JPWO2020262245A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2020262245A5 JPWO2020262245A5 JP2021526930A JP2021526930A JPWO2020262245A5 JP WO2020262245 A5 JPWO2020262245 A5 JP WO2020262245A5 JP 2021526930 A JP2021526930 A JP 2021526930A JP 2021526930 A JP2021526930 A JP 2021526930A JP WO2020262245 A5 JPWO2020262245 A5 JP WO2020262245A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- layer
- composite particles
- cured product
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 9
- 239000011246 composite particle Substances 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 239000007787 solid Substances 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 description 12
- 239000000203 mixture Substances 0.000 description 8
- 239000000835 fiber Substances 0.000 description 5
- 229920001955 polyphenylene ether Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 125000001033 ether group Chemical group 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019119108 | 2019-06-26 | ||
| JP2019119108 | 2019-06-26 | ||
| PCT/JP2020/024182 WO2020262245A1 (ja) | 2019-06-26 | 2020-06-19 | 金属張積層板及びプリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020262245A1 JPWO2020262245A1 (https=) | 2020-12-30 |
| JPWO2020262245A5 true JPWO2020262245A5 (https=) | 2022-03-18 |
| JP7411937B2 JP7411937B2 (ja) | 2024-01-12 |
Family
ID=74059767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021526930A Active JP7411937B2 (ja) | 2019-06-26 | 2020-06-19 | 金属張積層板及びプリント配線板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11638349B2 (https=) |
| JP (1) | JP7411937B2 (https=) |
| KR (1) | KR102824926B1 (https=) |
| CN (1) | CN113994769A (https=) |
| WO (1) | WO2020262245A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202247993A (zh) * | 2021-05-31 | 2022-12-16 | 日商富士軟片股份有限公司 | 配線基板及配線基板之製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI288591B (en) * | 2005-10-17 | 2007-10-11 | Phoenix Prec Technology Corp | Circuit board structure and dielectric structure thereof |
| JP2013000995A (ja) | 2011-06-17 | 2013-01-07 | Panasonic Corp | 金属張積層板、及びプリント配線板 |
| JP2014150133A (ja) | 2013-01-31 | 2014-08-21 | Panasonic Corp | 樹脂付き金属箔、プリント配線板、及びプリント配線板の製造方法 |
| JP2015159177A (ja) | 2014-02-24 | 2015-09-03 | 住友ベークライト株式会社 | 樹脂基板、金属張積層板、プリント配線基板、および半導体装置 |
| WO2015133513A1 (ja) | 2014-03-07 | 2015-09-11 | 日本ゼオン株式会社 | 多層硬化性樹脂フィルム、プリプレグ、積層体、硬化物、複合体及び多層回路基板 |
| CN105713312B (zh) * | 2014-12-05 | 2017-11-14 | 台光电子材料(昆山)有限公司 | 芳香族四官能乙烯苄基树脂组成物及其应用 |
| WO2016159102A1 (ja) * | 2015-04-01 | 2016-10-06 | 三菱鉛筆株式会社 | フッ素系樹脂含有非水系分散体、フッ素系樹脂含有ポリイミド前駆体溶液組成物、それを用いたポリイミド、ポリイミドフィルム、回路基板用接着剤組成物、およびそれらの製造方法 |
| TWI725054B (zh) * | 2015-10-01 | 2021-04-21 | 日商三菱鉛筆股份有限公司 | 氟系樹脂之非水系分散體、含氟系樹脂之熱硬化樹脂組成物與其硬化物、及電路基板用接著劑組成物 |
| KR102078009B1 (ko) | 2015-10-06 | 2020-02-17 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| CN109661862B (zh) * | 2016-09-01 | 2021-08-31 | Ａｇｃ株式会社 | 金属层叠板及其制造方法、以及印刷基板的制造方法 |
| JP6998527B2 (ja) * | 2017-06-19 | 2022-01-18 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 |
-
2020
- 2020-06-19 JP JP2021526930A patent/JP7411937B2/ja active Active
- 2020-06-19 CN CN202080043565.1A patent/CN113994769A/zh active Pending
- 2020-06-19 KR KR1020217041247A patent/KR102824926B1/ko active Active
- 2020-06-19 US US17/621,011 patent/US11638349B2/en active Active
- 2020-06-19 WO PCT/JP2020/024182 patent/WO2020262245A1/ja not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2018159080A1 (ja) | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 | |
| TW200504146A (en) | Resin composition for interlayer insulation of multilayer printed circuit board, adhesive film and prepreg | |
| KR20050085990A (ko) | 열경화성 수지 조성물, 수지 필름, 절연 재료 부착 금속박,양면 금속박 부착 절연 필름, 금속장 적층판, 다층 금속장적층판 및 다층 프린트 배선판 | |
| CN103849118A (zh) | 一种印刷电路板用树脂组合物、绝缘薄膜、半固化片和印刷电路板 | |
| KR102051374B1 (ko) | 저손실 절연 수지 조성물, 및 이를 이용한 절연 필름 | |
| JPWO2020262245A5 (https=) | ||
| CN100339416C (zh) | 用于电绝缘材料的聚酰亚胺树脂 | |
| CN116285875A (zh) | 一种低密度导热有机硅灌封胶及其制备方法 | |
| CN107241819A (zh) | 一种无卤阻燃柔性高分子复合电热膜的制备方法 | |
| JP2022158886A5 (https=) | ||
| CN108864973B (zh) | 一种耐高温阻燃的薄膜少胶云母带 | |
| WO2024004525A1 (ja) | 窒化ホウ素材料、その応用製品、および窒化ホウ素材料の製造方法 | |
| JP2008501841A5 (https=) | ||
| JPH068388A (ja) | エポキシ樹脂積層板 | |
| JP3772327B2 (ja) | 高周波部品 | |
| JP2005048036A (ja) | プリプレグ、およびこれを用いた金属箔張積層板 | |
| CN115537131A (zh) | 一种导热胶膜的制备方法 | |
| US20250092200A1 (en) | Modified bismaleimide resin and preparation method thereof | |
| JP4806279B2 (ja) | ガラスクロス含有絶縁基材 | |
| CN112300713A (zh) | 一种适用于柔性线路板的纯胶膜 | |
| JPWO2016117398A1 (ja) | 樹脂組成物、塗料、電子部品、モールド変圧器、モータコイル、ケーブル | |
| JP3658649B2 (ja) | エポキシ樹脂組成物 | |
| JP3119578B2 (ja) | 印刷回路用積層板の製造方法 | |
| CN120854169A (zh) | 耐湿叠层固态铝电解电容器及其制备方法 | |
| KR20240077616A (ko) | 변성 폴리실세스퀴옥산을 포함하는 저유전 기판 소재 및 그를 이용한 기판 |