JPWO2019217014A5 - - Google Patents

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JPWO2019217014A5
JPWO2019217014A5 JP2020562644A JP2020562644A JPWO2019217014A5 JP WO2019217014 A5 JPWO2019217014 A5 JP WO2019217014A5 JP 2020562644 A JP2020562644 A JP 2020562644A JP 2020562644 A JP2020562644 A JP 2020562644A JP WO2019217014 A5 JPWO2019217014 A5 JP WO2019217014A5
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layer
pinning
thickness
cobalt
double layers
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JP2020562644A
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JP7507693B2 (ja
JP2021523569A (ja
JP2021523569A5 (https=
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JP2020562644A 2018-05-08 2019-04-05 磁気トンネル接合構造及びその製造方法 Active JP7507693B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024097845A JP2024150436A (ja) 2018-05-08 2024-06-18 磁気トンネル接合構造及びその製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862668559P 2018-05-08 2018-05-08
US62/668,559 2018-05-08
US16/351,850 US10944050B2 (en) 2018-05-08 2019-03-13 Magnetic tunnel junction structures and methods of manufacture thereof
US16/351,850 2019-03-13
PCT/US2019/026079 WO2019217014A1 (en) 2018-05-08 2019-04-05 Magnetic tunnel junction structures and methods of manufacture thereof

Related Child Applications (1)

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JP2024097845A Division JP2024150436A (ja) 2018-05-08 2024-06-18 磁気トンネル接合構造及びその製造方法

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JP2021523569A JP2021523569A (ja) 2021-09-02
JPWO2019217014A5 true JPWO2019217014A5 (https=) 2022-04-08
JP2021523569A5 JP2021523569A5 (https=) 2022-04-08
JP7507693B2 JP7507693B2 (ja) 2024-06-28

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JP2020562644A Active JP7507693B2 (ja) 2018-05-08 2019-04-05 磁気トンネル接合構造及びその製造方法
JP2024097845A Pending JP2024150436A (ja) 2018-05-08 2024-06-18 磁気トンネル接合構造及びその製造方法

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US (2) US10944050B2 (https=)
JP (2) JP7507693B2 (https=)
KR (2) KR20250090373A (https=)
CN (1) CN112166509B (https=)
TW (2) TWI821274B (https=)
WO (1) WO2019217014A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019021751A (ja) 2017-07-14 2019-02-07 Tdk株式会社 磁気抵抗効果素子及びその製造方法
US10957849B2 (en) 2018-05-24 2021-03-23 Applied Materials, Inc. Magnetic tunnel junctions with coupling-pinning layer lattice matching
US10910557B2 (en) 2018-09-14 2021-02-02 Applied Materials, Inc. Apparatus and methods of fabricating a magneto-resistive random access memory (MRAM) device
CN113346006B (zh) * 2020-03-02 2023-03-21 上海磁宇信息科技有限公司 磁性隧道结结构及其磁性随机存储器
US20230039108A1 (en) * 2021-08-03 2023-02-09 Yimin Guo Perpendicular mtj element having a soft-magnetic adjacent layer and methods of making the same
US12022743B2 (en) * 2021-08-06 2024-06-25 Taiwan Semiconductor Manufacturing Company Ltd. Magnetic tunnel junction (MTJ) element and its fabrication process
US12382839B2 (en) 2022-01-07 2025-08-05 Samsung Electronics Co., Ltd. Magnetic tunneling junction device and memory device including the same

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773515B2 (en) * 2002-01-16 2004-08-10 Headway Technologies, Inc. FeTa nano-oxide layer as a capping layer for enhancement of giant magnetoresistance in bottom spin valve structures
JP2005079487A (ja) * 2003-09-03 2005-03-24 Fujitsu Ltd 磁気抵抗効果膜並びにこれを用いた磁気抵抗効果ヘッドおよび固体メモリ
US6960480B1 (en) 2004-05-19 2005-11-01 Headway Technologies, Inc. Method of forming a magnetic tunneling junction (MTJ) MRAM device and a tunneling magnetoresistive (TMR) read head
US7611912B2 (en) 2004-06-30 2009-11-03 Headway Technologies, Inc. Underlayer for high performance magnetic tunneling junction MRAM
US7067330B2 (en) 2004-07-16 2006-06-27 Headway Technologies, Inc. Magnetic random access memory array with thin conduction electrical read and write lines
US7098495B2 (en) * 2004-07-26 2006-08-29 Freescale Semiconducor, Inc. Magnetic tunnel junction element structures and methods for fabricating the same
JP4444241B2 (ja) * 2005-10-19 2010-03-31 株式会社東芝 磁気抵抗効果素子、磁気ランダムアクセスメモリ、電子カード及び電子装置
US8063459B2 (en) 2007-02-12 2011-11-22 Avalanche Technologies, Inc. Non-volatile magnetic memory element with graded layer
US7528457B2 (en) * 2006-04-14 2009-05-05 Magic Technologies, Inc. Method to form a nonmagnetic cap for the NiFe(free) MTJ stack to enhance dR/R
US8372661B2 (en) * 2007-10-31 2013-02-12 Magic Technologies, Inc. High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same
US8164862B2 (en) 2008-04-02 2012-04-24 Headway Technologies, Inc. Seed layer for TMR or CPP-GMR sensor
US7808027B2 (en) * 2009-01-14 2010-10-05 Magic Technologies, Inc. Free layer/capping layer for high performance MRAM MTJ
US8609262B2 (en) 2009-07-17 2013-12-17 Magic Technologies, Inc. Structure and method to fabricate high performance MTJ devices for spin-transfer torque (STT)-RAM application
US8922956B2 (en) * 2010-06-04 2014-12-30 Seagate Technology Llc Tunneling magneto-resistive sensors with buffer layers
US8604572B2 (en) * 2010-06-14 2013-12-10 Regents Of The University Of Minnesota Magnetic tunnel junction device
US9245608B2 (en) * 2011-09-22 2016-01-26 Qualcomm Incorporated Thermally tolerant perpendicular magnetic anisotropy coupled elements for spin-transfer torque switching device
JP5856490B2 (ja) * 2012-01-20 2016-02-09 ルネサスエレクトロニクス株式会社 磁気抵抗効果素子及び磁気メモリ
KR20140008745A (ko) * 2012-07-11 2014-01-22 삼성전자주식회사 자기 메모리 장치
US9490054B2 (en) 2012-10-11 2016-11-08 Headway Technologies, Inc. Seed layer for multilayer magnetic materials
KR102114285B1 (ko) 2013-04-09 2020-05-22 에스케이하이닉스 주식회사 반도체 장치 및 이 반도체 장치를 포함하는 마이크로프로세서, 프로세서, 시스템, 데이터 저장 시스템 및 메모리 시스템
US9082960B2 (en) * 2013-04-16 2015-07-14 Headway Technologies, Inc. Fully compensated synthetic antiferromagnet for spintronics applications
JP6251130B2 (ja) * 2013-06-17 2017-12-20 アイメックImec 磁気メモリ素子
KR102082328B1 (ko) * 2013-07-03 2020-02-27 삼성전자주식회사 수직 자기터널접합을 구비하는 자기 기억 소자
WO2015062174A1 (zh) * 2013-11-01 2015-05-07 中国科学院物理研究所 一种用于温度传感器的纳米磁性多层膜及其制造方法
KR102124361B1 (ko) 2013-11-18 2020-06-19 삼성전자주식회사 수직 자기터널접합을 포함하는 자기 기억 소자
US10050083B2 (en) * 2014-05-21 2018-08-14 Avalanche Technology, Inc. Magnetic structure with multilayered seed
JP2015038998A (ja) * 2014-09-12 2015-02-26 株式会社東芝 磁気記録素子及び磁気メモリ
KR102287755B1 (ko) * 2014-11-18 2021-08-09 삼성전자주식회사 자기 저항 메모리 소자를 형성하는 방법
US9236560B1 (en) * 2014-12-08 2016-01-12 Western Digital (Fremont), Llc Spin transfer torque tunneling magnetoresistive device having a laminated free layer with perpendicular magnetic anisotropy
US9634237B2 (en) 2014-12-23 2017-04-25 Qualcomm Incorporated Ultrathin perpendicular pinned layer structure for magnetic tunneling junction devices
WO2016148394A1 (ko) 2015-03-18 2016-09-22 한양대학교 산학협력단 메모리 소자
KR101800237B1 (ko) * 2015-05-22 2017-11-22 캐논 아네르바 가부시키가이샤 자기저항 효과 소자
US10522739B2 (en) 2015-06-26 2019-12-31 Intel Corporation Perpendicular magnetic memory with reduced switching current
WO2017135767A1 (ko) 2016-02-05 2017-08-10 한양대학교 산학협력단 메모리 소자
JP2018032805A (ja) * 2016-08-26 2018-03-01 ソニー株式会社 磁気抵抗素子及び電子デバイス

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