
- the interlayer connecting conductor 251 and the interlayer connecting conductor 252, the conductive joining material 41 and the conductive joining material 42 may partially overlap each other with the plurality of opening holes 292.
- the opening area of the opening hole 292 is, for example, on the outer surface 2320 of the ground conductor 232 even if the laminate 21 rises from the opening hole 292 after the circuit board 20 and the board 30 are connected. It is preferable that the amount does not squeeze out. That is, the opening area of the opening hole 292 may be such that the exposed surface of the laminated body 21 does not protrude from the outer surface 2320 of the ground conductor 232 in the state after the circuit board 20 and the substrate 30 are connected. As a result, it is possible to prevent the space between the ground conductor 232 and the signal conductor 22 from being unnecessarily shortened. Therefore, an unnecessary change in the characteristic impedance with respect to the high frequency signal transmitted by the circuit board 20 is suppressed.
- planar shapes of the opening hole 292 and the opening hole 291 are circular, but the planar shape is not limited to the circular shape. That is, the planar shapes of the opening hole 292 and the opening hole 291 may be other shapes as long as each has an opening area having the above-mentioned function.
- FIG. 4 is a plan view of the connection portion of the circuit board 20 according to the modified example of the first embodiment.
- the circuit board 25 according to the modified example of the first embodiment has a signal conductor 22, an opening hole 291 and an opening hole 292 in a plan view with respect to the circuit board 20 according to the first embodiment. It differs in that it does not overlap.
- Other configurations of the circuit board 25 are the same as those of the circuit board 20, and the description of the same parts will be omitted.
- the ground conductor 232 has a plurality of opening holes 291 and a plurality of opening holes 292.
- the opening holes 291 are periodically arranged in the region of the circuit portion of the ground conductor 232.
- the opening hole 291 does not overlap the signal conductor 22 in a plan view.
- the opening hole 292 is periodically arranged in the region of the connecting portion ReJ in the ground conductor 232.
- the opening hole 292 does not overlap the signal conductor 22 in a plan view.
- FIG. 5 is a plan view of the connection portion of the circuit board 20A according to the second embodiment.
- the circuit board 20A according to the second embodiment is different from the circuit board 20 according to the first embodiment in that it has a slit opening 293.
- Other configurations of the circuit board 20A are the same as those of the circuit board 20, and the description of the same parts will be omitted.
- the slit opening 293 is arranged in the area of the connection portion ReJ in the ground conductor 232.
- the slit opening 293 is partially frame-shaped and is realized by the non-forming portion of the conductor in the ground conductor 232.
- the slit opening 293 is arranged in a region where a plurality of opening holes 292 are formed and a region where the interlayer connecting conductor 251 and the interlayer connecting conductor 252 are formed in a plan view.
- the heater bar 90 is arranged so as to include substantially the entire area in contact with the heater bar 90.
- the heat from the heater bar 90 is less likely to leak to the outside from the region surrounded by the slit opening 293 in the ground conductor 232. Therefore, the heat of the heater bar 90 is effectively transferred to the inside of the connection portion ReJ.
- the solidification of the conductive bonding material 41, the conductive bonding material 42, the interlayer connecting conductor 251 and the interlayer connecting conductor 252 as described above can be effectively realized. Further, unnecessary flow of the laminated body 21 in the vicinity of the side end portion of the connecting portion ReJ is suppressed.
- the slit opening 293 may have a shape that is continuous over the entire circumference, but it is preferable that the slit opening 293 has a partially discontinuous portion. As a result, the ground at the connection portion ReJ is stabilized. Further, it is preferable that the area of the inner region of the slit opening 293 is larger than the area of the contact surface of the heater bar 90. As a result, even if an error occurs in the contact position of the heater bar 90, it is easy to contact only the inside of the slit opening 293.
- FIG. 6 is a plan view of the connection portion ReJ of the circuit board 20B according to the third embodiment.
- the circuit board 20B according to the third embodiment is different from the circuit board 20A according to the second embodiment in that a protective film 262 is provided.
- Other configurations of the circuit board 20B are the same as those of the circuit board 20A, and the description of the same parts will be omitted.
- the protective film 262 is a so-called resist film or the like, like the protective film 261.
- the protective film 262 is arranged on the main surface 212 side of the laminated body 21.
- the protective film 262 is arranged so as to straddle both the connection portion ReJ and the circuit portion.
- the protective film 262 covers the entire surface of the ground conductor 232 in the circuit section.
- the protective film 262 has an opening 2620 for the protective film in the connection portion ReJ.
- the protective film 262 covers the entire surface of the ground conductor 232 except for the protective film opening 2620.
- the protective film opening 2620 is arranged in the inner region of the slit opening 293. Further, in a plan view, the protective film opening 2620 overlaps with the interlayer connecting conductor 251 and the interlayer connecting conductor 252, the conductive bonding material 41, and the conductive bonding material 42.
- the circuit board 20B can protect the ground conductor 232 from the external environment in the circuit portion and a part of the connection portion ReJ. Then, the heater bar 90 can be brought into direct contact with the ground conductor 232 during heating and pressurization by the heater bar 90.
- the heater bar 90 can be more reliably brought into contact with the ground conductor 232.
- the slit opening 293 overlaps with the protective film 262. That is, the protective film 262 is embedded in the slit opening 293. Thereby, the outflow of the laminated body 21 from the slit opening 293 at the time of heating and pressurizing by the heater bar 90 can be suppressed. Therefore, it is possible to prevent the distance between the ground conductor 232 and the signal conductor 22 from becoming short, and it is possible to more reliably realize the desired characteristic impedance.
- FIG. 7 is a side sectional view showing a schematic configuration of the connection structure 10C of the circuit board according to the fourth embodiment.
- the board 30 is replaced with the circuit board 20 with respect to the circuit board connection structure 10 according to the first embodiment. different.
- Other configurations of the circuit board connection structure 10C are the same as those of the circuit board connection structure 10, and the description of the same parts will be omitted.
- the circuit board connection structure 10C is realized by connecting two circuit boards 20. More specifically, the connection portion ReJ of one circuit board 20 and the connection portion ReJ of the other circuit board 20 are opposed to each other and are connected by the conductive bonding material 41 and the conductive bonding material 42.
- the substrates to be connected are both configured to use the thermoplastic laminated body 21, by providing the opening hole 292 as described above, the above-mentioned various effects on the connecting portion ReJ can be obtained. be able to.
- the ground conductor 232 is formed on the main surface 212 of the laminated body 21. However, if the ground conductor 232 is arranged at a position closer to the main surface 212 than the other conductors arranged inside the laminated body 21, it is arranged in the inner layer of the laminated body 21 rather than the main surface 212. May be. Further, in the above description, the ground conductor is shown as an example as the planar conductor. However, if the conductor arranged at the position closer to the main surface 212 than the other conductors arranged inside the laminated body 21 in the connection portion ReJ is a planar conductor, the above configuration can be applied. can.
- Circuit board connection structure 20A, 20B, 25 Circuit board 21: Laminated body 22: Signal conductor 30: Substrate 31: Base material 32: Signal land conductor 33: Ground conductor 34: Protective film 41, 42: Conductive conductor 90: Heater bars 201, 202, 203: Insulator layer 211, 212: Main surface 231 and 232: Ground conductor 241: Mounting conductor 251 and 252: Interlayer connection conductor 261 and 262: Protective film 291 , 292: Opening hole 293: Slit opening 311 and 312: Main surface 2320: Outer surface 2620: Protective film opening
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Abstract
Description
本発明の第1の実施形態に係る基板接合構造について、図を参照して説明する。図1(A)は、第1の実施形態に係る回路基板の接続構造10の概略構成を示す側面断面図である。図1(B)は、第1の実施形態に係る回路基板20の平面図である。なお、図1(A)、図1(B)は、回路基板、基板のそれぞれの一部を示し、図1(A)は、構成が分かり易いような適切な断面で切った図を示す。また、図1(A)、図1(B)では、寸法を適宜誇張して記載している。図2(A)、図2(B)、図2(C)、図2(D)は、回路基板の接続構造の製造方法を説明するための図である。図3は、接続部ReJの開口穴292の箇所を拡大した側面断面図である。
回路基板20は、積層体21、信号導体22、グランド導体231、グランド導体232、実装導体241、層間接続導体251、層間接続導体252、および、保護膜261を備える。
基板30は、絶縁性の基材31、信号用ランド導体32、グランド用ランド導体33、保護膜34を備える。基材31は、主面311と主面312とを有する。基材31は、例えば、FR4等の樹脂基板によって実現される。
平面視において、回路基板20の接続部ReJは、基板30に重なっている。より具体的には、実装導体241の露出部と信号用ランド導体32の露出部とは重なっている。グランド導体231の接続部ReJでの露出部と、グランド用ランド導体33の露出部とは、重なっている。そして、実装導体241と信号用ランド導体32とは、導電性接合材41によって接続される。グランド導体231とグランド用ランド導体33とは、導電性接合材42によって接続される。なお、導電性接合材41および導電性接合材42は、例えば、はんだである。
上述の構成は、次のような製造方法によって実現される。まず、図2(A)に示すように、グランド導体231が形成された絶縁体層201、信号導体22が形成された絶縁体層202、グランド導体232が形成された絶縁体層203を積層する。絶縁体層201、および、絶縁体層202には、層間接続導体251用の貫通孔が形成されており、導電性ペーストが充填されている。また、絶縁体層201、絶縁体層202、および、絶縁体層203には、層間接続導体252用の貫通孔が形成されており、導電性ペーストが充填されている。
グランド導体232には、複数の開口穴291、および、複数の開口穴292を有する。開口穴291が、本発明の「第1開口穴」に対応し、開口穴292が、本発明の「第2開口穴」に対応する。複数の開口穴291および複数の開口穴292は、グランド導体232における導体の非形成部によって実現される。
本発明の第1の実施形態の変形例に係る基板接合構造について、図を参照して説明する。図4は、第1の実施形態の変形例に係る回路基板20の接続部の平面図である。
本発明の第2の実施形態に係る基板接合構造について、図を参照して説明する。図5は、第2の実施形態に係る回路基板20Aの接続部の平面図である。
本発明の第3の実施形態に係る基板接合構造について、図を参照して説明する。図6は、第3の実施形態に係る回路基板20Bの接続部ReJの平面図である。
本発明の第4の実施形態に係る基板接合構造について、図を参照して説明する。図7は、第4の実施形態に係る回路基板の接続構造10Cの概略構成を示す側面断面図である。
20、20A、20B、25:回路基板
21:積層体
22:信号導体
30:基板
31:基材
32:信号用ランド導体
33:グランド用ランド導体
34:保護膜
41、42:導電性接合材
90:ヒータバー
201、202、203:絶縁体層
211、212:主面
231、232:グランド導体
241:実装導体
251、252:層間接続導体
261、262:保護膜
291、292:開口穴
293:スリット開口
311、312:主面
2320:外面
2620:保護膜用開口
Claims (16)
- 熱可塑性の樹脂層を積層してなり、積層方向の一方端に第1主面を有し、他方端に第2主面を有する積層体と、
前記第1主面に形成された実装導体と、
前記実装導体および前記積層体に形成される他の導体よりも前記第2主面側に形成された面状導体と、
を備え、
前記積層体は、
前記実装導体を用いて導電性接合材によって外部の基板に接合される接続部と、
前記接続部以外の回路部と、を備え、
前記面状導体における前記回路部の領域である第1領域には、第1開口穴を有し、
前記面状導体における前記接続部の領域である第2領域には、第2開口穴を有し、
前記第2領域の面積に対する前記第2開口穴による開口面積の比は、前記第1領域の面積に対する前記第1開口穴による開口面積の比よりも大きい、
回路基板。 - 前記積層体は、複数の前記第2開口穴を有する、
請求項1に記載の回路基板。 - 前記積層体は、複数の前記第1開口穴を有し、
複数の前記第2開口穴のうち最も開口面積が小さい前記第2開口穴の開口面積は、複数の前記第1開口穴のうち最も開口面積が大きい前記第1開口穴の開口面積よりも大きい、
請求項2に記載の回路基板。 - 複数の前記第1開口穴は、周期的に配置されている、
請求項3に記載の回路基板。 - 前記積層体は、複数の前記第1開口穴を有し、
複数の前記第1開口穴は、周期的に配置されている、
請求項1または請求項2に記載の回路基板。 - 前記積層体の内部には、前記実装導体に接続し、導電性ペーストを固化することによって形成される層間接続導体を備える、
請求項1乃至請求項5のいずれかに記載の回路基板。 - 前記積層方向に視て、前記第2開口穴と前記層間接続導体とは異なる位置に配置されている、
請求項6に記載の回路基板。 - 前記面状導体は、前記積層方向に視て、前記接続部の領域において前記層間接続導体の形成領域の外側に、スリット状の開口を有する、
請求項6または請求項7に記載の回路基板。 - 前記積層体の前記第2主面に、絶縁性の保護膜を備え、
前記保護膜は、前記面状導体における前記接続部の領域において、その中央領域を開口する保護膜用開口を有する、
請求項1乃至請求項8のいずれかに記載の回路基板。 - 前記面状導体は、前記接続部から前記回路部まで繋がっている、
請求項1乃至請求項9のいずれかに記載の回路基板。 - 前記面状導体は、グランド導体である、
請求項1乃至請求項9のいずれかに記載の回路基板。 - 前記積層体の内部には、前記積層方向の途中位置に、信号導体を備え、
前記信号導体と前記グランド導体とによって、伝送線路が形成されている、
請求項11に記載の回路基板。 - 前記グランド導体の幅は、前記信号導体の幅よりも大きい、
請求項12に記載の回路基板。 - 請求項1乃至請求項13のいずれかに記載の回路基板と、
前記外部の基板と、を備え、
前記導電性接合材によって、前記回路基板と前記外部の基板とを接続する、
回路基板の接続構造。 - 前記外部の基板は、前記回路基板と同様の構成を備える、
請求項13に記載の回路基板の接続構造。 - 請求項14または請求項15に記載の基板の接続構造の製造方法であって、
前記外部の基板に対して、前記導電性接合材を配置し、
前記積層体の前記接続部を、前記外部の基板に対して前記第1主面を対向させて配置し、
前記面状導体における前記接続部の領域に、ヒータバーを当接させながら、前記回路基板を、前記外部の基板に対して、加熱圧着させる、
回路基板の接続構造の製造方法。
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