WO2020262245A1 - 金属張積層板及びプリント配線板 - Google Patents

金属張積層板及びプリント配線板 Download PDF

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Publication number
WO2020262245A1
WO2020262245A1 PCT/JP2020/024182 JP2020024182W WO2020262245A1 WO 2020262245 A1 WO2020262245 A1 WO 2020262245A1 JP 2020024182 W JP2020024182 W JP 2020024182W WO 2020262245 A1 WO2020262245 A1 WO 2020262245A1
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Prior art keywords
layer
resin composition
metal
composite particles
group
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PCT/JP2020/024182
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English (en)
French (fr)
Japanese (ja)
Inventor
大 佐々木
泰礼 西口
一輝 松村
陽介 石川
田宮　裕記
岸野　光寿
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to KR1020217041247A priority Critical patent/KR102824926B1/ko
Priority to JP2021526930A priority patent/JP7411937B2/ja
Priority to CN202080043565.1A priority patent/CN113994769A/zh
Priority to US17/621,011 priority patent/US11638349B2/en
Publication of WO2020262245A1 publication Critical patent/WO2020262245A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0228—Vinyl resin particles, e.g. polyvinyl acetate, polyvinyl alcohol polymers or ethylene-vinyl acetate copolymers
    • B32B2264/0242—Vinyl halide, e.g. PVC, PVDC, PVF or PVDF (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/40—Pretreated particles
    • B32B2264/402—Pretreated particles with organic substances
    • B32B2264/4021—Pretreated particles with organic substances with silicon-containing compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/40—Pretreated particles
    • B32B2264/403—Pretreated particles coated or encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/10—Properties of the layers or laminate having particular acoustical properties
    • B32B2307/102—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

Definitions

  • This disclosure relates to a metal-clad laminate and a printed wiring board.
  • Patent Document 1 describes an insulating layer in a metal-clad laminate as a particle containing a modified polyphenylene ether having a substituent having a carbon-carbon double bond at the end, a cross-linking agent having a carbon-carbon double bond, and a fluororesin. It is disclosed that a low specific dielectric constant can be achieved by producing the insulating layer from the contained resin composition.
  • the insulating layer tends to have a low relative permittivity due to the particles containing fluororesin, but the metal layer overlapping the insulating layer in the metal-clad laminate. Peel strength tends to be low.
  • An object of the present disclosure is to provide a metal-clad laminate and a printed wiring board in which the insulating layer is easily made to have a low relative permittivity and the peel strength of the metal layer with respect to the insulating layer is not easily lowered.
  • the metal-clad laminate according to the present embodiment includes an insulating layer and a metal layer that overlaps the insulating layer.
  • the insulating layer includes a first layer and a second layer interposed between the first layer and the metal layer.
  • the first layer contains a cured product of the first resin composition.
  • the second layer contains a cured product of the second resin composition.
  • the first resin composition contains composite particles having a core containing a fluororesin and a shell containing a silicon oxide that covers at least a part of the core.
  • the second resin composition contains composite particles having a core containing a fluororesin and a shell containing a silicon oxide that covers at least a part of the core, or does not contain the composite particles.
  • the ratio of the composite particles in the second resin composition to the solid content of the second resin composition is the solid content of the first resin composition. It is lower than the ratio of the composite particles in the first resin composition with respect to.
  • the printed wiring board according to the present embodiment includes an insulating layer and conductor wiring that overlaps the insulating layer.
  • the insulating layer includes a first layer and a second layer interposed between the first layer and the conductor wiring.
  • the first layer contains a cured product of the first resin composition.
  • the second layer contains a cured product of the second resin composition.
  • the first resin composition contains composite particles having a core containing a fluororesin and a shell containing a silicon oxide that covers at least a part of the core.
  • the second resin composition contains composite particles having a core containing a fluororesin and a shell containing a silicon oxide that covers at least a part of the core, or does not contain the composite particles.
  • the ratio of the composite particles in the second resin composition to the solid content of the second resin composition is the solid content of the first resin composition. It is lower than the ratio of the composite particles in the first resin composition with respect to.
  • Japanese Patent Application Laid-Open No. 2019-1965 describes an insulating layer in a metal-clad laminate as a modified polyphenylene ether having a substituent having a carbon-carbon double bond at the end, a cross-linking agent having a carbon-carbon double bond, and a fluororesin. It is disclosed that a low relative permittivity of an insulating layer can be achieved by producing a resin composition containing particles containing.
  • the insulating layer has a low relative permittivity due to particles containing fluororesin.
  • the peel strength of the metal layer overlapping the insulating layer in the metal-clad laminate tends to be low.
  • An object of the present disclosure is to provide a metal-clad laminate and a printed wiring board in which the insulating layer is easily made to have a low relative permittivity and the peel strength of the metal layer with respect to the insulating layer is not easily lowered.
  • the metal-clad laminate 1 includes an insulating layer 2 and a metal layer 3 that overlaps the insulating layer 2.
  • the insulating layer 2 includes a first layer 21 and a second layer 22 interposed between the first layer 21 and the metal layer 3.
  • the first layer 21 contains a cured product of the first resin composition.
  • the second layer 22 contains a cured product of the second resin composition.
  • the first resin composition contains composite particles having a core containing a fluororesin and a shell containing a silicon oxide that covers at least a part of the core.
  • the second resin composition contains or does not contain composite particles having a core containing a fluororesin and a shell containing a silicon oxide that covers at least a part of the core.
  • the ratio of the composite particles in the second resin composition to the solid content of the second resin composition is the ratio of the first resin composition to the solid content of the first resin composition. Lower than the proportion of composite particles in.
  • the insulating layer 2 in the metal-clad laminate 1 is likely to have a low relative permittivity, and the peel strength of the metal layer 3 with respect to the insulating layer 2 is unlikely to decrease.
  • the operation of this embodiment will be described in more detail. According to the present embodiment, it is easy to reduce the dielectric constant of the insulating layer 2 by the composite particles contained in the first layer 21 or the composite particles contained in the first layer 21 and the second layer 22, respectively. Further, the second layer 22 in contact with the metal layer 3 has no interface between the composite particles and the matrix, or the interface is less than the interface between the composite particles and the matrix in the first layer 21. Therefore, even if stress is generated in the second layer 22 by applying a force to the metal layer 3, cleavage is unlikely to occur in the second layer 22. Further, since the composite particles in the first layer 21 are provided with a shell containing a silicon oxide as described above, the composite particles and the surrounding matrix are likely to have high adhesion in the first layer 21.
  • the matrix of the first layer 21 is a portion of the cured product of the first resin composition excluding composite particles
  • the matrix of the second layer 22 is the cured product of the second resin composition. It is the part of which excluding composite particles. Therefore, even if stress is generated in the first layer 21 by applying a force to the metal layer 3, cleavage is unlikely to occur in the interface between the composite particle and the matrix in the first layer 21.
  • the peel strength of the metal layer 3 with respect to the insulating layer 2 is preferably 5 N / cm or more.
  • the relative permittivity of the insulating layer 2 is preferably 3.15 or less. According to the present embodiment, the relative permittivity of the insulating layer 2 is lowered by the composite particles, and the peel strength is less likely to be lowered by the composite particles, thereby achieving both such a high peel strength and a low relative permittivity. Can be realized.
  • the method for measuring the peel strength and the relative permittivity will be described in detail in the column of Examples described later.
  • the peel strength is more preferably 5.0 N / cm or more, and further preferably 6.0 or more. Further, the relative permittivity is more preferably 3.10 or less, and further preferably 3.05 or less.
  • the coefficient of linear expansion of the insulating layer 2 is preferably 14.0 ppm / ° C. or less.
  • the metal-clad laminate 1 is less likely to warp, and the dimensional stability of the metal-clad laminate 1 is improved.
  • Such a coefficient of linear expansion can be realized, for example, by adjusting the amount of the inorganic filler in the insulating layer 2.
  • the coefficient of linear expansion of the insulating layer 2 is more preferably 13.0 ppm / ° C. or lower, and even more preferably 12.0 ppm / ° C. or lower.
  • the components of the first resin composition and the second resin composition will be described.
  • the first resin composition (hereinafter, also referred to as composition (X)) contains, for example, composite particles and a resin component.
  • the resin component preferably has a reaction curable property, and particularly preferably has a thermosetting property.
  • the resin component is not limited to the polymer, and the resin component may contain any of a monomer, an oligomer and a prepolymer.
  • the resin component contains at least one component selected from the group consisting of, for example, epoxy resin, phenol resin, bismaleimide resin, cyanate resin, and modified polyphenylene resin. Further, the resin component may contain a curing agent, a cross-linking agent and the like.
  • the resin component preferably contains a modified polyphenylene ether compound (A) having a group having an unsaturated double bond at the end and a cross-linking agent (B) having a carbon-carbon double bond. ..
  • A modified polyphenylene ether compound
  • B cross-linking agent
  • the modified polyphenylene ether compound (A) (hereinafter, also referred to as compound (A)) will be described.
  • the compound (A) can easily realize a low dielectric constant and a low dielectric loss tangent of the cured product of the composition (X).
  • Compound (A) is a polyphenylene ether terminal-modified with a group having an unsaturated double bond (carbon-carbon unsaturated double bond). That is, compound (A) has, for example, a polyphenylene ether chain and a group having an unsaturated double bond attached to the end of the polyphenylene ether chain.
  • Examples of the group having an unsaturated double bond include a substituent represented by the following formula (1).
  • n is a number from 0 to 10.
  • Z is an Airen group.
  • R 1 to R 3 are independently hydrogen atoms or alkyl groups.
  • Z is directly bonded to the end of the polyphenylene ether chain.
  • the arylene group is, for example, a monocyclic aromatic group such as a phenylene group, or a polycyclic aromatic group such as a naphthylene group. At least one hydrogen atom bonded to the aromatic ring in the arylene group may be substituted with a functional group such as an alkenyl group, an alkynyl group, a formyl group, an alkylcarbonyl group, an alkenylcarbonyl group, or an alkynylcarbonyl group.
  • the arylene group is not limited to the above.
  • the alkyl group for example, an alkyl group having 1 to 18 carbon atoms is preferable, and an alkyl group having 1 to 10 carbon atoms is more preferable.
  • the alkyl group is, for example, a methyl group, an ethyl group, a propyl group, a hexyl group, a decyl group or the like.
  • the alkyl group is not limited to the above.
  • the group having an unsaturated double bond has, for example, a vinylbenzyl group (ethenylbenzyl group) such as a p-ethenylbenzyl group and an m-ethenylbenzyl group, a vinylphenyl group, an acrylate group, a methacrylate group and the like.
  • the group having an unsaturated double bond preferably has a vinylbenzyl group, a vinylphenyl group, or a methacrylate group. If the group having an unsaturated double bond has an allyl group, the reactivity of compound (A) tends to be low. Further, if the group having an unsaturated double bond has an acrylate group, the reactivity of the compound (A) tends to be too high.
  • a preferable specific example of the group having an unsaturated double bond is a functional group containing a vinylbenzyl group.
  • the group having an unsaturated double bond is, for example, a substituent represented by the following formula (2).
  • R 1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms
  • R 2 is a single bond or an alkylene group having 1 to 10 carbon atoms.
  • R 2 is preferably an alkylene group having 1 to 10 carbon atoms.
  • the group having an unsaturated double bond may be a (meth) acrylate group.
  • the (meth) acrylate group is represented by, for example, the following formula (3).
  • R 4 is a hydrogen atom or an alkyl group.
  • the alkyl group is preferably an alkyl group having 1 to 18 carbon atoms, and more preferably an alkyl group having 1 to 10 carbon atoms.
  • the alkyl group is a methyl group, an ethyl group, a propyl group, a hexyl group, a decyl group or the like.
  • Alkyl groups are not limited to the above.
  • compound (A) has a polyphenylene ether chain in its molecule.
  • the polyphenylene ether chain has, for example, a repeating unit represented by the following formula (4).
  • n is a number from 1 to 50.
  • R 5 to R 8 are independently hydrogen atoms, alkyl groups, alkenyl groups, alkynyl groups, formyl groups, alkylcarbonyl groups, alkenylcarbonyl groups, or alkynylcarbonyl groups.
  • Each of R 5 to R 8 is preferably a hydrogen atom or an alkyl group.
  • the alkyl group for example, an alkyl group having 1 to 18 carbon atoms is preferable, and an alkyl group having 1 to 10 carbon atoms is more preferable.
  • the alkyl group is, for example, a methyl group, an ethyl group, a propyl group, a hexyl group, a decyl group or the like.
  • the alkenyl group for example, an alkenyl group having 2 to 18 carbon atoms is preferable, and an alkenyl group having 2 to 10 carbon atoms is more preferable.
  • the alkenyl group is, for example, a vinyl group, an allyl group, a 3-butenyl group, or the like.
  • alkynyl group for example, an alkynyl group having 2 to 18 carbon atoms is preferable, and an alkynyl group having 2 to 10 carbon atoms is more preferable.
  • the alkynyl group is, for example, an ethynyl group, a propa-2-in-1-yl group (propargyl group), or the like.
  • the alkylcarbonyl group may be a carbonyl group substituted with an alkyl group, for example, an alkylcarbonyl group having 2 to 18 carbon atoms is preferable, and an alkylcarbonyl group having 2 to 10 carbon atoms is more preferable.
  • the alkylcarbonyl group is, for example, an acetyl group, a propionyl group, a butyryl group, an isobutyryl group, a pivaloyl group, a hexanoyl group, an octanoyl group, a cyclohexylcarbonyl group and the like.
  • the alkenylcarbonyl group may be a carbonyl group substituted with an alkenyl group.
  • an alkenylcarbonyl group having 3 to 18 carbon atoms is preferable, and an alkenylcarbonyl group having 3 to 10 carbon atoms is more preferable.
  • the alkenylcarbonyl group is, for example, an acryloyl group, a methacryloyl group, a crotonoyl group, or the like.
  • the alkynylcarbonyl group may be a carbonyl group substituted with an alkynyl group, for example, an alkynylcarbonyl group having 3 to 18 carbon atoms is preferable, and an alkynylcarbonyl group having 3 to 10 carbon atoms is more preferable.
  • the alkynylcarbonyl group is, for example, a propioloyl group or the like.
  • the alkyl group, alkenyl group, alkynyl group, formyl group, alkylcarbonyl group, alkenylcarbonyl group and alkynylcarbonyl group are not limited to the above.
  • the number average molecular weight of compound (A) is preferably 1000 or more and 5000 or less, more preferably 1000 or more and 4000 or less, and further preferably 1000 or more and 3000 or less.
  • the number average molecular weight is a polystyrene-converted value of the measurement results obtained by gel permeation chromatography (GPC).
  • GPC gel permeation chromatography
  • n in the formula (4) has a number average molecular weight of the compound (A) within the above preferable range. It is preferable that the value is such that Specifically, n is preferably 1 or more and 50 or less.
  • the compound (A) When the quantity average molecular weight of the compound (A) is within such a range, the compound (A) imparts excellent dielectric properties to the cured product of the composition (X) by the polyphenylene ether chain, and further heat resistance of the cured product. The property and moldability can be improved.
  • the possible reasons for this are as follows.
  • the number average molecular weight of the unmodified polyphenylene ether is about 1000 or more and 5000 or less, the polyphenylene ether has a relatively low molecular weight and tends to reduce the heat resistance of the cured product.
  • compound (A) since compound (A) has an unsaturated double bond at the terminal, it is considered that the heat resistance of the cured product can be enhanced.
  • the number average molecular weight of the compound (A) is 5000 or less, it is considered that the moldability of the composition (X) is not easily impaired. Therefore, it is considered that the compound (A) can not only improve the heat resistance of the cured product but also improve the moldability of the composition (X).
  • the number average molecular weight of the compound (A) is 1000 or less, the glass transition temperature of the cured product is unlikely to decrease, and therefore the cured product tends to have good heat resistance. Further, since the polyphenylene ether chain in the compound (A) is unlikely to be shortened, the excellent dielectric properties of the cured product due to the polyphenylene ether chain can be easily maintained.
  • the compound (A) when the number average molecular weight is 5000 or less, the compound (A) is easily dissolved in a solvent, and the storage stability of the composition (X) is unlikely to decrease. Further, the compound (A) does not easily increase the viscosity of the composition (X), so that good moldability of the composition (X) can be easily obtained.
  • the compound (A) does not contain a high molecular weight component having a molecular weight of 13000 or more, or the content of the high molecular weight component having a molecular weight of 13000 or more in the compound (A) is 5% by mass or less. That is, the content of the high molecular weight component having a molecular weight of 13000 or more in the compound (A) is preferably 0% by mass or more and 5% by mass or less.
  • the cured product can have particularly excellent dielectric properties, and the composition (X) can have particularly excellent reactivity and storage stability, and further particularly excellent fluidity. It is more preferable that the content of the high molecular weight component is 3% by mass or less.
  • the content of the high molecular weight component can be calculated based on the measured molecular weight distribution by measuring the molecular weight distribution using, for example, gel permeation chromatography (GPC).
  • the average number of groups having unsaturated double bonds (number of terminal functional groups) per molecule of compound (A) is preferably 1 or more, more preferably 1.5 or more, and 1 7. 7 or more is more preferable, and 1.8 or more is particularly preferable. In these cases, it is easy to secure the heat resistance of the cured product of the composition (X).
  • the average number of groups having unsaturated double bonds is preferably 5 or less, more preferably 3 or less, further preferably 2.7 or less, and particularly preferably 2.5 or less. preferable. In these cases, it is possible to prevent the reactivity and viscosity of the compound (A) from becoming excessively high, so that the storage stability of the composition (X) is lowered and the fluidity of the composition (X) is lowered.
  • the number of terminal functional groups of compound (A) is the average value of substituents per molecule in 1 mol of compound (A).
  • the number of terminal functional groups for example, when the compound (A) is synthesized by modifying the polyphenylene ether, the number of hydroxyl groups in the compound (A) is measured, and the number of hydroxyl groups in the compound (A) is the polyphenylene before modification. It is obtained by calculating the amount of decrease from the number of hydroxyl groups of ether.
  • the decrease from the number of hydroxyl groups of the polyphenylene ether before this modification is the number of terminal functional groups.
  • the number of hydroxyl groups remaining in compound (A) is determined by measuring the UV absorbance of a mixed solution obtained by adding a quaternary ammonium salt (tetraethylammonium hydroxide) that associates with hydroxyl groups to the solution of compound (A). Can be sought.
  • the intrinsic viscosity of compound (A) is preferably 0.03 dl / g or more and 0.12 dl / g or less, more preferably 0.04 dl / g or more and 0.11 dl / g or less, and 0.06 dl / g. It is more preferably g or more and 0.095 dl / g or less. In this case, the dielectric constant and the dielectric loss tangent of the cured product of the composition (X) are more likely to be lowered. Further, by imparting sufficient fluidity to the composition (X), the moldability of the composition (X) can be improved.
  • the intrinsic viscosity is the intrinsic viscosity measured in methylene chloride at 25 ° C., and more specifically, it is prepared by dissolving compound (A) in methylene chloride at a concentration of 0.18 g / 45 ml. The viscosity of the solution at 25 ° C. This viscosity is measured with a viscometer such as AVS500 Visco System manufactured by Schott, for example.
  • compound (A) can be synthesized by reacting polyphenylene ether with a compound in which a group having an unsaturated double bond and a halogen atom are bonded. More specifically, the polyphenylene ether and the compound in which a group having an unsaturated double bond and a halogen atom are bonded are dissolved in a solvent and stirred. As a result, the polyphenylene ether reacts with the compound in which the group having an unsaturated double bond and the halogen atom are bonded, and the compound (A) is obtained.
  • the cross-linking agent (B) having a carbon-carbon double bond (hereinafter, also referred to as the cross-linking agent (B)) forms a cross-linked structure by reacting with the compound (A).
  • the cross-linking agent (B) is derived from, for example, divinylbenzene, polybutadiene, alkyl (meth) acrylate, tricyclodecanol (meth) acrylate, fluorene (meth) acrylate, isocyanurate (meth) acrylate, and trimethylolpropane (meth) acrylate. Contains at least one component selected from the group.
  • the cross-linking agent (B) preferably contains polybutadiene from the viewpoint of reducing the dielectric constant.
  • the percentage of the cross-linking agent (B) is preferably 5% by mass or more and 70% by mass or less, and 10% by mass or more and 60% by mass or less, based on the total amount of the compound (A) and the cross-linking agent (B). More preferably, it is more preferably 10% by mass or more and 50% by mass or less.
  • the moldability of the composition (X) can be particularly improved, and the heat resistance of the cured product can be particularly improved, while the cured product maintains the excellent dielectric properties of the compound (A).
  • the composition (X) may further contain the reaction initiator (H).
  • the reaction initiator (H) can contain an appropriate compound capable of accelerating the curing reaction between the compound (A) and the cross-linking agent (B).
  • the reaction initiator (H) is, for example, ⁇ , ⁇ '-bis (t-butylperoxy-m-isopropyl) benzene, 2,5-dimethyl-2,5-di (t-butylperoxy).
  • reaction initiator (H) can contain at least one compound selected from the group consisting of monocarbonates and oxidizing agents such as azobisisobutyronitrile.
  • the reaction initiator (H) may contain a carboxylic acid metal salt or the like in addition to the oxidizing agent. In this case, the curing reaction can be further promoted.
  • the components that can be contained in the reaction initiator (H) are not limited to the above.
  • the reaction initiator (H) preferably contains ⁇ , ⁇ '-bis (t-butylperoxy-m-isopropyl) benzene.
  • ⁇ , ⁇ '-bis (t-butylperoxy-m-isopropyl) benzene since the reaction start temperature of ⁇ , ⁇ '-bis (t-butylperoxy-m-isopropyl) benzene is relatively high, when the composition (X) is heated to be dried or semi-cured. The curing reaction can be prevented from proceeding excessively.
  • ⁇ , ⁇ '-bis (t-butylperoxy-m-isopropyl) benzene has low volatility, it is difficult to volatilize during storage and heating of the composition (X), and therefore, the composition (X) It does not easily impair the stability of.
  • the composition (X) contains composite particles.
  • the composite particle has a core containing a fluororesin and a shell containing a silicon oxide that covers at least a part of the core.
  • the core is preferably composed of only a fluororesin, but may further contain a component other than the fluororesin as long as the effects of the present embodiment are not impaired.
  • the shell is preferably composed of only a silicon compound, but may further contain components other than the silicon compound as long as the effects of the present embodiment are not impaired.
  • the composite particles make it easier for the insulating layer 2 to have a low relative permittivity.
  • the composite particles have a shell containing a silicon oxide, the affinity between the matrix phase of the first layer 21 and the composite particles tends to be high, and therefore the composite particles are composited even if stress is generated in the first layer 21. Cleavage is unlikely to occur at the interface between the particle and the matrix.
  • the fluororesin constituting the core contains, for example, polytetrafluoroethylene. In this case, it becomes particularly easy to realize a low relative permittivity of the insulating layer 2.
  • the shell is made of, for example, silicon oxide particles having a particle size smaller than that of the core.
  • the silicon oxide particles are attached to the fluororesin particles to prepare a shell. it can.
  • a composite particle having a core and a shell is obtained.
  • the method of producing the shell is not limited to the above.
  • Composite particles can be obtained by adhering the silicon oxide particles to the fluororesin particles or precipitating the silicon oxide particles on the fluororesin particles.
  • a method of spraying silicon oxide particles onto molten fluororesin particles to form composite particles with the fluororesin particles, or when the fluororesin particles are dispersed in a liquid and then precipitated, fluorine is used.
  • examples thereof include a method of obtaining composite particles by precipitating silicon oxide on the surface of resin particles.
  • the shell may be in a state in which silicon oxide particles are densely attached and supported around the core, or may form a layer in which silicon oxide is continuously connected around the core. Good.
  • the shell preferably has at least one functional group selected from the group consisting of hydroxyl groups, phenylamino groups and vinyl groups.
  • the adhesion between the composite particle and the matrix tends to increase, and therefore cleavage is less likely to occur at the interface between the composite particle and the matrix.
  • the shell has a hydroxyl group
  • the shell is made from, for example, untreated silicon oxide particles.
  • the shell can have a hydroxyl group derived from a hydroxyl group originally present on the surface of the silicon oxide particles.
  • the shell is, for example, phenylamino treated.
  • the shell comprises a silicon oxide treated with a compound having a phenylamino group (C 6 H 5 -NH-).
  • a compound having a phenylamino group for example, N-phenyl-3-aminopropyltrimethoxysilane (KBM-573: manufactured by Shin-Etsu Chemical Co., Ltd.) can be used.
  • KBM-573 manufactured by Shin-Etsu Chemical Co., Ltd.
  • Composite particles having a shell having a phenylamino group can be obtained.
  • the shell contains a silicon oxide treated with a compound having a vinyl group.
  • a compound having a vinyl group for example, vinyl trimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd .: KBM-1003) can be used.
  • the silicon oxide particles are treated with a compound having a vinyl group, and then the silicon oxide particles are attached to the surface of the fluorine resin particles. This makes it possible to obtain composite particles having a shell having a vinyl group.
  • the median diameter of the composite particles is preferably 0.2 ⁇ m or more and 15 ⁇ m or less.
  • the median diameter is 0.2 ⁇ m or more, the dispersibility of the composite particles in the composition (X) is good, whereby the composition (X) can have good storage stability and handleability.
  • the median diameter is 15 ⁇ m or less, the composite particles can be satisfactorily dispersed in the first layer 21. Therefore, it is possible to further reduce the relative permittivity of the insulating layer 2. It is more preferable that the median diameter is 0.5 ⁇ m or more and 5 ⁇ m or less.
  • the median diameter is a value calculated from the volume-based particle size distribution measured by the laser diffraction / scattering method.
  • the particle size of the composite particles can also be measured using a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM). Specifically, the composite particles are photographed using TEM or STEM, and the longest diameter of the core portion of the composite particles is measured from the obtained image. The arithmetic mean value of this measurement result can be regarded as the average particle size of the core. The average particle size can be determined from the measurement results for at least 30 cores. Furthermore, the longest diameter of the silicon oxide particles in the composite particles is measured. The arithmetic mean value of this measurement result can be regarded as the average particle size of the silicon oxide particles. The average particle size can be determined from the measurement results for at least 30 silicon oxide particles.
  • TEM transmission electron microscope
  • STEM scanning transmission electron microscope
  • the amount of composite particles with respect to 100 parts by mass of the total amount of compound (A) and compound (B) is preferably 10 parts by mass or more and 250 parts by mass or less. When this amount is 10 parts by mass or more, it is particularly easy to reduce the dielectric constant of the insulating layer 2. Further, when this amount is 250 parts by mass or less, the peel strength of the metal layer 3 with respect to the insulating layer 2 is particularly unlikely to decrease.
  • the amount of the composite particles is more preferably 20 parts by mass or more and 200 parts by mass or less, and further preferably 30 parts by mass or more and 100 parts by mass or less.
  • the composition (X) does not contain fluororesin particles having no shell (that is, particles similar to only the core in the composite particles). Even when the composition (X) contains fluororesin particles, the ratio of the fluororesin particles to 100 parts by mass of the total amount of the compound (A) and the compound (B) is preferably 20 parts by mass or less. In this case, cleavage is less likely to occur in the first layer 21, and therefore the peel strength of the metal layer 3 with respect to the insulating layer 2 is less likely to decrease.
  • the composition (X) may contain an inorganic filler (F).
  • the inorganic filler (F) can enhance the heat resistance and flame retardancy of the first layer 21, and can reduce the coefficient of linear expansion of the insulating layer 2.
  • the inorganic filler (F) contains at least one component selected from the group consisting of, for example, silica, alumina, talc, aluminum hydroxide, magnesium hydroxide, titanium oxide, mica, aluminum borate, barium sulfate, calcium carbonate and the like. Can be contained.
  • the inorganic filler (F) may be surface-treated with a silane coupling agent.
  • the silane coupling agent can increase the heat resistance of the insulating layer 2 at the time of moisture absorption when the insulating layer 2 in the laminated plate is prepared from the composition (X), and the peel strength of the metal foil overlapping the insulating layer 2 with respect to the insulating layer 2. Can be raised.
  • the silane coupling agent contains at least one component selected from the group consisting of, for example, vinylsilane, styrylsilane, methacrylsilane, and acrylicsilane.
  • the percentage of the inorganic filler (F) with respect to the total solid content of the composition (X) is, for example, 5% by mass or more and 56% by mass or less.
  • the composition (X) may contain a solvent (D). It is preferable that the solvent (D) can satisfactorily dissolve or disperse the resin component and does not inhibit the reaction of the resin component.
  • the solvent (D) preferably contains at least one component selected from the group consisting of an aliphatic hydrocarbon solvent, an aromatic hydrocarbon solvent and a ketone solvent, and particularly preferably contains toluene.
  • the components that can be contained in the solvent (D) are not limited to the above. Since the composition (X) contains a solvent, the base material can be easily impregnated with the composition (X) when a prepreg is produced from the composition (X).
  • the amount of the solvent in the composition (X) is preferably 100% by mass or more and 500% by mass or less with respect to the total solid content. In such a case, the composition (X) is likely to be homogenized, and the composition (X) is likely to be impregnated into the fibrous substrate.
  • the composition (X) may contain a silane coupling agent (G).
  • the silane coupling agent (G) in this case is a component not used for the surface treatment of the inorganic filler (F).
  • the silane coupling agent (G) can increase the heat resistance of the insulating layer 2 at the time of moisture absorption when the insulating layer 2 in the metal-clad laminate 1 is prepared from the composition (X), and the insulating layer 2 can be used.
  • the peel strength of the metal layer 3 can be further increased.
  • the silane coupling agent (G) contains at least one component selected from the group consisting of, for example, vinylsilane, styrylsilane, methacrylsilane, and acrylicsilane.
  • the percentage of the silane coupling agent (G) to the resin component is preferably 0.3% by mass or more and 5% by mass or less. When such a silane coupling agent (G) is used, the peel strength of the metal layer 3 with respect to the insulating layer 2 can be further increased.
  • the composition (X) may contain additives other than the above components.
  • Additives include, for example, polymerization inhibitors, flame retardants, defoamers such as silicone-based defoamers and acrylic acid ester-based defoamers, heat stabilizers, antistatic agents, ultraviolet absorbers, dyes and pigments, lubricants, etc.
  • it contains at least one component selected from the group consisting of dispersants such as wet dispersants.
  • dispersants such as wet dispersants.
  • the components that the additive can contain are not limited to the above.
  • the composition (X) is prepared, for example, as follows. First, a component that can be dissolved in an organic solvent, such as compound (A) and a cross-linking agent (B), is mixed with the organic solvent to prepare a mixture. At this time, heating may be performed if necessary. Then, if necessary, a component that does not dissolve in the organic solvent used, for example, an inorganic filler, is added to the mixture and dispersed using a ball mill, a bead mill, a planetary mixer, a roll mill, or the like to form a varnish-like composition. (X) is prepared.
  • a prepreg can be prepared from the composition (X).
  • the prepreg comprises a base material and a dried or semi-cured product of the composition (X) impregnated in the base material.
  • the prepreg is produced, for example, by impregnating a base material with the composition (X) and then heating the composition (X).
  • the base material is, for example, a fibrous base material.
  • the fibrous substrate is selected from the group consisting of, for example, a glass fiber substrate (glass cloth or glass non-woven fabric), aramid cloth, polyester cloth, aramid non-woven fabric, polyester non-woven fabric, pulp paper, linter paper and the like.
  • a glass fiber substrate glass cloth or glass non-woven fabric
  • aramid cloth polyester cloth
  • aramid non-woven fabric polyester non-woven fabric
  • polyester non-woven fabric pulp paper
  • pulp paper linter paper and the like.
  • the glass cloth is preferably flattened.
  • the thickness of the fibrous base material is, for example, 0.04 mm or more and 0.3 mm or less.
  • the base material can be impregnated with the composition (X) by immersing the base material in the composition (X) or applying the composition (X) to the base material. If necessary, the base material may be immersed in the composition (X) multiple times, or the base material may be coated with the composition (X) multiple times.
  • the composition (X) impregnated in the base material is heated to dry or semi-cure the composition (X).
  • the heating conditions are, for example, a heating temperature of 80 ° C. or higher and 180 ° C. or lower, and a heating time of 1 minute or longer and 10 minutes or shorter, but the heating conditions are not limited to this.
  • a prepreg containing a base material and a dried or semi-cured product of the composition (X) impregnated in the base material can be obtained.
  • the second resin composition (hereinafter, also referred to as composition (Y)) contains composite particles or does not contain composite particles.
  • the ratio of the composite particles in the composition (Y) to the solid content of the composition (Y) is in the composition (X) with respect to the solid content of the composition (X). Is lower than the proportion of composite particles in.
  • the solid content of the composition (X) is a component excluding the solvent in the composition (X)
  • the solid content of the composition (Y) is a component excluding the solvent in the composition (Y). That is.
  • composition of the components of the composition (Y) excluding the composite particles may be the same as in the case of the above composition (X).
  • composition of the components of the composition (X) and the composition (Y) used at the same time, excluding the composite particles, may be the same or different.
  • the composition (Y) does not contain composite particles.
  • the ratio of the composite particles to the solid content in the composition (Y) is preferably 5% by mass or less.
  • the ratio of the composite particles to the solid content in the composition (Y) is preferably 9% by mass or less with respect to the composite particles in the composition (X).
  • the composition (Y) does not contain fluororesin particles having no shell (that is, particles similar to only the core in the composite particles). Even when the composition (X) contains fluororesin particles, the ratio of the fluororesin particles to the solid content in the composition (Y) is preferably 5% by mass or less. In this case, cleavage is less likely to occur in the second layer 22, and therefore the peel strength of the metal layer 3 with respect to the insulating layer 2 is less likely to decrease. It is more preferable that this ratio is 4% by mass or less.
  • a resin sheet can be produced from the composition (Y).
  • the composition (Y) is applied onto an appropriate carrier film made of, for example, a resin film, and then the composition (Y) is heated to dry or semi-cure the composition (Y).
  • the heating conditions are, for example, a heating temperature of 80 ° C. or higher and 180 ° C. or lower, and a heating time of 1 minute or longer and 10 minutes or shorter, but the heating conditions are not limited to this.
  • a resin sheet made of a dried product or a semi-cured product of the composition (Y) is produced on the carrier film.
  • the composition (Y) may be dried or semi-cured by applying the composition (Y) on a metal foil such as a copper foil and then heating the composition (Y).
  • a resin sheet made of a dried product or a semi-cured product of the composition (Y) is produced on the metal foil. Further, as a result, a resin sheet with a metal foil including the metal foil and the resin sheet overlapping the metal foil is produced.
  • the prepreg may be prepared from the composition (Y) in the same manner as in the case of producing the prepreg from the composition (X) described above.
  • the metal-clad laminate 1 includes an insulating layer 2 and a metal layer 3 overlapping the insulating layer 2, and the insulating layer 2 is between the first layer 21 and the first layer 21 and the metal layer 3.
  • a second layer 22 is provided. That is, the metal layer 3, the second layer 22, and the first layer 21 are laminated in this order.
  • the first layer 21 contains a cured product of the composition (X), and the second layer 22 contains a cured product of the composition (Y).
  • the metal-clad laminate 1 may be a double-sided metal-clad laminate as shown in FIG.
  • the insulating layer 2 includes, for example, a first layer 21 and two second layers 22, and the first layer 21 is interposed between the two second layers 22.
  • the metal-clad laminate 1 includes two metal layers 3, and the two metal layers 3 are overlapped with two second layers 22, respectively. That is, the metal layer 3, the second layer 22, the first layer 21, the second layer 22, and the metal layer 3 are laminated in this order.
  • the first layer 21 may contain a fiber base material.
  • the first layer 21 preferably contains a glass fiber base material. In this case, it is easy to increase the strength of the insulating layer 2.
  • the glass fiber base material is, for example, at least one of a glass cloth and a glass non-woven fabric.
  • the second layer 22 preferably does not contain a glass fiber base material. In this case, there is no interface between the glass fiber base material and the cured product of the composition (Y) in the second layer 22, and cleavage does not occur at this interface. Therefore, the peel strength of the metal layer 3 with respect to the insulating layer 2 is less likely to decrease. It is preferable that the second layer 22 does not contain a fiber base material other than the glass fiber base material.
  • the thickness of the second layer 22 is preferably 1 ⁇ m or more and 25 ⁇ m or less.
  • the peel strength of the metal layer 3 with respect to the insulating layer 2 is less likely to decrease.
  • the thickness of the second layer 22 is 25 ⁇ m or less, it is particularly easy to reduce the dielectric constant of the insulating layer 2 by the first layer 21.
  • This thickness is more preferably 3 ⁇ m or more and 23 ⁇ m or less, and further preferably 5 ⁇ m or more and 20 ⁇ m or less.
  • the thickness of the insulating layer 2 is preferably 15 ⁇ m or more and 250 or less. In this case, the thickness of the insulating layer 2 is less likely to vary. This thickness is more preferably 25 ⁇ m or more and 230 ⁇ m or less, and further preferably 35 ⁇ m or more and 220 ⁇ m or less.
  • the thickness of the first layer 21 is preferably thicker than the thickness of the second layer 22. In this case, it is particularly easy to reduce the dielectric constant of the insulating layer 2 by the first layer 21.
  • the thickness of the first layer 21 is preferably 10 ⁇ m or more and 240 ⁇ m or less. When the thickness of the first layer 21 is 10 ⁇ m or more, it is particularly easy to reduce the dielectric constant of the insulating layer 2 by the first layer 21. Further, when the thickness of the first layer 21 is 240 ⁇ m or less, the thickness of the first layer 21 is less likely to vary.
  • the thickness of the first layer 21 is more preferably 20 ⁇ m or more and 230 ⁇ m or less, and further preferably 30 ⁇ m or more and 210 ⁇ m or less.
  • the metal-clad laminate 1 is a double-sided metal-clad laminate
  • the second layer 22 is interposed between one of the two metal layers 3 and the first layer 21.
  • the other metal layer 3 may be in direct contact with the first layer 21. That is, the metal layer 3, the second layer 22, the first layer 21, and the metal layer 3 may be laminated in this order.
  • the metal-clad laminate 1 shown in FIG. 1 is manufactured by, for example, the following method.
  • a laminate is obtained by laminating a metal foil, one or more resin sheets, one or more prepregs, one or more resin sheets, and a metal foil in this order.
  • This laminate is heat pressed.
  • the maximum heating temperature during the heating press is, for example, 160 ° C. or higher and 230 ° C. or lower.
  • the press pressure during the hot press is, for example, 0.5 MPa or more and 6 MPa or less.
  • the heating time during the heating press is, for example, 30 minutes or more and 240 minutes or less.
  • the first layer 21 is produced by curing the prepreg
  • the second layer 22 is produced by curing the resin sheet.
  • the metal foil adheres to the second layer 22, so that the metal layer 3 made of the metal foil is produced.
  • the metal-clad laminate 1 shown in FIG. 1 is manufactured.
  • the metal-clad laminate 1 may be manufactured by the following method.
  • Two resin sheets with metal leaf are arranged so that the resin sheets face each other, and one or more prepregs are arranged between the resin sheets with metal leaf, and these are laminated to obtain a laminate. ..
  • This laminate is heat pressed.
  • the maximum heating temperature during the heating press is, for example, 160 ° C. or higher and 230 ° C. or lower.
  • the press pressure during the hot press is, for example, 0.5 MPa or more and 6 MPa or less.
  • the heating time during the heating press is, for example, 30 minutes or more and 240 minutes or less.
  • the first layer 21 is produced by curing the prepreg
  • the second layer 22 is produced by curing the resin sheet in the resin sheet with metal foil.
  • the metal layer 3 is produced from the metal foil in the resin sheet with the metal foil.
  • the metal-clad laminate 1 shown in FIG. 1 is manufactured.
  • the conditions for heat-pressing the laminate are not limited to the above, and are appropriately set so that the first layer 21 and the second layer 22 are produced from the prepreg and the resin sheet, respectively.
  • the method for producing the metal-clad laminate 1 can produce an insulating layer 2 including a first layer 21 containing a cured product of the composition (X) and a second layer 22 containing a cured product of the composition (Y). If, the method is not limited to the above method.
  • the printed wiring board 5 as shown in FIG. 2 can be manufactured by producing the conductor wiring 4 from the metal layer 3 in the metal-clad laminate 1 by a photolithography method or the like.
  • the printed wiring board 5 includes an insulating layer 2 and a conductor wiring 4 overlapping the insulating layer 2, and the insulating layer 2 is between the first layer 21 and the first layer 21 and the conductor wiring 4. It has an intervening second layer 22.
  • the first layer 21 contains a fiber base material, but the fiber base material may not be contained.
  • the first layer 21 is made of a resin sheet made of a dried product or a semi-cured product of the composition (X).
  • the second layer 22 does not contain the fiber base material, but may not contain the fiber base material.
  • the second layer 22 is made of a prepreg comprising a fiber substrate and a dried or semi-cured product of the composition (Y) impregnated therein.
  • a polyphenylene ether (a polyphenylene ether having a structure represented by the following formula (5), SABIC) is placed in a three-necked flask having a capacity of 1 liter equipped with a temperature controller, a stirrer, a cooling facility, and a dropping funnel.
  • reaction solution was stirred until polyphenylene ether, chloromethylstyrene, and tetra-n-butylammonium bromide were dissolved in toluene. At that time, the reaction solution was gradually heated until the solution temperature finally reached 75 ° C. Then, an aqueous sodium hydroxide solution (20 g of sodium hydroxide / 20 g of water) was added dropwise to the reaction solution as an alkali metal hydroxide over 20 minutes. Then, the reaction solution was further stirred at 75 ° C. for 4 hours. Next, after neutralizing the reaction solution with an aqueous hydrochloric acid solution having a concentration of 10% by mass, a large amount of methanol was added.
  • the obtained solid was analyzed by 1H-NMR (400 MHz, CDCl 3 , TMS). As a result, a peak derived from ethenylbenzyl was confirmed at 5 to 7 ppm. As a result, it was confirmed that the obtained solid was a modified polyphenylene ether having a group represented by the formula (1) at the molecular terminal. Specifically, it was confirmed that the polyphenylene ether was ethenylbenzylated.
  • the modified polyphenylene ether was accurately weighed.
  • the weight of the modified polyphenylene ether at that time is defined as X (mg).
  • TEAH tetraethylammonium hydroxide
  • ⁇ indicates the extinction coefficient, which is 4700 L / mol ⁇ cm in this test.
  • the OPL is the cell optical path length, which is 1 cm in this test.
  • the intrinsic viscosity (IV) of the methylene chloride solution of the modified polyphenylene ether was measured at 25 ° C. Specifically, a 0.18 g / 45 ml methylene chloride solution (liquid temperature 25 ° C.) of modified polyphenylene ether was measured with a viscometer (AVS500 Visco System manufactured by Schott). As a result, the intrinsic viscosity (IV) was 0.086 dl / g.
  • the molecular weight distribution of the modified polyphenylene ether was measured using GPC (gel permeation chromatography). From the obtained molecular weight distribution, the weight average molecular weight (Mw) and the content of high molecular weight components having a molecular weight of 13000 or more were calculated. Further, the content of the high molecular weight component was specifically calculated from the ratio of the peak area based on the curve showing the molecular weight distribution obtained by GPC. As a result, Mw was 2300. The content of the high molecular weight component was 0.1% by mass.
  • -Crosslinking agent 1 Polybutadiene oligomer, manufactured by Nippon Soda Co., Ltd., product number B-1000.
  • -Crosslinking agent 2 Tricyclodecanedimethanol diacrylate, manufactured by Shin Nakamura Chemical Industry Co., Ltd., product name light acrylate A-DCP.
  • -Flame Retardant 1 Phosphate compound (aluminum trisdiethylphosphinate), manufactured by Clariant Chemicals, product name Exolit OP935.
  • -Flame retardant 2 Phosphate ester compound (aromatic condensed phosphoric acid ester compound), manufactured by Daihachi Chemical Industry Co., Ltd., product number PX-200.
  • -Inorganic filler spherical silica, median diameter 3 ⁇ m, manufactured by Admatex, product number SC2300-SVJ.
  • -Silane coupling agent 3-methacryloxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., product number KBM-503.
  • -Fluorine resin particles manufactured by Daikin Industries, Ltd., product name Lubron TML-2, particle size 3.5 ⁇ m.
  • -Composite particle 1 Composite particle having a core made of polytetrafluoroethylene and a shell made of silica particles treated with phenylamino, having a median diameter of 3.0 ⁇ m.
  • Composite particle 2 A composite particle having a core made of polytetrafluoroethylene and a shell made of silica particles treated with phenylamino, having a median diameter of 1.0 ⁇ m.
  • Composite particles 3 Composite particles having a core made of polytetrafluoroethylene and a shell made of silica particles treated with phenylamino, having a median diameter of 15.0 ⁇ m.
  • prepreg The components shown in the column of composition of the first resin composition in Tables 1 to 3 were mixed to prepare the first resin composition.
  • a prepreg was prepared by impregnating the fiber base material (glass cloth) shown in the column of the fiber base material in Tables 1 to 3 with this first resin composition and heating at 150 ° C. for 1 minute.
  • Example 1 and Comparative Example 4 the components shown in the composition column of the second resin composition in Tables 1 to 3 were mixed to prepare a second resin composition.
  • This second resin composition was applied onto a carrier film and then heated at 150 ° C. for 3 minutes to prepare a resin sheet having a thickness of 15 ⁇ m.
  • Example 1 and Comparative Example 4 copper foil (thickness 18 ⁇ m), resin sheet, the number of prepregs shown in the prepreg number columns of Tables 1 to 3, resin sheet and copper foil (thickness). 18 ⁇ m) was laminated in this order to prepare a laminate, and the laminate was heated and pressed under the conditions of a heating temperature of 250 ° C., a press pressure of 4 mPa, and a heating time of 5 minutes to prepare a metal-clad laminate 1. ..
  • the thickness of the first layer 21, the thickness of the second layer 22, and the thickness of the metal layer 3 in each metal-clad laminate 1 are as shown in Tables 1 to 3.
  • Evaluation test 5.1 Glass transition temperature An unclad plate consisting of only the insulating layer 2 is produced by removing the metal foil from the metal-clad laminate 1 by etching treatment, and dynamic viscoelasticity measurement (DMA) is performed on this unclad plate. It was. The temperature at which the tan ⁇ (loss elastic modulus / storage elastic modulus) thus obtained became the maximum value was defined as the glass transition temperature.
  • DMA dynamic viscoelasticity measurement
  • a dynamic viscoelasticity measuring device a viscoelasticity spectrometer manufactured by Hitachi High-Tech Science Corporation, model number DMA7100 was used, and the measurement was performed with a tension module under a temperature rising condition of 5 ° C./min.
  • peel strength The peel strength of the metal layer 3 (metal foil) with respect to the insulating layer 2 of the metal-clad laminate 1 was measured in accordance with JIS C 6481. In the measurement, the metal foil formed to have a width of 5 mm and a length of 100 mm was peeled off from the insulating layer 2 at a speed of 50 mm / min by a tensile tester, and the peel strength at that time was measured.
  • the insulating layer 2 has a first layer 21 and a second layer 22, the first layer 21 contains composite particles, and the second layer 22 contains composite particles.
  • the first layer 21 contains composite particles
  • the second layer 22 contains composite particles.
  • Example 4 it was confirmed that the glass transition temperature, the relative permittivity, and the peel strength changed by changing the cross-linking agent from that in Example 1.
  • Example 5 it was found that by adding the composite particles to the second layer, the peel strength was lowered as compared with Example 1.
  • Example 1 the relative permittivity changes according to the change in the resin content of the insulating layer due to the change in the fiber base material, the change in the thickness of the first layer and the second layer, and the like. ..
  • the resin content was 73% by mass
  • the relative permittivity was about 65%, which was higher than in Example 1, and in Example 10, the resin content was further lowered. As a result, the relative permittivity is even higher.
  • Comparative Examples 1 and 2 since the insulating layer 2 did not contain composite particles and did not contain fluororesin particles, the peel strength was high, but the relative permittivity was high. In Comparative Example 3, since the insulating layer 2 contained fluororesin particles and did not have the second layer 22, the peel strength was low although the relative permittivity was low. In Comparative Example 4, the insulating layer 2 contains composite particles, but does not have the second layer 22, so that the relative permittivity is low but the peel strength is low. In Comparative Example 5, although the insulating layer 2 has the second layer 22, since the first layer 21 contains fluororesin particles without containing composite particles, the relative permittivity is low, but the peel strength is low.
  • Comparative Example 3 the evaluation of the appearance after etching was poor. This is because the insulating layer 2 in Comparative Example 3 is composed of only a layer containing fluororesin particles without containing composite particles, so that the ferric chloride aqueous solution is easily repelled during the etching treatment, and therefore the efficiency of the etching treatment is lowered. It is presumed that this is because it was done.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
PCT/JP2020/024182 2019-06-26 2020-06-19 金属張積層板及びプリント配線板 Ceased WO2020262245A1 (ja)

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